护套类2.2护套

For use with TO-5 packages

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包装：袋 描述：HEATSINK TO-5 1.25W H=.25\ 风扇，热管理 热敏 - 散热器

护套类混合护套

ECU

SINGLE-CHIP DUAL PROSLIC®

Si32260/1 Features  Two complete FXS channels in a single 6 x 8 mm or 8 x 8 mm package  Performs all BORSCHT functions  Ideal for short- or long-loop applications  Ultra low power consumption  Internal balanced or unbalanced ringing  Patented low power ringing  Adaptive ringing  S

Single-Chip Dual ProSLIC

Description The Si32260/1 Dual ProSLIC® devices, in a single package, implement two complete foreign exchange station (FXS) telephony interfaces. The Si32260/1 devices operate from a 3.3 V supply and have standard PCM/SPI or GCI bus digital interfaces. A pair of built-in dc-dc converter controll

Single-Chip Dual ProSLIC

Description The Si32260/1 Dual ProSLIC® devices, in a single package, implement two complete foreign exchange station (FXS) telephony interfaces. The Si32260/1 devices operate from a 3.3 V supply and have standard PCM/SPI or GCI bus digital interfaces. A pair of built-in dc-dc converter controll

Single-Chip Dual ProSLIC

Description The Si32260/1 Dual ProSLIC® devices, in a single package, implement two complete foreign exchange station (FXS) telephony interfaces. The Si32260/1 devices operate from a 3.3 V supply and have standard PCM/SPI or GCI bus digital interfaces. A pair of built-in dc-dc converter controll

Silicon Laboratories is pleased to announce revision 1.1 of the datasheet

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