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| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
236-150AB | BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS • No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s | ETCList of Unclassifed Manufacturers 未分类制造商 |   | |
236-150AB | BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 文件：922.36 Kbytes Page：20 Pages | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | | |
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS • No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s | ETCList of Unclassifed Manufacturers 未分类制造商 | | ||
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS • No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s | ETCList of Unclassifed Manufacturers 未分类制造商 | | ||
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS • No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s | ETCList of Unclassifed Manufacturers 未分类制造商 | | ||
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 文件：922.36 Kbytes Page：20 Pages | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | | ||
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 文件：922.36 Kbytes Page：20 Pages | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | | ||
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 文件：922.36 Kbytes Page：20 Pages | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | |
236-150AB产品属性
- 类型
描述
- 型号
236-150AB
- 制造商
WAKEFIELD THERMAL SOLUTIONS
- 功能描述
Heat Sink Passive TO-220 Vertical/Horizontal Thru-Hole Aluminum 4.8?C/W Black Anodized
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TE/泰科 |
24+ |
NA/ |
9974 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
INVENSYS |
23+ |
DIP-16 |
6500 |
专注配单,只做原装进口现货 |
|||
TE/泰科 |
21+ |
NA |
15000 |
只做原装,一定有货,不止网上数量,量多可订货! |
|||
TE/泰科 |
18+ |
NA |
9974 |
||||
TYCO |
NA |
16355 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
TE/泰科 |
2508+ |
/ |
209858 |
一级代理，原装现货 |
|||
TE CONNECTIVITY |
25+ |
Connector |
15000 |
原厂原装,价格优势 |
|||
Tyco |
2004 |
4000 |
公司优势库存 热卖中!! |
||||
TE Connectivity AMP Connectors |
23+ |
原厂封装 |
2458 |
只做原装只有原装现货实报 |
|||
TE |
新 |
15005 |
全新原装 货期两周 |
236-150AB规格书下载地址
236-150AB参数引脚图相关
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- 236-150ABE-05
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236-150AB数据表相关新闻
2367817-2
2367817-2
2022-9-52367819-2
2367819-2
2022-9-52359527-2原装深圳现货
2359527-2
2022-7-182379237-1深圳现货特价出售
2379237-1
2022-7-182359528-2
2359528-2
2021-8-312359527-2
2359527-2
2021-8-31
DdatasheetPDF页码索引
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