型号 功能描述 生产厂家 企业 LOGO 操作

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

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更新时间:2025-12-30 17:49:01
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
WAKEFIELDENGINEERING
21+
NA
59000
只做原装,一定有货,不止网上数量,量多可订货!
WAKEFIELDENGINEERING
24+
NA
45399
原装现货,专业配单专家
TE
NA
41137
一级代理 原装正品假一罚十价格优势长期供货
WAKEFIELD
23+
NA
1886
专做原装正品,假一罚百!
WAKEFIELDENGINEERING
22+
N/A
12245
现货,原厂原装假一罚十!
WAKEFIELDENGINEERING
21+
NA
12820
只做原装,质量保证
WAKEFIELDTHERMAL
24+
1778
TE/泰科
2508+
/
273494
一级代理,原装现货
WAKEFIELDENGINEERING
2450+
NA
9850
只做原厂原装正品现货或订货假一赔十!
TE/泰科
24+
34678
原厂现货渠道

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