RF片上系统 - SoC SmartConnect Chipset WINC1500 - SmartConnect Chipset WINC1500

封装/外壳：40-VFQFN 裸露焊盘 包装：托盘 描述：IC RF TXRX+MCU WIFI 40-WFQFN RF/IF，射频/中频和 RFID 射频收发器 IC

RF片上系统 - SoC SmartConnect Chipset WINC1500 - SmartConnect Chipset WINC1500

封装/外壳：40-VFQFN 裸露焊盘 包装：托盘 描述：IC RF TXRX+MCU WIFI 40VFQFN RF/IF，射频/中频和 RFID 射频收发器 IC

200 V - 1,000 V Single Phase Bridge 22.0 A - 25.0 A Forward Current 70 ns - 3000 ns Recovery Time

200 V - 1,000 V Single Phase Bridge 22.0 A - 25.0 A Forward Current 70 ns - 3000 ns Recovery Time

200 V - 1,000 V Single Phase Bridge 22.0 A - 25.0 A Forward Current 70 ns - 3000 ns Recovery Time

200 V - 1,000 V Single Phase Bridge 22.0 A - 25.0 A Forward Current 70 ns - 3000 ns Recovery Time

200 V - 1,000 V Single Phase Bridge

[VMI] 200 V - 1,000 V Single Phase Bridge 22.0 A - 25.0 A Forward Current 70 ns - 3000 ns Recovery Time

3MTM Hi?밫ack Conformable Double Coated Tape

文件：49.7 Kbytes Page：2 Pages

24 AWG stranded (7x32) TC conductor, polyolefin insulation, individually shielded Beldfoil

文件：87.09 Kbytes Page：3 Pages