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| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
73644-3105 | 2.00mm (.079) Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position C, 144 Circuits 文件：175.38 Kbytes Page：4 Pages | MOLEX8Molex Electronics Ltd. 莫仕 |   |
73644-3105产品属性
- 类型
描述
- 型号
73644-3105
- 制造商
MOLEX
- 制造商全称
Molex Electronics Ltd.
- 功能描述
2.00mm(.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position C, 144 Circuits
更新时间：2025-10-7 9:38:00
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MOLEX/莫仕 |
24+ |
34244 |
原厂现货渠道 |
||||
BROADCOM |
25+ |
BGA |
880000 |
明嘉莱只做原装正品现货 |
|||
3M |
24+ |
233 |
|||||
Amphenol ICC (FCI) |
23+ |
原厂封装 |
11674 |
只做原装只有原装现货实报 |
|||
MOLEX |
新 |
646 |
全新原装 货期两周 |
||||
SAMZO(三佐) |
23+ |
SMD-4P,4.7x3.6mm |
1840 |
原装现货/专做开关15年 |
|||
BROADCOM |
2023+ |
BGA |
20000 |
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73644-3105数据表相关新闻
72V73273BBG原装原装原装！
72V73273BBG原装原装原装！
2024-6-17739W-X2/32-A
739W-X2/32-A
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优势渠道
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74088820APSE-QAA
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2019-12-19
DdatasheetPDF页码索引
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