Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater