型号 功能描述 生产厂家 企业 LOGO 操作
231-75PAB

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

231-75PAB产品属性

  • 类型

    描述

  • 型号

    231-75PAB

  • 功能描述

    散热片 TO-220 VERT/HORZ BLK

  • RoHS

  • 制造商

    Ampro By ADLINK

  • 产品

    Heat Sink Accessories

  • 安装风格

    Through Hole

  • 设计目的

    Express-HRR

更新时间:2025-11-21 9:04:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TE
2022
连接器
10000
全新、原装
TE
24+
con
2500
优势库存,原装正品
TE
5
泰科
25+
N/A
62
全新原装
TE/AMPTYCO泰科
100144
原装正品,实数库存有上就有,欢迎咨询!
TE/泰科
2508+
/
470984
一级代理,原装现货
TE/泰科
24+
32407
原厂现货渠道
TE Connectivity AMP Connectors
23+
原厂封装
547
只做原装只有原装现货实报
TE/泰科
23+
NA/原装
82985
代理-优势-原装-正品-现货*期货
TE
24+
con
10000
查现货到京北通宇商城

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