型号 功能描述 生产厂家 企业 LOGO 操作
236-150AB

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

236-150AB

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes Page:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes Page:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes Page:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes Page:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

236-150AB产品属性

  • 类型

    描述

  • 型号

    236-150AB

  • 制造商

    WAKEFIELD THERMAL SOLUTIONS

  • 功能描述

    Heat Sink Passive TO-220 Vertical/Horizontal Thru-Hole Aluminum 4.8?C/W Black Anodized

更新时间:2026-3-10 11:30:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TE/泰科
24+
NA
15000
原装现货,专业配单专家
TE/泰科
2508+
/
209858
一级代理,原装现货
AMP-TECONNECTIVITY
23+
175182
原厂授权代理,海外优势订货渠道。可提供大量库存,详
TE CONNECTIVITY
25+
Connector
15000
原厂原装,价格优势
TE/泰科
2447
SMD
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
INVENSYS
23+
DIP-16
6500
专注配单,只做原装进口现货
TE/泰科
23+
NA
50000
全新原装正品现货,支持订货
TE CONNECTIVITY美国泰科
2450+
NA
9850
只做原厂原装正品现货或订货假一赔十!
TE/泰科
21+
NA
15000
只做原装,一定有货,不止网上数量,量多可订货!
TE Connectivity
25+
23746
原厂现货渠道

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