PLASTIC PACKAGE ULTRA MINIATURE PURE SILICON™ CLOCK OSCILLATORS

Features • Low Power Consumption • Exceptional Stability Over Temp. at -40°C to +85°C • Low Cost-Compact QFN Plastic Packaging • Compact Package design

ULTRA MINIATURE PLASTIC PACKAGE PURE SILICON CLOCK OSCILLATOR

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PLASTIC PACKAGE ULTRA MINIATURE PURE SILICON™ CLOCK OSCILLATORS

Features • Low Power Consumption • Exceptional Stability Over Temp. at -40°C to +85°C • Low Cost-Compact QFN Plastic Packaging • Compact Package design

ULTRA MINIATURE PURE SILICON CLOCK OSCILLATORS

FEATURES: • Ultra Miniature Pure Silicon Clock Oscillator • MEMS Technology by Discera • Low Power Consumption

PLASTIC PACKAGE ULTRA MINIATURE PURE SILICON™ CLOCK OSCILLATORS

Features • Low Power Consumption • Exceptional Stability Over Temp. at -40°C to +85°C • Low Cost-Compact QFN Plastic Packaging • Compact Package design

PLASTIC PACKAGE ULTRA MINIATURE PURE SILICON™ CLOCK OSCILLATORS

Features • Low Power Consumption • Exceptional Stability Over Temp. at -40°C to +85°C • Low Cost-Compact QFN Plastic Packaging • Compact Package design

Intel® Smart Display Module-Large Size with 8th/9th Generation Intel®Coffee Lake -S / Refresh series Processor (Socket Type)

Features ■ Intel® Smart Display Module-Large Size ■ 8th/9th Generation Intel® Core™ i-S series Processor (Coffee Lake-S/ Refresh) ■ DDR4 2666 SO-DIMM x 2 ■ M.2 2242 (B key) x 1, M.2 2230 (E-Key) x 1 ■ USB 3.2 Gen 1 x 2 (Gen 2 supported by Q370) ■ Intel® I219 GbE x 1 ■ HDMI 2.0 x 1, DP1.2 x

Intel® Smart Display Module-Large Size with 8th/9th Generation Intel®Coffee Lake -S / Refresh series Processor (Socket Type)

Features ■ Intel® Smart Display Module-Large Size ■ 8th/9th Generation Intel® Core™ i-S series Processor (Coffee Lake-S/ Refresh) ■ DDR4 2666 SO-DIMM x 2 ■ M.2 2242 (B key) x 1, M.2 2230 (E-Key) x 1 ■ USB 3.2 Gen 1 x 2 (Gen 2 supported by Q370) ■ Intel® I219 GbE x 1 ■ HDMI 2.0 x 1, DP1.2 x

Intel® Smart Display Module-Large Size with 8th/9th Generation Intel®Coffee Lake -S / Refresh series Processor (Socket Type)

Features ■ Intel® Smart Display Module-Large Size ■ 8th/9th Generation Intel® Core™ i-S series Processor (Coffee Lake-S/ Refresh) ■ DDR4 2666 SO-DIMM x 2 ■ M.2 2242 (B key) x 1, M.2 2230 (E-Key) x 1 ■ USB 3.2 Gen 1 x 2 (Gen 2 supported by Q370) ■ Intel® I219 GbE x 1 ■ HDMI 2.0 x 1, DP1.2 x

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

Plastic SMD MEMS Clock Oscillator

Features  Extended Operating Temperature at -40 to +125°C (LVDS and CMOS only)  MIL-STD-883 shock and vibration compliant  Durable QFN Plastic Compact Packaging  Tri-State or Power Down functions  PCIe Gen1-6 Compliant Output  Low RMS Jitter 650 fs (typ.)  REACH/RoHS II Compliant |

中低压N-MOS

中低压N-MOS

N-MOS Trench

封装/外壳：4-SMD，无引线 功能：待机（断电） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：MEMS OSC XO 10.0000MHZ LVCMOS 晶体，振荡器，谐振器 振荡器

封装/外壳：4-SMD，无引线 功能：待机（断电） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：MEMS OSC XO 100.0000MHZ LVCMOS 晶体，振荡器，谐振器 振荡器

ULTRA MINIATURE PLASTIC PACKAGE ULTRA MINIATURE PLASTIC PACKAGE

文件：2.10022 Mbytes Page：3 Pages

PLASTIC PACKAGE INDUSTRIAL GRADE ULTRA MINIATURE PURE SILICONTM CLOCK OSCILLATOR

文件：7.08803 Mbytes Page：5 Pages

PLASTIC PACKAGE INDUSTRIAL GRADE ULTRA MINIATURE PURE SILICONTM CLOCK OSCILLATOR

文件：7.08803 Mbytes Page：5 Pages

PLASTIC PACKAGE INDUSTRIAL GRADE ULTRA MINIATURE PURE SILICONTM CLOCK OSCILLATOR

文件：7.08803 Mbytes Page：5 Pages

Standby or Disable Tri-state function

文件：3.81331 Mbytes Page：6 Pages

VOLTAGE CONTROLLED TEMP

文件：98.01 Kbytes Page：1 Pages