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20706

AT9228 Assembly

Description Square Deep Recessed Assembly 9.6W/m IP20 LED Strip and driver / 4000K / 90CRI / 2M

ATOMAitupu Technology Co., Ltd.

爱特姆深圳市爱特姆科技有限公司

Präsenzmelder & Bewegungsmelder Deckenmontage innen

Funktionsbeschreibung - Passiv-Infrarot-Präsenzmelder für Deckenmontage UP - Quadratischer Erfassungsbereich 360°, 7 x 7 m, (49 m2) bei 3 m Montagehöhe - 1 Kanal Licht (Relais 230 V) - Automatische präsenz- und helligkeitsabhängige Steuerung für Beleuchtung - Mischlichtmessung für Fluoreszenz

THEBEN

德国泰邦

Präsenzmelder & Bewegungsmelder Deckenmontage innen

Funktionsbeschreibung - Passiv-Infrarot-Präsenzmelder für Deckenmontage UP - Quadratischer Erfassungsbereich 360°, 7 x 7 m, (49 m2) bei 3 m Montagehöhe - 1 Kanal Licht (Relais 230 V) - Automatische präsenz- und helligkeitsabhängige Steuerung für Beleuchtung - Mischlichtmessung für Fluoreszenz

THEBEN

德国泰邦

Presence and motion detectors Ceiling installation indoor

Description - Passive infra-red presence detector for flush-mounted ceiling installation - Square detection area 360°, 7 x 7 m, (49 m2) at mounting height 3 m - 1 channel light (Relay, 230 V) - Automatic presence- and brightness-dependent control for lighting - Mixed light measurement suitabl

THEBEN

德国泰邦

Präsenzmelder & Bewegungsmelder Deckenmontage innen

Funktionsbeschreibung - Passiv-Infrarot-Präsenzmelder für Deckenmontage UP - Quadratischer Erfassungsbereich 360°, 7 x 7 m, (49 m2) bei 3 m Montagehöhe - 1 Kanal Licht (Relais 230 V) und 1 Kanal Präsenz (Relais potenzialfrei für HKL Steuerung) - Automatische präsenz- und helligkeitsabhängige S

THEBEN

德国泰邦

Presence and motion detectors Ceiling installation indoor

Description - Passive infra-red presence detector for flush-mounted ceiling installation - Square detection area 360°, 7 x 7 m, (49 m2) at mounting height 3 m - 1 channel light (Relay, 230 V) and 1 channel presence (Relay, floating for HVAC control) - Automatic presence- and brightness-depende

THEBEN

德国泰邦

Präsenzmelder & Bewegungsmelder Deckenmontage innen

Funktionsbeschreibung - Passiv-Infrarot-Präsenzmelder für Deckenmontage UP - Quadratischer Erfassungsbereich 360° - Slave-Version für thePrema-Master Präsenzmelder - Durch werkseitige Voreinstellung sofort betriebsbereit - Testbetrieb zur Überprüfung von Funktion und Erfassungsbereich - Erwe

THEBEN

德国泰邦

Präsenzmelder & Bewegungsmelder Deckenmontage innen

Funktionsbeschreibung - Passiv-Infrarot-Präsenzmelder für Deckenmontage UP - Quadratischer Erfassungsbereich 360° - Slave-Version für thePrema-Master Präsenzmelder - Durch werkseitige Voreinstellung sofort betriebsbereit - Testbetrieb zur Überprüfung von Funktion und Erfassungsbereich - Erwe

THEBEN

德国泰邦

Presence and motion detectors Ceiling installation indoor

Description - Passive infra-red presence detector for flush-mounted ceiling installation - Square detection area 360° - Slave version for thePrema master presence detectors - Ready for immediate use due to factory preset - Test mode for checking function and detection area - Extension of det

THEBEN

德国泰邦

Simplifying the multi-cloud with a domain focus application

Features ƒ High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor ƒ Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services ƒ Integrated IoT software for private cloud deployment, pla

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9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

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Intel Atom E3900 series Embedded SBC Fanless Slim System

Features ƒ Intel® Atom™ E3900 series ƒ Onboard 4GB LPDDR4-2400MT/s, 32GB eMMC ƒ Independent display by HDMI ƒ Semi-Industry Fanless slim systen, Din Rail or Wall mount design ƒ Support HDMI x 1 , GbE x 2 USB 3.0 x 2, COM x 2, DIO x 2 ƒ Flexible expansion M.2 E key, F/S miniPCIe ƒ 12V power

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8th Gen. Intel® Core Processor SoC Multiple I/Os Fanless Embedded System

Features ƒ 8th Gen. Intel Core i7-8665UE/i5-8365UE Quad Core ƒ Dual Display HDMI + DP, up to 4K2K ƒ 4 x GbE, 8 x USB3.0/2.0, 4 x UART, 2 x CANBus ƒ 4 Expansion: M.2 E-Key 2230, M-Key 2280, B-Key 3042, F/S mPCIe ƒ DC-in 12V, Wall Mount & DIN Rail ƒ iManager3.0 & SW APIs, WISE-PaaS/DeviceOn

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11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

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Intel 8th Gen U Series Palm-sized Fanless System

Features ƒ Equip powerful 8th-Gen Intel® Core™ i processor ƒ Palm-sized chassis design (180 x 116.7 x 66mm) ƒ Diverse system I/O: 4 x COM, 4 x USB, 2 x HDMI, 2 x GbE LAN, 16-bit GPIO ƒ 3 x M.2 expansion slots (1 x 2230 E-key, 1 x 2242/3042 B-Key, 1 x 2280 M-key) for edge AI capability ƒ Win1

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Intel Atom platform with Dual GbE LAN Fanless Compact Box

Features ƒ Intel® Apollo Lake E3900 series & N series Processor ƒ Palm-size form factor: 128 (L) x 152 (W) x 37 mm(H) ƒ Supports 2 x COM port, 1 x HDMI, 1 x Display Port, 2 x USB3.0, TPM 2.0 and DCIN 12~24V ƒ Built-in 1 x M.2 2230 slot, 1 x Half size Mini PCIe expansion slot and 1 x Full siz

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Intel® Atom™ E3950/E3930 DC 1.6/1.3 GHz UTX Industrial Motherboard with HDMI/eDP (LVDS)/DP, 2 COMs and Dual LAN

Features ƒ Supports Intel® Atom™ Quad/ Dual core E3950/E3930 1.6/ 1.3 GHz processor ƒ Single 204-pin SO-DIMM up to 8 GB DDR3L 1866 MHz SDRAM ƒ Supports HDMI/DP++, eDP (co-lay dual-channel 48-bit LVDS) ƒ Supports 1 Mini-PCIE expansion slot, M.2 E-Key slot, 2 COMs (RS-232, RS-422/485), 4 USB 3

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Intel® Atom™ E3950 QC 1.6 GHz UTX Industrial Motherboard with HDMI/eDP (LVDS)/DP, 4 COMs and 3 LANs

Features ƒ Supports Intel® Atom™ Quad core E3950 up to 2.0 GHz processor ƒ Single 204-pin SO-DIMM up to 8 GB DDR3L 1866 MHz SDRAM ƒ Supports HDMI/DP++, eDP (co-lay dual-channel 48-bit LVDS) ƒ Supports 1 Mini-PCIE expansion slot, M.2 E-Key slot, 4 COMs (2x RS-232, 2x RS-232 or 422 or 485), 4 U

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Intel Atom Platform Palm Size Fanless system

Features ƒ Intel® Atom Quad Core/Dual Core Processor ƒ Palm-size form factor: 170 (L) x 117 (W) x 52.6 mm (H) ƒ Supports 2 x LAN, 2 x COM port, 1 x HDMI, 1 x Display Port, 4 x USB3.0, CANBus, and DCIN 12~24V ƒ Built-in 1 x M.2 expansion slot (PCIe Gen2, USB 2.0 co-lay), 1 x Full size Mini PC

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Intel Atom Platform Palm Size Fanless system

Features ƒ Intel® Apollo Lake E3900 series Processor ƒ Palm-size form factor: 170 X 117 X 52.6 mm ƒ Supports 3 x LAN, 4 x COM port, 1 x HDMI, 1 x Display Port, 4 x USB3.0, CANBus, 16bit GPIO, Audio in/out and DCIN 12~24V ƒ Built-in 1 x M.2 expansion slot (PCIe Gen2, USB 2.0 co-lay), 1 x Full

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AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

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11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W ƒ On-board LPDDR4x-4267 up to 32G with IBECC for Industrial Sku ƒ Dual independent display: eDP/MIPI-DSI, DP up to 8K ƒ 2 GbE, 2 USB 3.2, COM Port, SMBus/I2C ƒ Expansion: M.2 E-Key, M.2 B-Key/M-Key NVMe x2 ƒ Supports i

