封装/外壳：8-SOIC（0.154"，3.90mm 宽） 包装：托盘 描述：IC MULTIPLIER/ZD BUFFER 8-SOIC 集成电路（IC） 时钟发生器，PLL，频率合成器

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Introduction The Intel® Pentium® 4 processor on 90 nm process in the 775-land package is a follow on to the Pentium 4 processor in the 478-pin package with enhancements to the Intel NetBurst® microarchitecture. The Pentium 4 processor on 90 nm process in the 775-land package uses FlipChip Land Gr

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DESCRIPTION The BECA 570 profile is a highperforming, double acting compact piston seal composed of a profiled rubber ring with special fibre reinforcements and a POM wear/backup ring. It can be assembled in a groove according to standard ISO 6547. APPLICATIONS Agriculture Mobile mac

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SUBMINIATURE FUSEHOLDERS

文件：92.51 Kbytes Page：1 Pages