Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of complianc

Ultrafast Recovery Diode

FEATURES · Power pack · Glass passivated pellet chip junction · Ultrafast recovery time · Low switching losses, high efficiency · Low forward voltage drop · High forward surge capability APPLICATIONS · Switching Mode Power Supplies · DC/DC conveters

Ultrafast Rectifier

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封装/外壳：TO-220-2 包装：卷带（TR） 描述：DIODE GEN PURP 200V 8A TO220AC 分立半导体产品 二极管 - 整流器 - 单

HIGH EFFICIENCY FAST RECOVERY RECTIFIER DIODES

DESCRIPTION Single chip rectifier suited for switchmode power supply and high frequency DC to DC converters. Packaged in TO-220AC or ISOWATT220AC this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. FEATURES ■ SUITED FOR S

FAST EFFICIENT PLASTIC RECTIFIER

Reverse Voltage - 50 to 200 Volts Forward Current - 8.0 Amperes FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Glass passivated chip junction ♦ Low power loss ♦ Low leakage current ♦ High surge current capability ♦ Superfast recovery time for

SWITCHMODE TM Power Rectifiers

This state−of−the−art device is designed for use in switching power supplies, inverters and as free wheeling diodes. Features • 175°C Operating Junction Temperature • Popular TO−220 Package • Epoxy Meets UL 94 V−0 @ 0.125 in • Low Forward Voltage • Low Leakage Current • High Temperature Gla

Rectifier diodes ultrafast

GENERAL DESCRIPTION Glass passivated high efficiency rectifier diodes in a plastic envelope, featuring low forward voltage drop, ultra-fast recovery times and soft recovery characteristic. They are intended for use in switched mode power supplies and high frequency circuits in general where low c

Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of    245 °C (for TO-263AB package) • Solder dip 2