型号 功能描述 生产厂家&企业 LOGO 操作
768141103GP

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

768141103GP

封装/外壳:14-SOIC(0.220",5.59mm 宽) 包装:管件 描述:RES ARRAY 13 RES 10K OHM 14SOIC 电阻器 电阻器网络,阵列

ETC

知名厂家

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

Leaded Surface Mount

文件:147.95 Kbytes Page:5 Pages

CTSCTS Electronic Components

西迪斯西迪斯公司

Leaded Surface Mount

文件:147.95 Kbytes Page:5 Pages

CTSCTS Electronic Components

西迪斯西迪斯公司

封装/外壳:14-SOIC(0.220",5.59mm 宽) 包装:卷带(TR) 描述:RES ARRAY 13 RES 10K OHM 14SOIC 电阻器 电阻器网络,阵列

ETC

知名厂家

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

Surface Mount Resistor Network

Features - Surface Mount Gull Wing Package - Solid Ceramic Construction - Low Profile, Board to Network Clearance – 0.191mm ±0.064mm - No Internal Dendrite Growth - Meets EIA PDP 100 SOGN-0002 Outline - Requires 30 Less Board Space Than Molded Products of the Same Power Rating - Tape and

CTSCTS Electronic Components

西迪斯西迪斯公司

Leaded Surface Mount

文件:147.95 Kbytes Page:5 Pages

CTSCTS Electronic Components

西迪斯西迪斯公司

Leaded Surface Mount

文件:147.95 Kbytes Page:5 Pages

CTSCTS Electronic Components

西迪斯西迪斯公司

Leaded Surface Mount

文件:147.95 Kbytes Page:5 Pages

CTSCTS Electronic Components

西迪斯西迪斯公司

768141103GP产品属性

  • 类型

    描述

  • 型号

    768141103GP

  • 功能描述

    RES ARRAY 10K OHM 13 RES 14SOIC

  • RoHS

  • 类别

    电阻器 >> 网络、阵列

  • 系列

    768

  • 标准包装

    43

  • 系列

    768

  • 电路类型

    隔离

  • 电阻(欧姆)

    100k

  • 电阻数

    8

  • 引脚数

    16

  • 每个元件的功率

    200mW

  • 容差

    ±2%

  • 温度系数

    ±100ppm/°C

  • 应用

    -

  • 安装类型

    表面贴装

  • 封装/外壳

    16-SOIC(0.220,5.59mm 宽)

  • 供应商设备封装

    -

  • 尺寸/尺寸

    0.440 L x 0.220 W(11.18mm x 5.59mm)

  • 高度

    0.063(1.60mm)

  • 包装

    管件

  • 工作温度

    -55°C ~ 125°C

更新时间:2025-8-17 15:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
CTS
23+
原厂原包
19960
只做进口原装 终端工厂免费送样
24+
N/A
70000
一级代理-主营优势-实惠价格-不悔选择
ADVANTEK
2000
全新原装 货期两周

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