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61083价格
参考价格:¥10.1572
型号:61083-041402LF 品牌:FCI 备注:这里有61083多少钱,2026年最近7天走势,今日出价,今日竞价,61083批发/采购报价,61083行情走势销售排行榜,61083报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
61083 | SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR DESCRIPTION The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic package is ideal for designs where board space and device weight are important requirements. This device is available custom binned to customer specifications or scree | MICROPAC | ||
61083 | SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR | MICROPAC | ||
61083 | 包装:散装 描述:PUNCH ASSY D 工具 专用工具 | GREENLEE | ||
61083 | 0.8mM BOARD TO BOARD PLUG ASSY 文件:461.27 Kbytes Page:6 Pages | FCI-CONNECTOR | ||
SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR DESCRIPTION The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic package is ideal for designs where board space and device weight are important requirements. This device is available custom binned to customer specifications or scree | MICROPAC | |||
SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR DESCRIPTION The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic package is ideal for designs where board space and device weight are important requirements. This device is available custom binned to customer specifications or scree | MICROPAC | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 |
61083产品属性
- 类型
描述
- 型号
61083
- 功能描述
冲压机与冲模 PUN.UNIT(D) .75X.703
- RoHS
否
- 制造商
Souriau
- 产品
Dies
- 类型
Crimping
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
AMPHENOL/安费诺 |
25+ |
连接器 |
13250 |
原装正品现货供应商原厂货源渠道订货 |
|||
FCIELECTRONICS |
24+ |
156061 |
明嘉莱只做原装正品现货 |
||||
AMPHENOL/FCI |
板对板 0.8间距 20P 公头 4.7H |
71291 |
一级代理百分百有货,原装正品现货,支持实单! |
||||
FCI |
25+ |
SMD |
22000 |
一级代理原装现货 |
|||
AMPHENOL |
25+ |
610 |
公司优势库存 热卖中! |
||||
AMPHENOL/安费诺 |
2022+ |
NA |
10000 |
只做原装,价格优惠,长期供货。 |
|||
FCI |
2025+ |
connector |
5000 |
原装进口价格优 请找坤融电子! |
|||
FCI |
24+ |
778 |
|||||
AMPHENOL/安费诺 |
2508+ |
/ |
470984 |
一级代理,原装现货 |
|||
AMPHENOL/安费诺 |
22+ |
SMD |
5800 |
专营AMPHENOL/FCI/优势资源/支持实单订货 |
61083芯片相关品牌
61083规格书下载地址
61083参数引脚图相关
- 74ls373
- 74ls244
- 74ls192
- 74ls164
- 74ls138
- 74ls04
- 74ls00
- 74hc595
- 74hc573
- 74hc541
- 74hc244
- 74hc164
- 7490
- 7241
- 7169
- 700t
- 6657
- 6612
- 6445
- 6280
- 610SJR
- 610-R10
- 610-R01
- 610PTBO
- 610PT
- 610NM
- 610JE
- 610HE
- 610FE
- 6109PBG
- 61099
- 61095-1
- 61095
- 61090
- 61089B
- 61089
- 61085-3
- 61085-1
- 61085
- 61084
- 61083-084402LF
- 61083-084400LF
- 61083-083402LF
- 61083-082402LF
- 61083-081402LF
- 61083-081400LF
- 61083-064402LF
- 61083-063422LF
- 61083-063402LF
- 61083-063400LF
- 61083-062402LF
- 61083-062400LF
- 61083-061402LF
- 61083-044409LF
- 61083-044402LF
- 61083-043402LF
- 61083-043400LF
- 61083-042402LF
- 61083-042400LF
- 61083-041402LF
- 61082-202400LF
- 61082-202000
- 61082-201402LF
- 61082-181402LF
- 61082-163400LF
- 61082-162402LF
- 61082-162400LF
- 61082-161400LF
- 61082-142620LF
- 61082-142400LF
- 61082-141402LF
- 61082-141400LF
- 61082-123402LF
- 61082-122402LF
- 61082-122400LF
- 61082-121402LF
- 61082-103402LF
- 61082-102602LF
- 61082-102402LF
- 61082-101402LF
- 61082
- 61070-2
- 61070-1
- 61063
- 61060-2
- 61060
- 61059
- 61058
- 61056
- 61055
- 61053
- 61050
- 61048-2
- 61048
- 6102A
- 61029-2
- 61029-1
- 6102-5
- 6102-3
- 6102-1
61083数据表相关新闻
6116SA15SOG
6116SA15SOG
2023-4-12614004135023
进口代理
2022-10-1861082-121402LF
进口代理
2022-9-29618购5G手机?买得起玩的溜的OPPO手机Ace2了解一下
618购5G手机?买得起玩的溜的OPPO手机 Ace2了解一下
2020-6-560619-1技术参数 60619-1原装正品现货
60619-1技术参数 60619-1原装正品现货
2020-5-156098-4333
深圳科雨电子有限公司,联系人:卢小姐 手机:18975515225 原装正品 大量现货,有需要的可以联系我 QQ:97877805 微信:wei555222777
2019-6-20
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