位置:首页 > IC中文资料 > 66AK2H12DAAW
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:9.04113 Mbytes Page:355 Pages | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:2.83 Mbytes Page:329 Pages | TI 德州仪器 | |||
Applications of the K2H and K2E platforms in high-end imaging 文件:520.73 Kbytes Page:4 Pages | TI 德州仪器 | |||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | |||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | |||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | |||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | |||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | |||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | |||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | |||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | |||
封装/外壳:1517-BBGA,FCBGA 包装:托盘 描述:66AK2H12DAAW2 集成电路(IC) DSP(数字信号处理器) | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:2.83 Mbytes Page:329 Pages | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:9.04113 Mbytes Page:355 Pages | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:9.04113 Mbytes Page:355 Pages | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:2.83 Mbytes Page:329 Pages | TI 德州仪器 | |||
封装/外壳:1517-BBGA,FCBGA 包装:托盘 描述:66AK2H12DAAWA2 集成电路(IC) DSP(数字信号处理器) | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:2.83 Mbytes Page:329 Pages | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:9.04113 Mbytes Page:355 Pages | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:9.04113 Mbytes Page:355 Pages | TI 德州仪器 | |||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件:2.83 Mbytes Page:329 Pages | TI 德州仪器 |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI/德州仪器 |
24+ |
NA/ |
105 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
TI(德州仪器) |
24+ |
NA/ |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
Texas Instruments |
20+ |
FCBGA-1517 |
15988 |
TI全新DSP-可开原型号增税票 |
|||
TI |
24+ |
SMD |
21 |
“芯达集团”专营军工百分之百原装进口 |
|||
TI |
22+ |
1517FCBGA (40x40) |
9000 |
原厂渠道,现货配单 |
|||
TI(德州仪器) |
25+ |
N/A |
6000 |
原装,请咨询 |
|||
Texas Instruments |
25+ |
1517-BBGA FCBGA |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
TI/德州仪器 |
22+ |
BGA1517 |
12245 |
现货,原厂原装假一罚十! |
|||
Texas |
25+ |
25000 |
原厂原包 深圳现货 主打品牌 假一赔百 可开票! |
||||
TI |
25+ |
(AAW) |
6000 |
原厂原装,价格优势 |
66AK2H12DAAW芯片相关品牌
66AK2H12DAAW规格书下载地址
66AK2H12DAAW参数引脚图相关
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- 7490
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- 700t
- 6706-RC
- 67068
- 67060
- 6705-RC
- 6705K
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- 66AK2H14BAAW24
- 66AK2H14AXAAW24
- 66AK2H14AAAWA24
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- 66AK2H06DAAW2
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- 66AK2H06BAAWA24
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- 66995
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- 66951
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2020-5-15
DdatasheetPDF页码索引
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