型号 功能描述 生产厂家 企业 LOGO 操作

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:9.04113 Mbytes Page:355 Pages

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:2.83 Mbytes Page:329 Pages

TI

德州仪器

Applications of the K2H and K2E platforms in high-end imaging

文件:520.73 Kbytes Page:4 Pages

TI

德州仪器

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

TI

德州仪器

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

TI

德州仪器

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

TI

德州仪器

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

TI

德州仪器

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

TI

德州仪器

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

TI

德州仪器

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

TI

德州仪器

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

TI

德州仪器

封装/外壳:1517-BBGA,FCBGA 包装:托盘 描述:66AK2H12DAAW2 集成电路(IC) DSP(数字信号处理器)

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:2.83 Mbytes Page:329 Pages

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:9.04113 Mbytes Page:355 Pages

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:9.04113 Mbytes Page:355 Pages

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:2.83 Mbytes Page:329 Pages

TI

德州仪器

封装/外壳:1517-BBGA,FCBGA 包装:托盘 描述:66AK2H12DAAWA2 集成电路(IC) DSP(数字信号处理器)

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:2.83 Mbytes Page:329 Pages

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:9.04113 Mbytes Page:355 Pages

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:9.04113 Mbytes Page:355 Pages

TI

德州仪器

Multicore DSPARM KeyStone II System-on-Chip (SoC)

文件:2.83 Mbytes Page:329 Pages

TI

德州仪器

更新时间:2025-12-31 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
24+
NA/
105
优势代理渠道,原装正品,可全系列订货开增值税票
TI(德州仪器)
24+
NA/
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
Texas Instruments
20+
FCBGA-1517
15988
TI全新DSP-可开原型号增税票
TI
24+
SMD
21
“芯达集团”专营军工百分之百原装进口
TI
22+
1517FCBGA (40x40)
9000
原厂渠道,现货配单
TI(德州仪器)
25+
N/A
6000
原装,请咨询
Texas Instruments
25+
1517-BBGA FCBGA
9350
独立分销商 公司只做原装 诚心经营 免费试样正品保证
TI/德州仪器
22+
BGA1517
12245
现货,原厂原装假一罚十!
Texas
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
TI
25+
(AAW)
6000
原厂原装,价格优势

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