TflexTM 500 Series

Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex™ 500 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts. Tfle

包装：散装 描述：THERM PAD 457.2MMX457.2MM BLUE 风扇，热管理 热 - 垫，片

包装：盒 描述：THERM PAD 228.6MMX228.6MM BLUE 风扇，热管理 热 - 垫，片

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E