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| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
239-75ABE-03 | BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS • No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s | ETCList of Unclassifed Manufacturers 未分类制造商 |   |
更新时间：2026-3-2 9:18:00
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
24+ |
SMD |
5500 |
一级代理原装现货假一罚十 |
||||
SWRE |
24+ |
SOP-16 |
60000 |
全新原装现货 |
|||
SWRE |
23+ |
SOP-16 |
242442 |
||||
JRC/新日本无线 |
24+ |
TO220 |
9600 |
原装现货,优势供应,支持实单! |
|||
HITACHI |
16+ |
QFP |
4000 |
进口原装现货/价格优势! |
|||
JRC |
2026+ |
TO220 |
14903 |
全新原装现货,可出样品,可开增值税发票 |
|||
TI/德州仪器 |
MSOP8 |
6698 |
|||||
JRC/新日本无线 |
2007 |
TO220 |
2 |
原装现货支持BOM配单服务 |
|||
TE |
25+ |
100 |
原厂现货渠道 |
||||
AVA |
25+ |
18 |
公司优势库存 热卖中!! |
239-75ABE-03芯片相关品牌
239-75ABE-03规格书下载地址
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DdatasheetPDF页码索引
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