型号 功能描述 生产厂家 企业 LOGO 操作
274-1ABE-02

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

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更新时间:2026-3-15 8:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
MSOP8
6698
BEL
24+
DIP-8
20000
全新原厂原装,进口正品现货,正规渠道可含税!!
PhoenixContact
24+
SMD
17900
I/O模块IBSIL24BKDIO16/16-PAC
LU
23+
NA
2485
专做原装正品,假一罚百!
TI/德州仪器
25+
MSOP8
15000
全新原装现货,价格优势
TI
24+
DIP
296
TI
2450+
SOP8
6540
只做原厂原装正品终端客户免费申请样品
WEIDMVLLER
15+
NA
1182
全新 发货1-2天
TI/德州仪器
2447
SOP8
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
BEL
23+
DIP-8
5000
专注配单,只做原装进口现货

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