型号 功能描述 生产厂家 企业 LOGO 操作
BCM43455

Single-Chip 5G WiFi IEEE 802.11n/ac MAC/Baseband/ Radio with Integrated Bluetooth 5.0

Features IEEE 802.11x Key Features ■ IEEE 802.11ac compliant. ■ Support for TurboQAM® (MCS0–MCS8 86 Mbps and MCS0– MCS9 96 Mbps) HT20, 20 MHz channel bandwidth. ■ Single-stream spatial multiplexing up to 433.3 Mbps data rate. ■ Supports 20, 40, and 80 MHz channels with optional SGI (256 QAM

Infineon

英飞凌

BCM43455

Single-Chip 5G WiFi IEEE 802.11ac MAC/Baseband/ Radio with Integrated Bluetooth 4.1 and FM Receiver

文件:2.60064 Mbytes Page:159 Pages

CypressCypress Semiconductor

赛普拉斯赛普拉斯半导体公司

BCM43455

Single-Chip 5G WiFi IEEE 802.11ac MAC/Baseband/ Radio with Integrated Bluetooth 4.1 and FM Receiver

Infineon

英飞凌

Single-Chip 5G WiFi IEEE 802.11n/ac MAC/Baseband/ Radio with Integrated Bluetooth 5.0

Features IEEE 802.11x Key Features ■ IEEE 802.11ac compliant. ■ Support for TurboQAM® (MCS0–MCS8 86 Mbps and MCS0– MCS9 96 Mbps) HT20, 20 MHz channel bandwidth. ■ Single-stream spatial multiplexing up to 433.3 Mbps data rate. ■ Supports 20, 40, and 80 MHz channels with optional SGI (256 QAM

Infineon

英飞凌

Single-Chip 5G WiFi IEEE 802.11n/ac MAC/Baseband/ Radio with Integrated Bluetooth 5.0

Features IEEE 802.11x Key Features ■ IEEE 802.11ac compliant. ■ Support for TurboQAM® (MCS0–MCS8 86 Mbps and MCS0– MCS9 96 Mbps) HT20, 20 MHz channel bandwidth. ■ Single-stream spatial multiplexing up to 433.3 Mbps data rate. ■ Supports 20, 40, and 80 MHz channels with optional SGI (256 QAM

Infineon

英飞凌

无线收发芯片

BOARDCOM

博通

包装:托盘 描述:1X1 11AC BTFM COMBO RF/IF,射频/中频和 RFID 射频收发器 IC

BOARDCOM

博通

Single-Chip 5G WiFi IEEE 802.11ac MAC/Baseband/ Radio with Integrated Bluetooth 4.1 and FM Receiver

文件:2.60064 Mbytes Page:159 Pages

CypressCypress Semiconductor

赛普拉斯赛普拉斯半导体公司

Aluminum electrolytic capacitors

Long-life grade capacitors Capacitors with screw terminals Long useful life - 85 °C Features ■ Long useful life ■ All-welded construction ensures reliable electrical contact ■ Version with optimized construction for base cooling (heat sink mounting) available ■ Version with low-inductance d

EPCOS

爱普科斯

更新时间:2025-12-25 12:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Broadcom(博通)
2511
-
5904
电子元器件采购降本30%!原厂直采,砍掉中间差价
BROADCOM
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
Broadcom/AVAGO(安华高)
24+
4432
只做原装,提供一站式配单服务,代工代料。BOM配单
BCM
24+
NA/
461
优势代理渠道,原装正品,可全系列订货开增值税票
BROADCOM/博通
25+
WLBGA140
15620
BROADCOM全新特价BCM43455XKUBG即刻询购立享优惠#长期有货
BROADCOM
22+
BGA
30000
只做原装正品
ST
23+
QFP48
7300
专注配单,只做原装进口现货
BCM
23+
BGA
50000
全新原装正品现货,支持订货
Broadcom
24+
BGA
36000
进口原装现货假一赔十
BROADCOM
原厂封装
9800
原装进口公司现货假一赔百

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