位置：首页 > IC中文资料第12679页 > 768201103JP
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
768201103JP | Surface Mount Resistor Network Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and | CTS 西迪斯 |   | |
768201103JP | 封装/外壳：20-SOIC（0.220"，5.59mm 宽） 包装：卷带（TR） 描述：RES ARRAY 19 RES 10K OHM 20SOIC 电阻器 电阻器网络，阵列 | CTS 西迪斯 | | |
Surface Mount Resistor Network Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and | CTS 西迪斯 | | ||
包装：卷带（TR） 描述：RESISTOR ARRAY 10K OHM 5% 20PIN 电阻器 电阻器网络，阵列 | CTS 西迪斯 | | ||
Surface Mount Resistor Network Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and | CTS 西迪斯 | | ||
Surface Mount Resistor Network Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and | CTS 西迪斯 | | ||
Surface Mount Resistor Network Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and | CTS 西迪斯 | | ||
Surface Mount Resistor Network Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and | CTS 西迪斯 | |
768201103JP产品属性
- 类型
描述
- 型号
768201103JP
- 制造商
CTS Corporation
- 功能描述
FIXED RESISTORS>2 LEADS - Bulk
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
SOLECTRON |
24+ |
NA/ |
5250 |
原装现货,当天可交货,原型号开票 |
|||
CHINAXYJ |
23+ |
SMD |
9868 |
专做原装正品,假一罚百! |
|||
SOLECT |
25+23+ |
SOP20 |
8680 |
绝对原装正品全新进口深圳现货 |
|||
CTSCORPOR |
23+ |
5000 |
原厂授权代理,海外优势订货渠道。可提供大量库存,详 |
||||
TE/泰科 |
2508+ |
/ |
484664 |
一级代理，原装现货 |
|||
CTS |
25+ |
1740 |
公司优势库存 热卖中!! |
||||
CTS |
新 |
2000 |
全新原装 货期两周 |
||||
CTS |
24+ |
SOP20 |
22055 |
郑重承诺只做原装进口现货 |
|||
24+ |
5000 |
公司存货 |
|||||
TE/泰科 |
23+ |
NA/原装 |
82985 |
代理-优势-原装-正品-现货*期货 |
768201103JP规格书下载地址
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