Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

连接器附件

包装：袋 描述：MODICE LEFT SPRING PLATE 盒子，外壳，机架 盒配件

包装：袋 描述：MODICE LEFT SPRING PLATE 盒子，外壳，机架 盒配件

连接器附件

How to Use This Catalog

文件：8.73467 Mbytes Page：116 Pages

For use with TO-220 packages

文件：87.41 Kbytes Page：2 Pages

How to Use This Catalog

文件：8.73467 Mbytes Page：116 Pages

TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS

DESCRIPTION The TH58100 is a single 3.3 V 1-Gbit (1,107,296,256) bit NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes x 32 pages x 8192 blocks. The device has a 528-byte static register which allows program and read data to be transferred between t

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ARM Cortex-M4F 192MHz

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NTC thermistors for temperature measurement

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NTC thermistors for temperature measurement

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