型号 功能描述 生产厂家 企业 LOGO 操作
BGT60TR13C

60 GHz Radar Sensor

Features  60 GHz radar sensor for FMCW operation  5.5 GHz bandwidth  Antenna-in-package (6.5 x 5.0 x 0.9 mm³)  Digital interface for chip configuration and radar data acquistion  Optimized power modes for low-power operation  Integrated state machine for independent operation Potent

Infineon

英飞凌

BGT60TR13C

60 GHz radar system platform

The BGT60TR13C shield is optimized for fast prototyping designs and system integrations as well as initial product feature evaluations. The board offers developers the flexibility to choose their own platform depending on their preferred use cases. The sensor supports various use cases, serving a

Infineon

英飞凌

BGT60TR13C

BGT60TR13C E6327

Features • 60 GHz radar sensor for FMCW operation • 5.5 GHz bandwidth • Antenna-in-package (6.5 x 5.0 x 0.9 mm³) • Digital interface for chip configuration and radar data acquisition • Optimized power modes for low-power operation • Integrated state machine for independent operation Poten

Infineon

英飞凌

BGT60TR13C

XENSIV ™ 60GHz雷达传感器,实现高级传感

Infineon

英飞凌

BGT60TR13C E6327

Features • 60 GHz radar sensor for FMCW operation • 5.5 GHz bandwidth • Antenna-in-package (6.5 x 5.0 x 0.9 mm³) • Digital interface for chip configuration and radar data acquisition • Optimized power modes for low-power operation • Integrated state machine for independent operation Poten

Infineon

英飞凌

60 GHz Radar Sensor

Features  60 GHz radar sensor for FMCW operation  5.5 GHz bandwidth  Antenna-in-package (6.5 x 5.0 x 0.9 mm³)  Digital interface for chip configuration and radar data acquistion  Optimized power modes for low-power operation  Integrated state machine for independent operation Potent

Infineon

英飞凌

BGT60TR13C E6327

Features • 60 GHz radar sensor for FMCW operation • 5.5 GHz bandwidth • Antenna-in-package (6.5 x 5.0 x 0.9 mm³) • Digital interface for chip configuration and radar data acquisition • Optimized power modes for low-power operation • Integrated state machine for independent operation Poten

Infineon

英飞凌

封装/外壳:119-WFBGA,WLBGA 包装:托盘 描述:RF TRANSCEIVER PG-VF2BGA-40 RF/IF,射频/中频和 RFID 射频收发器 IC

Infineon

英飞凌

包装:散装 描述:MMW_CONSUMER \u0026 IOT PG-VF2BGA-40 传感器,变送器 专用传感器

Infineon

英飞凌

更新时间:2026-1-2 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Infineon(英飞凌)
24+
标准封装
13048
原厂渠道供应,大量现货,原型号开票。
INFINEON
23+
K-B
4510
只有原装,请来电咨询
Infineon(英飞凌)
24+
N/A
7448
原厂可订货,技术支持,直接渠道。可签保供合同
1924+
24+
VF2BGA-40
25540
郑重承诺只做原装进口现货
INFINEON
24+
N/A
10000
只做原装,实单最低价支持
Infineon(英飞凌)
25+
封装
500000
源自原厂成本,高价回收工厂呆滞
INFINEON/英飞凌
25+
VF2BGA-40
32360
INFINEON/英飞凌全新特价BGT60TR13CE6327即刻询购立享优惠#长期有货
Infineon(英飞凌)
23+
10000
只做全新原装,实单来
INFINEON/英飞凌
2025+
N/A
2000
原装原厂发货7-15工作日
22+
sot
6600
正品渠道现货,终端可提供BOM表配单。

BGT60TR13C数据表相关新闻