Assembly and Handling Information

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BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

Mini 7/8 Female 4 Pin Field Attachable

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5횞20mm fast-acting glass body cartridge fuse designed to IEC specification

文件：995.95 Kbytes Page：4 Pages

Direct replacement for E27 (European Standard)

文件：284.97 Kbytes Page：5 Pages

1.5A Three Terminal Adj. Voltage Regulator

文件：365.04 Kbytes Page：9 Pages