BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

Mini 7/8 Female 4 Pin Field Attachable

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5횞20mm fast-acting glass body cartridge fuse designed to IEC specification

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Direct replacement for E27 (European Standard)

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1.5A Three Terminal Adj. Voltage Regulator

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This specification covers the requirements for product performance, test methods and quality assurance provisions of 217B-BC02

Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions.