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74AC11价格

参考价格:¥7.9314

型号:74AC11000D 品牌:TI 备注:这里有74AC11多少钱,2026年最近7天走势,今日出价,今日竞价,74AC11批发/采购报价,74AC11行情走势销售排行榜,74AC11报价。
型号 功能描述 生产厂家 企业 LOGO 操作
74AC11

Triple 3-Input AND Gate

General Description The AC11 contains three, 3-input AND gates. Features ■ ICC reduced by 50 ■ Outputs source/sink 24mA

FAIRCHILD

仙童半导体

74AC11

TRIPLE 3-INPUT AND GATE

DESCRIPTION The AC11 is an advanced high-speed CMOS TRIPLE 3-INPUT AND GATE fabricated with sub-micron silicon gate and double-layer metal wiring C2MOS technology. It is ideal for low power applications mantaining high speed operation similar to equivalent Bipolar Schottky TTL. ■ HIGH SPEED: tPD

STMICROELECTRONICS

意法半导体

74AC11

TRIPLE 3-INPUT AND GATE

STMICROELECTRONICS

意法半导体

74AC11

Triple 3-Input AND Gate

ONSEMI

安森美半导体

丝印代码:74AC11000N;QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

TI

德州仪器

丝印代码:74AC11000N;QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

TI

德州仪器

丝印代码:74AC11000N;QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

TI

德州仪器

丝印代码:74AC11004N;HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

TI

德州仪器

丝印代码:74AC11004N;HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

TI

德州仪器

丝印代码:74AC11008N;QUADRUPLE 2-INPUT POSITIVE-AND GATE

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm

TI

德州仪器

丝印代码:74AC11008N;QUADRUPLE 2-INPUT POSITIVE-AND GATE

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm

TI

德州仪器

丝印代码:74AC11032N;QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

TI

德州仪器

丝印代码:74AC11032N;QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

TI

德州仪器

丝印代码:74AC11074N;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3

TI

德州仪器

丝印代码:74AC11074N;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3

TI

德州仪器

丝印代码:74AC11086N;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description

TI

德州仪器

丝印代码:74AC11086N;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description

TI

德州仪器

丝印代码:74AC11086N;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description

TI

德州仪器

丝印代码:74AC11086N;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description

TI

德州仪器

丝印代码:74AC11257N;QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS

3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems

TI

德州仪器

丝印代码:74AC11257N;QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER WITH 3-STATE OUTPUTS

3-State Outputs Interface Directly With System Bus Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise 500-mA Typical Latch-Up Immunity at 125°C Provides Bus Interface From Multiple Sources in High-Performance Systems

TI

德州仪器

QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

TI

德州仪器

丝印代码:AC11000;QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

TI

德州仪器

丝印代码:AC11000;QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

TI

德州仪器

丝印代码:AC11000;QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

TI

德州仪器

HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

TI

德州仪器

丝印代码:AC11004;HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

TI

德州仪器

丝印代码:AC11004;HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

TI

德州仪器

丝印代码:AC11004;HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

TI

德州仪器

QUADRUPLE 2-INPUT POSITIVE-AND GATE

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm

TI

德州仪器

丝印代码:AC11008;QUADRUPLE 2-INPUT POSITIVE-AND GATE

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm

TI

德州仪器

丝印代码:AC11008;QUADRUPLE 2-INPUT POSITIVE-AND GATE

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm

TI

德州仪器

丝印代码:AE008;QUADRUPLE 2-INPUT POSITIVE-AND GATE

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm

TI

德州仪器

丝印代码:AE008;QUADRUPLE 2-INPUT POSITIVE-AND GATE

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Sm

TI

德州仪器

DUAL 4 INPUT NAND SCHMITT TRIGGER

DESCRIPTION The 74AC/ACT11013 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families.

PHILIPS

飞利浦

DUAL 4 INPUT NAND SCHMITT TRIGGER

DESCRIPTION The 74AC/ACT11013 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families.

