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74AC112价格
参考价格：￥14.3830
型号：74AC11240DBR 品牌：TI 备注：这里有74AC112多少钱，2025年最近7天走势，今日出价，今日竞价，74AC112批发/采购报价，74AC112行情走势销售排行榜，74AC112报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small- | TI 德州仪器 |   | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small- | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small- | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small- | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small- | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small- | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small- | TI 德州仪器 | | ||
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS EPICE (Enhanced-Performance Implanted CMOS ) 1-mm Process 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 12 | TI 德州仪器 | | ||
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS EPICE (Enhanced-Performance Implanted CMOS ) 1-mm Process 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 12 | TI 德州仪器 | | ||
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS EPICE (Enhanced-Performance Implanted CMOS ) 1-mm Process 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 12 | TI 德州仪器 | | ||
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS EPICE (Enhanced-Performance Implanted CMOS ) 1-mm Process 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 12 | TI 德州仪器 | | ||
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS EPICE (Enhanced-Performance Implanted CMOS ) 1-mm Process 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 12 | TI 德州仪器 | | ||
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS EPICE (Enhanced-Performance Implanted CMOS ) 1-mm Process 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 12 | TI 德州仪器 | | ||
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS EPICE (Enhanced-Performance Implanted CMOS ) 1-mm Process 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 12 | TI 德州仪器 | | ||
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS EPICE (Enhanced-Performance Implanted CMOS ) 1-mm Process 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 12 | TI 德州仪器 | | ||
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS EPICE (Enhanced-Performance Implanted CMOS ) 1-mm Process 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 12 | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plas | TI 德州仪器 | | ||
8-INPUT MULTIPLEXER 8-input multiplexer (3-State) | Philips 飞利浦 | | ||
8-INPUT MULTIPLEXER 8-input multiplexer (3-State) | Philips 飞利浦 | | ||
8-INPUT MULTIPLEXER 8-input multiplexer (3-State) | Philips 飞利浦 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | | ||
9-bit odd/even parity generator/checker with bus drive l/O port DESCRIPTION The 74AC/ACT11268 high-performance CMOS device combine very high speed and high output drive comparable to the most advanced TTL families. | Philips 飞利浦 | | ||
9-bit odd/even parity generator/checker with bus drive l/O port DESCRIPTION The 74AC/ACT11268 high-performance CMOS device combine very high speed and high output drive comparable to the most advanced TTL families. | Philips 飞利浦 | | ||
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS 文件：114.93 Kbytes Page：9 Pages | TI 德州仪器 | | ||
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS 文件：111.22 Kbytes Page：9 Pages | TI 德州仪器 | | ||
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS 文件：111.22 Kbytes Page：9 Pages | TI 德州仪器 | | ||
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS 文件：111.22 Kbytes Page：9 Pages | TI 德州仪器 | | ||
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER 文件：117.52 Kbytes Page：7 Pages | TI 德州仪器 | | ||
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER 文件：117.52 Kbytes Page：7 Pages | TI 德州仪器 | | ||
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER 文件：117.52 Kbytes Page：7 Pages | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS 文件：582.26 Kbytes Page：14 Pages | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS 文件：96.57 Kbytes Page：6 Pages | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS 文件：582.26 Kbytes Page：14 Pages | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS 文件：96.57 Kbytes Page：6 Pages | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS 文件：582.26 Kbytes Page：14 Pages | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS 文件：96.57 Kbytes Page：6 Pages | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS 文件：582.26 Kbytes Page：14 Pages | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS 文件：96.57 Kbytes Page：6 Pages | TI 德州仪器 | | ||
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS 文件：582.26 Kbytes Page：14 Pages | TI 德州仪器 | |
74AC112产品属性
- 类型
描述
- 型号
74AC112
- 功能描述
Dual J-K Flip-Flop with Set and Reset
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI |
22+ |
DIP-24/750PC |
4140 |
全新原装现货!自家库存! |
|||
TI |
25+ |
DIP-24 |
3200 |
全新原装、诚信经营、公司现货销售 |
|||
TI |
1119+ |
DIP |
1316 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
TI |
03+ |
DIP-24/750PCS |
4140 |
原装现货海量库存欢迎咨询 |
|||
TI |
24+ |
SOIC/5.2mm |
25843 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
|||
TI |
25+ |
DIP-24.. |
9 |
全新现货 |
|||
TI |
25+ |
DIP |
2700 |
全新原装自家现货优势! |
|||
TI/德州仪器 |
24+ |
NA/ |
4140 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
TI/德州仪器 |
25+ |
DIP-24 |
65428 |
百分百原装现货 实单必成 |
|||
TI |
25+ |
28 |
公司优势库存 热卖中!! |
74AC112规格书下载地址
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DdatasheetPDF页码索引
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