Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

低功耗200 MHz BLACKFIN+ 嵌入式处理器，带128KB L2 SRAM

Instruction set compatible with previous Blackfin products

文件：2.96096 Mbytes Page：116 Pages

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

Instruction set compatible with previous Blackfin products

文件：2.96096 Mbytes Page：116 Pages

Instruction set compatible with previous Blackfin products

文件：2.96096 Mbytes Page：116 Pages

封装/外壳：88-VFQFN 裸露焊盘，CSP 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC DSP LP 128KB L2SR 88LFCSP 集成电路（IC） DSP（数字信号处理器）

封装/外壳：88-VFQFN 裸露焊盘，CSP 包装：托盘 描述：IC DSP LP 128KB L2SR 88LFCSP 集成电路（IC） DSP（数字信号处理器）

Instruction set compatible with previous Blackfin products

文件：2.96096 Mbytes Page：116 Pages

RECTIFIERS ASSEMBLIES THREE PHASE BRIDGES, 2.5 AMP, STANDARD AND FAST RECOVERY

Three Phase Bridges, 2.5 Amp, Standard and Fast Recovery FEATURES • Miniature Package • Recovery Time : to 500 ns • Surge Ratings : to 25 A • PIV : from 100 to 600 V • Controlled Avalanche Characteristics • Only Fused-in-Glass Diodes Used

PHENOLIC INSTRUMENT CASES

[KEYSTONE] PHENOLIC INSTRUMENT CASES •Choice of Sizes •Sturdy construction •Flush mounting panels •Cases and panels are sold separately •Covers available in Phenolic or Aluminum •Covers can be machined to accept dials, switches, displays •Panel mounting screws available

Highly compliant

文件：296.43 Kbytes Page：2 Pages

Temperature Sensors Line Guide

文件：736.09 Kbytes Page：11 Pages

PUSHBUTTON SWITCHES - SNAP-ACTING

文件：525.6 Kbytes Page：6 Pages