型号 功能描述 生产厂家 企业 LOGO 操作
231-69PABE-XXX

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

更新时间:2026-1-30 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
BOURNS
25+
-
20948
样件支持,可原厂排单订货!
2316S-16G-F1
25+
2283
2283
TF(拓锋)
20+
SOT-23-3L
3000
N/A
25+
ROHS
880000
明嘉莱只做原装正品现货
TE/泰科
2508+
/
484664
一级代理,原装现货
ROHS
ROHS
56520
一级代理 原装正品假一罚十价格优势长期供货
TE
25+
100
原厂现货渠道
TE/泰科
23+
NA/原装
82985
代理-优势-原装-正品-现货*期货
HITACHI
16+
TQFP
578
进口原装现货/价格优势!
N/A
23+
80000
专注配单,只做原装进口现货

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