74AC11价格
参考价格:¥7.9314
型号:74AC11000D 品牌:TI 备注:这里有74AC11多少钱,2026年最近7天走势,今日出价,今日竞价,74AC11批发/采购报价,74AC11行情走势销售排行榜,74AC11报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
74AC11 | Triple 3-Input AND Gate General Description The AC11 contains three, 3-input AND gates. Features ■ ICC reduced by 50 ■ Outputs source/sink 24mA | FAIRCHILD 仙童半导体 | ||
74AC11 | TRIPLE 3-INPUT AND GATE DESCRIPTION The AC11 is an advanced high-speed CMOS TRIPLE 3-INPUT AND GATE fabricated with sub-micron silicon gate and double-layer metal wiring C2MOS technology. It is ideal for low power applications mantaining high speed operation similar to equivalent Bipolar Schottky TTL. ■ HIGH SPEED: tPD | STMICROELECTRONICS 意法半导体 | ||
74AC11 | TRIPLE 3-INPUT AND GATE | STMICROELECTRONICS 意法半导体 | ||
74AC11 | Triple 3-Input AND Gate | ONSEMI 安森美半导体 | ||
丝印代码:74AC11000N;QUADRUPLE 2-INPUT POSITIVE-NAND GATE FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC | TI 德州仪器 | |||
丝印代码:74AC11000N;QUADRUPLE 2-INPUT POSITIVE-NAND GATE FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC | TI 德州仪器 | |||
丝印代码:74AC11000N;QUADRUPLE 2-INPUT POSITIVE-NAND GATE FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC | TI 德州仪器 | |||
丝印代码:74AC11004N;HEX INVERTER Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small | TI 德州仪器 | |||
丝印代码:74AC11004N;HEX INVERTER Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small | TI 德州仪器 | |||
丝印代码:74AC11008N;QUADRUPLE 2-INPUT POSITIVE-AND GATE Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm | TI 德州仪器 | |||
丝印代码:74AC11008N;QUADRUPLE 2-INPUT POSITIVE-AND GATE Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm | TI 德州仪器 | |||
丝印代码:74AC11032N;QUADRUPLE 2-INPUT POSITIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m | TI 德州仪器 | |||
丝印代码:74AC11032N;QUADRUPLE 2-INPUT POSITIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m | TI 德州仪器 | |||
丝印代码:74AC11074N;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3 | TI 德州仪器 | |||
丝印代码:74AC11074N;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3 | TI 德州仪器 | |||
丝印代码:74AC11086N;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description | TI 德州仪器 | |||
丝印代码:74AC11086N;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description | TI 德州仪器 | |||
丝印代码:74AC11086N;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description | TI 德州仪器 | |||
丝印代码:74AC11086N;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description | TI 德州仪器 | |||
丝印代码:74AC11257N;QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | |||
丝印代码:74AC11257N;QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS 3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems | TI 德州仪器 | |||
QUADRUPLE 2-INPUT POSITIVE-NAND GATE FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC | TI 德州仪器 | |||
丝印代码:AC11000;QUADRUPLE 2-INPUT POSITIVE-NAND GATE FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC | TI 德州仪器 | |||
丝印代码:AC11000;QUADRUPLE 2-INPUT POSITIVE-NAND GATE FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC | TI 德州仪器 | |||
丝印代码:AC11000;QUADRUPLE 2-INPUT POSITIVE-NAND GATE FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC | TI 德州仪器 | |||
HEX INVERTER Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small | TI 德州仪器 | |||
丝印代码:AC11004;HEX INVERTER Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small | TI 德州仪器 | |||
丝印代码:AC11004;HEX INVERTER Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small | TI 德州仪器 | |||
丝印代码:AC11004;HEX INVERTER Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small | TI 德州仪器 | |||
QUADRUPLE 2-INPUT POSITIVE-AND GATE Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm | TI 德州仪器 | |||
丝印代码:AC11008;QUADRUPLE 2-INPUT POSITIVE-AND GATE Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm | TI 德州仪器 | |||
丝印代码:AC11008;QUADRUPLE 2-INPUT POSITIVE-AND GATE Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm | TI 德州仪器 | |||
丝印代码:AE008;QUADRUPLE 2-INPUT POSITIVE-AND GATE Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm | TI 德州仪器 | |||
丝印代码:AE008;QUADRUPLE 2-INPUT POSITIVE-AND GATE Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm | TI 德州仪器 | |||
DUAL 4 INPUT NAND SCHMITT TRIGGER DESCRIPTION The 74AC/ACT11013 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. | PHILIPS 飞利浦 | |||
DUAL 4 INPUT NAND SCHMITT TRIGGER DESCRIPTION The 74AC/ACT11013 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. | PHILIPS 飞利浦 | |||
DUAL 4 INPUT NAND SCHMITT TRIGGER DESCRIPTION The 74AC/ACT11013 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. | PHILIPS 飞利浦 | |||
