61083价格

参考价格:¥10.1572

型号:61083-041402LF 品牌:FCI 备注:这里有61083多少钱,2026年最近7天走势,今日出价,今日竞价,61083批发/采购报价,61083行情走势销售排行榜,61083报价。
型号 功能描述 生产厂家 企业 LOGO 操作
61083

SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR

DESCRIPTION The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic package is ideal for designs where board space and device weight are important requirements. This device is available custom binned to customer specifications or scree

MICROPAC

61083

SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR

MICROPAC

61083

包装:散装 描述:PUNCH ASSY D 工具 专用工具

GREENLEE

61083

0.8mM BOARD TO BOARD PLUG ASSY

文件:461.27 Kbytes Page:6 Pages

FCI-CONNECTOR

SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR

DESCRIPTION The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic package is ideal for designs where board space and device weight are important requirements. This device is available custom binned to customer specifications or scree

MICROPAC

SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR

DESCRIPTION The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic package is ideal for designs where board space and device weight are important requirements. This device is available custom binned to customer specifications or scree

MICROPAC

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

61083产品属性

  • 类型

    描述

  • 型号

    61083

  • 功能描述

    冲压机与冲模 PUN.UNIT(D) .75X.703

  • RoHS

  • 制造商

    Souriau

  • 产品

    Dies

  • 类型

    Crimping

更新时间:2026-1-27 19:11:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
AMPHENOL/安费诺
25+
连接器
13250
原装正品现货供应商原厂货源渠道订货
FCIELECTRONICS
24+
156061
明嘉莱只做原装正品现货
AMPHENOL/FCI
板对板 0.8间距 20P 公头 4.7H
71291
一级代理百分百有货,原装正品现货,支持实单!
FCI
25+
SMD
22000
一级代理原装现货
AMPHENOL
25+
610
公司优势库存 热卖中!
AMPHENOL/安费诺
2022+
NA
10000
只做原装,价格优惠,长期供货。
FCI
2025+
connector
5000
原装进口价格优 请找坤融电子!
FCI
24+
778
AMPHENOL/安费诺
2508+
/
470984
一级代理,原装现货
AMPHENOL/安费诺
22+
SMD
5800
专营AMPHENOL/FCI/优势资源/支持实单订货

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