Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of complianc

Ultrafast Recovery Diode

FEATURES · Power pack · Glass passivated pellet chip junction · Ultrafast recovery time · Low switching losses, high efficiency · Low forward voltage drop · High forward surge capability APPLICATIONS · Switching Mode Power Supplies · DC/DC conveters

Ultrafast Rectifier

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封装/外壳：TO-220-2 包装：散装 描述：DIODE GEN PURP 150V TO220AC 分立半导体产品 二极管 - 整流器 - 单

Super Fast Rectifiers

Features ◇ Low cost ◇ Glass passivated junction chips ◇ Low leakage ◇ Low forward voltage drop ◇ High current capability ◇ Easily cleaned with alcohol,Isopropanol and similar solvents

Rectifier diodes ultrafast

GENERAL DESCRIPTION Glass passivated high efficiency rectifier diodes in a plastic envelope, featuring low forward voltage drop, ultra-fast recovery times and soft recovery characteristic. They are intended for use in switched mode power supplies and high frequency circuits in general where low c

FAST EFFICIENT PLASTIC RECTIFIER

Reverse Voltage - 50 to 200 Volts Forward Current - 8.0 Amperes FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Glass passivated chip junction ♦ Low power loss ♦ Low leakage current ♦ High surge current capability ♦ Superfast recovery time for

RECTIFIERS

description The UES1400/BYW29/BYW80 Series, in a plastic package similar to the TO-220, is sepecifically designed for operation in power switching circuit to frequencies in excess of 100KHz. The very low forward voltage and very fast recovery time make them particularly suited for switching type

Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of    245 °C (for TO-263AB package) • Solder dip 2