PHILIPS

飞利浦

DUAL 4 INPUT NAND SCHMITT TRIGGER

DESCRIPTION The 74AC/ACT11013 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families.

PHILIPS

飞利浦

SIGNETICS

DESCRIPTION The 74AC/ACT11014 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families.

PHILIPS

飞利浦

SIGNETICS

DESCRIPTION The 74AC/ACT11014 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families.

PHILIPS

飞利浦

SIGNETICS

DESCRIPTION The 74AC/ACT11014 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families.

PHILIPS

飞利浦

QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

TI

德州仪器

丝印代码:AC11032;QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

TI

德州仪器

丝印代码:AC11032;QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

TI

德州仪器

丝印代码:AE032;QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

TI

德州仪器

丝印代码:AE032;QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

TI

德州仪器

丝印代码:AC11032;QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

TI

德州仪器

丝印代码:AC11032;QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

TI

德州仪器

DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3

TI

德州仪器

丝印代码:AC11074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3

TI

德州仪器

丝印代码:AC11074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3

TI

德州仪器

丝印代码:AC11074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3

TI

德州仪器

丝印代码:AE074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3

TI

德州仪器

丝印代码:AE074;DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 3

TI

德州仪器

QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description

TI

德州仪器

丝印代码:AC11086;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description

TI

德州仪器

丝印代码:AC11086;QUADRUPLE 2-INPUT EXCLUSIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) description

TI

德州仪器

QUAD 2 INPUT NAND SCHMITT TRIGGER

DESCRIPTION The 74AC/ACT11132 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. The 74AC/ACT11132 provides four separate 2-input NAND gate functions which are capable of transforming slowly changing input signals into sharpl

PHILIPS

飞利浦

QUAD 2 INPUT NAND SCHMITT TRIGGER

DESCRIPTION The 74AC/ACT11132 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. The 74AC/ACT11132 provides four separate 2-input NAND gate functions which are capable of transforming slowly changing input signals into sharpl

PHILIPS

飞利浦

DUAL 4 INPUT MULTIPLEXER

DESCRIPTION The 74AC/ACT11153 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. FEATURES • Separate Output Enable inputs for each section • Common Select inputs • Output capability: ±24 mA • CMOS (AC) and TTL (ACT) volta

PHILIPS

飞利浦

DUAL 4 INPUT MULTIPLEXER

DESCRIPTION The 74AC/ACT11153 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families. FEATURES • Separate Output Enable inputs for each section • Common Select inputs • Output capability: ±24 mA • CMOS (AC) and TTL (ACT) volta

PHILIPS

飞利浦

74AC11产品属性

  • 类型

    描述

  • Supply voltage (Min) (V):

    3

  • Supply voltage (Max) (V):

    5.5

  • Number of channels (#):

    4

  • Inputs per channel:

    2

  • IOL (Max) (mA):

    24

  • IOH (Max) (mA):

    -24

  • Input type:

    Standard CMOS

  • Output type:

    Push-Pull

  • Features:

    Very high speed (tpd 5-10ns)

  • Data rate (Max) (Mbps):

    100

  • Rating:

    Catalog

更新时间:2026-5-21 15:32:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
23+
TSSOP
7850
只做原装正品假一赔十为客户做到零风险!!
TI
25+
-
22412
原装正品现货,原厂订货,可支持含税原型号开票。
TI/德州仪器
2019+
SOP16
3333
原厂渠道 可含税出货
TI/德州仪器
23+
明嘉莱只做原装正品现货
2510000
TSSOP16
TI/德州仪器
2025+
SSOP
5000
原装进口价格优 请找坤融电子!
TI
25+
N/A
7786
正规渠道,免费送样。支持账期,BOM一站式配齐
TI/德州仪器
25+
TSSOP24
32360
TI/德州仪器全新特价74AC11240PW即刻询购立享优惠#长期有货
TI
2021+
SMD-16
6800
原厂原装,欢迎咨询
TI
2025+
N/A
70000
柒号只做原装 现货价秒杀全网
TI/德州仪器
2025+
SOP14
269
原装正品 询价请发QQ

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