型号 功能描述 生产厂家&企业 LOGO 操作
ADSP-BF700

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

ADSP-BF700

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

封装/外壳:88-VFQFN 裸露焊盘,CSP 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC DSP LP 128KB L2SR 88LFCSP 集成电路(IC) DSP(数字信号处理器)

AD

亚德诺

封装/外壳:88-VFQFN 裸露焊盘,CSP 包装:托盘 描述:IC DSP LP 128KB L2SR 88LFCSP 集成电路(IC) DSP(数字信号处理器)

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

RECTIFIERS ASSEMBLIES THREE PHASE BRIDGES, 2.5 AMP, STANDARD AND FAST RECOVERY

Three Phase Bridges, 2.5 Amp, Standard and Fast Recovery FEATURES • Miniature Package • Recovery Time : to 500 ns • Surge Ratings : to 25 A • PIV : from 100 to 600 V • Controlled Avalanche Characteristics • Only Fused-in-Glass Diodes Used

Microsemi

美高森美

PHENOLIC INSTRUMENT CASES

[KEYSTONE] PHENOLIC INSTRUMENT CASES •Choice of Sizes •Sturdy construction •Flush mounting panels •Cases and panels are sold separately •Covers available in Phenolic or Aluminum •Covers can be machined to accept dials, switches, displays •Panel mounting screws available

etc2List of Unclassifed Manufacturers

etc未分类制造商etc2未分类制造商

Highly compliant

文件:296.43 Kbytes Page:2 Pages

LSTD

Temperature Sensors Line Guide

文件:736.09 Kbytes Page:11 Pages

Honeywell

霍尼韦尔

PUSHBUTTON SWITCHES - SNAP-ACTING

文件:525.6 Kbytes Page:6 Pages

E-SWITCH

更新时间:2025-8-13 13:44:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ADI/亚德诺
24+
BGA
540010
自己库存,有更多量
ADI/亚德诺
22+
66900
原封装
ADI/亚德诺
2324+
LFCSP-VQ-88
78920
二十余载金牌老企,研究所优秀合供单位,您的原厂窗口
ADI/亚德诺
24+
LFCSP
60000
ADI/亚德诺
24+
38522
只做全新原装进口现货
ADI(亚德诺)
22+
N/A
10000
原装,BOM表可配单
ADI(亚德诺)
24+
NA/
8735
原厂直销,现货供应,账期支持!
ADI(亚德诺)
24+
LFCSP-VQ-88
1025
深耕行业12年,可提供技术支持。
ADI
2024+
N/A
70000
柒号只做原装 现货价秒杀全网
ADI/亚德诺
25+
LFCSP
57488
百分百原装现货 实单必成 欢迎询价

ADSP-BF700数据表相关新闻