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BU100晶体管资料
BU100别名：BU100三极管、BU100晶体管、BU100晶体三极管
BU100生产厂家：德国电子元件股份公司
BU100制作材料：Si-NPN
BU100性质：电视 （TV）_行输出 （HA）
BU100封装形式：直插封装
BU100极限工作电压：150V
BU100最大电流允许值：10A
BU100最大工作频率：<1MHZ或未知
BU100引脚数：2
BU100最大耗散功率：15W
BU100放大倍数：
BU100图片代号：E-44
BU100vtest：150
BU100htest：999900
- BU100atest：10
BU100wtest：15
BU100代换 BU100用什么型号代替：BU107,BU109,BU110,BU114,BU127,BU606,BU607,BU608,BUY20,BUY69C,BUY70C,
BU100价格
参考价格：￥4.9246
型号：BU1006A-E3/45 品牌：Vishay 备注：这里有BU100多少钱，2025年最近7天走势，今日出价，今日竞价，BU100批发/采购报价，BU100行情走势销售排行榜，BU100报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
BU100 | Silicon NPN Power Transistors DESCRIPTION • With TO-3 package • High voltage capability APPLICATIONS • For horizontal deflection output stage of CTV receivers and high voltalge, fast switching and industrial applications | ISC 无锡固电 |   | |
BU100 | Silicon NPN Power Transistor 文件：130.68 Kbytes Page：2 Pages | NJSEMINew Jersey Semi-Conductor Products, Inc. 新泽西半导体新泽西半导体产品股份有限公司 | | |
Enhanced PowerBridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced isoCink??Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced isoCink??Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced isoCink??Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material c | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced Power Bridge Rectifiers FEATURES • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Dir | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced isoCink??Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material c | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced Power Bridge Rectifiers FEATURES • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Dir | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced Power Bridge Rectifiers FEATURES • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Dir | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced Power Bridge Rectifiers FEATURES • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Dir | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Dir | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced isoCink??Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced PowerBridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced isoCink??Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material c | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced Power Bridge Rectifiers FEATURES • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Dir | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Dir | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Bridge Rectifiers FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
封装/外壳：4-SIP，BU-5S 包装：卷带（TR） 描述：DIODE BRIDGE 10A 600V 分立半导体产品 二极管 - 桥式整流器 | ETC 知名厂家 | ETC | | |
Enhanced PowerBridge Rectifiers 文件：99.22 Kbytes Page：6 Pages | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Enhanced PowerBridge Rectifiers 文件：99.22 Kbytes Page：6 Pages | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
封装/外壳：4-SIP，BU-5S 包装：散装 描述：BRIDGE RECT 1P 600V 3A BU-5S 分立半导体产品 二极管 - 桥式整流器 | ETC 知名厂家 | ETC | | |
Enhanced PowerBridge Rectifiers 文件：99.22 Kbytes Page：6 Pages | VishayVishay Siliconix 威世科技威世科技半导体 | | ||
Precision Wirewound Resistors 100 Series / SM Series / PC Series • Resistances to 6 Megohms • Resistance Tolerances to ±0.005 • Temperature Coeffcients of ±2 ppm/°C • High TCR Available (Balco & Platinum Wire) • 100 Acceptance Tested / Traceable to NIST • Long Term Stability / 100ppm/year • Matched Resistance Sets t | Riedon | | ||
1.3 Watts Axial Leaded Zener Diodes VOLTAGE RANGE: 2.4 - 200V POWER: 1.3Wa t t s Features ● Complete Voltage Range 2.4 to 200 Volts ● High peak reverse power dissipation ● High reliability ● Low leakage current | SUNMATE 森美特 | | ||
SHIELDED SMT POWER INDUCTORS ● FEATURE Various high power inductor are Superior to be high saturation for surface mounting ● APPLICATIONS 2 DC/DC converter power supply, Telecommunication equipment | PRODUCTWELL | | ||
TOGGLE SWITCHES - MINIATURE 文件：1.55809 Mbytes Page：10 Pages | E-SWITCH | | ||
100/200 文件：3.83844 Mbytes Page：2 Pages | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | |
BU100产品属性
- 类型
描述
- 型号
BU100
- 制造商
ISC
- 制造商全称
Inchange Semiconductor Company Limited
- 功能描述
Silicon NPN Power Transistors
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
VISHAY/威世 |
24+ |
NA/ |
3290 |
原装现货,当天可交货,原型号开票 |
|||
VISHAY(威世) |
24+ |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
||||
VIS |
24+ |
扁桥GBU |
80000 |
只做自己库存 全新原装进口正品假一赔百 可开13%增 |
|||
ST |
1738+ |
TO-3 |
8529 |
科恒伟业!只做原装正品,假一赔十! |
|||
VISHAY/威世 |
22+ |
DIP-4 |
100000 |
代理渠道/只做原装/可含税 |
|||
MOTOROLA/摩托罗拉 |
25+ |
TO-3P |
54648 |
百分百原装现货 实单必成 欢迎询价 |
|||
MOTOROLA/摩托罗拉 |
24+ |
TO-3P |
990000 |
明嘉莱只做原装正品现货 |
|||
VISHAY/威世 |
10+ |
DIP-4 |
390 |
原装进口无铅现货 |
|||
VISHAY/威世 |
23+ |
DIP |
90000 |
一定原装正品 |
|||
VISHAY |
25+23+ |
1541 |
16864 |
绝对原装正品全新进口深圳现货 |
BU100规格书下载地址
BU100参数引脚图相关
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- BTS7960
- BTS780
- BTS775G
BU100数据表相关新闻
BTT6200-4ESA
原装正品现货
2022-8-8BTT6200-1ENA电源开关 IC - 配电 芯片
BTT6200-1ENA
2022-2-11BTT6200-4ESA 进口原装现货 假一罚十
进口原装现货 价格实惠 支持实单
2021-11-18BU2090
BU2090，全新原装当天发货或门市自取0755-82732291.
2019-9-14BU2090F
BU2090F，全新原装当天发货或门市自取0755-82732291.
2019-9-14BU2090F-E2
BU2090F-E2 ，全新原装当天发货或门市自取0755-82732291.
2019-3-6
DdatasheetPDF页码索引
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