SIGNETICS DESCRIPTION The 74AC/ACT11014 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. | PHILIPS 飞利浦 | |||
SIGNETICS DESCRIPTION The 74AC/ACT11014 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. | PHILIPS 飞利浦 | |||
SIGNETICS DESCRIPTION The 74AC/ACT11014 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. | PHILIPS 飞利浦 | |||
QUADRUPLE 2-INPUT POSITIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m | TI 德州仪器 | |||
丝印代码:AC11032;QUADRUPLE 2-INPUT POSITIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m | TI 德州仪器 | |||
丝印代码:AC11032;QUADRUPLE 2-INPUT POSITIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m | TI 德州仪器 | |||
丝印代码:AE032;QUADRUPLE 2-INPUT POSITIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m | TI 德州仪器 | |||
丝印代码:AE032;QUADRUPLE 2-INPUT POSITIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m | TI 德州仪器 | |||
丝印代码:AC11032;QUADRUPLE 2-INPUT POSITIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m | TI 德州仪器 | |||
丝印代码:AC11032;QUADRUPLE 2-INPUT POSITIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m | TI 德州仪器 | |||
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3 | TI 德州仪器 | |||
丝印代码:AC11074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3 | TI 德州仪器 | |||
丝印代码:AC11074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3 | TI 德州仪器 | |||
丝印代码:AC11074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3 | TI 德州仪器 | |||
丝印代码:AE074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3 | TI 德州仪器 | |||
丝印代码:AE074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3 | TI 德州仪器 | |||
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description | TI 德州仪器 | |||
丝印代码:AC11086;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description | TI 德州仪器 | |||
丝印代码:AC11086;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description | TI 德州仪器 | |||
QUAD 2 INPUT NAND SCHMITT TRIGGER DESCRIPTION The 74AC/ACT11132 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. The 74AC/ACT11132 provides four separate 2-input NAND gate functions which are capable of transforming slowly changing input signals into sharpl | PHILIPS 飞利浦 | |||
QUAD 2 INPUT NAND SCHMITT TRIGGER DESCRIPTION The 74AC/ACT11132 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. The 74AC/ACT11132 provides four separate 2-input NAND gate functions which are capable of transforming slowly changing input signals into sharpl | PHILIPS 飞利浦 | |||
DUAL 4 INPUT MULTIPLEXER DESCRIPTION The 74AC/ACT11153 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. FEATURES • Separate Output Enable inputs for each section • Common Select inputs • Output capability: ±24 mA • CMOS (AC) and TTL (ACT) volta | PHILIPS 飞利浦 | |||
DUAL 4 INPUT MULTIPLEXER DESCRIPTION The 74AC/ACT11153 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. FEATURES • Separate Output Enable inputs for each section • Common Select inputs • Output capability: ±24 mA • CMOS (AC) and TTL (ACT) volta | PHILIPS 飞利浦 |
74AC11产品属性
- 类型
描述
- Supply voltage (Min) (V):
3
- Supply voltage (Max) (V):
5.5
- Number of channels (#):
4
- Inputs per channel:
2
- IOL (Max) (mA):
24
- IOH (Max) (mA):
-24
- Input type:
Standard CMOS
- Output type:
Push-Pull
- Features:
Very high speed (tpd 5-10ns)
- Data rate (Max) (Mbps):
100
- Rating:
Catalog
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI |
23+ |
TSSOP |
7850 |
只做原装正品假一赔十为客户做到零风险!! |
|||
TI |
25+ |
- |
22412 |
原装正品现货,原厂订货,可支持含税原型号开票。 |
|||
TI/德州仪器 |
2019+ |
SOP16 |
3333 |
原厂渠道 可含税出货 |
|||
TI/德州仪器 |
23+ |
明嘉莱只做原装正品现货 |
2510000 |
TSSOP16 |
|||
TI/德州仪器 |
2025+ |
SSOP |
5000 |
原装进口价格优 请找坤融电子! |
|||
TI |
25+ |
N/A |
7786 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
TI/德州仪器 |
25+ |
TSSOP24 |
32360 |
TI/德州仪器全新特价74AC11240PW即刻询购立享优惠#长期有货 |
|||
TI |
2021+ |
SMD-16 |
6800 |
原厂原装,欢迎咨询 |
|||
TI |
2025+ |
N/A |
70000 |
柒号只做原装 现货价秒杀全网 |
|||
TI/德州仪器 |
2025+ |
SOP14 |
269 |
原装正品 询价请发QQ |
74AC11规格书下载地址
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- 74AC00B
- 74AC00
- 74ABT827D,623
- 74ABT821D,602
- 74ABT74D,118
- 74ABT74D,112
- 74ABT74
- 74ABT32
- 74ABT20
74AC11数据表相关新闻
74ACT14SCX
MC14069UBDR2G 74ACT14SCX MM74HC14MTCX UC3844BVD1R2G UC3842BD1R2G NL27WZ04DFT2G
2023-5-1774ABT162841DLRG4
74ABT162841DLRG4
2021-10-2774ABT162601DLRG4
74ABT162601DLRG4
2021-10-2774AC157M十年IC,因为专注,所以专业
74AC157M 十年IC,因为专注,所以专业
2020-10-177499111221A
7499111221A
2020-9-2874AC125P中文产品资料
74AC125P中文产品资料
2019-2-15
DdatasheetPDF页码索引
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