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Intel® Xeon® /Core™ i3/i5/i7 LGA1151 Powerful Edge Inference System

Features ƒ Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 up to 65W CPU ƒ Dual independent display: VGA + HDMI ƒ Dual Channel DDR4 SO-DIMM memory up to 32 GB ƒ 850W power supply built-in ƒ PCIe x16 Graphics card support up to 260W ƒ Two swappable 2.5 hard drive bay

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Compact Fanless System with 10th Gen Intel® Xeon®/Core™ i CPU Socket (LGA 1200)

Features ƒ Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipset ƒ Wide operating temperature (-10 ~ 60 °C) ƒ VGA and HDMI output ƒ 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1) ƒ 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional) ƒ 1 x 2.5 H

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Edge Intelligence System with Intel 11th generation with Edge X API and WISE-DeviceOn

Features ƒ Intel 11th gen. Core i5/i3/Celeron ƒ Pre-integrated Edge X with data acquisition API ƒ Pre-integrated WISE-DeviceOn for device management and remote control ƒ 8/16 GB DDR4 Memory Built-in ƒ 64 GB SATA Slim SSD Built-in ƒ Compact 156 x 112 x 60mm dimensions ƒ 4K HDMI and DP 1.4a D

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Intel® Atom® x6000 Series Processor (Code Name: Elkhart Lake) Pico-ITX SBC

Features ƒ Intel Atom x6000E Series ƒ Onboard LPDDR4x up to 8GB and EMMC up to 128GB ƒ Support 12~24V wide voltage range and -40~85°C operating temperature ƒ 2x GbE LAN, 2x USB3.2, 2x RS-232/422/485, I2C ƒ M.2 E-Key and B-Key for SATA storage, option to support RS-232 module ƒ Support iManag

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Intel® 10th Gen Core™ processor,LGA1200 Mini-ITX motherboard

Features ƒ Supports Intel® 10th Gen Core™ i processor (LGA1200) with Intel Q470E/ H420E chipset ƒ Two 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAM ƒ Supports displays of HDMI2.0a/DP1.2/VGA/LVDs (or eDP) ƒ Supports 1 M.2 M key & 1 M.2 E key ƒ Supports 4 USB3.2 Gen2 & 4 USB3.2 Gen1, and 3 SA

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Intel® Atom™ E3940 QC SoC with 4K Dual HDMI/Dual LAN/M.2 DIN-Rail Fanless Box PC

Features ƒ Intel® Atom™ E3940 Quad Core SoC turbo burst up to 1.8 GHz ƒ DIN-Rail system with essential I/O ports on front-side bezel ƒ 2 x Intel GbE and 4 x USB 3.0 ƒ Dual HDMI display up to 4K resolution ƒ 1 x full-size mPCIe with SIM holder and 1 x M.2 2230 for WIFI #1 ƒ 1 x 2.5 SATA III S

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Intel® Atom™ E3940 QC SoC with 4K Dual HDMI/Dual LAN/M.2 DIN-Rail Fanless Box PC

Features ƒ Intel® Atom™ E3940 Quad Core SoC turbo burst up to 1.8 GHz ƒ DIN-Rail system with essential I/O ports on front-side bezel ƒ 2 x Intel GbE and 4 x USB 3.0 ƒ Dual HDMI display up to 4K resolution ƒ 1 x full-size mPCIe with SIM holder and 1 x M.2 2230 for WIFI #1 ƒ 1 x 2.5 SATA III S

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Intel 8th Gen U Series CORE i3/i5/i7 CPU,eDP (LVDS), 2 HDMI, 2 LAN, 2 USB3.2 Gen2 x1, 4 COM (RS-232/422/485),M.2 E-Key, M.2 B-Key, M.2 M-Key NVMe

Features ƒ Intel® 8th Gen Core™ i3-8145UE / i5-8365UE / i7-8665UE/CELERON 4305UE ƒ Supports 1 x DDR4-2400 SO-DIMM ƒ Supports 1 x eDP (LVDS co-lay), 2 x HDMI, 3 Independent Displays ƒ Supports 2 x LAN, 2 x USB3.2 Gen2 x1 Type-A Ports, 4 COM Ports (RS-232/422/485, selected via BIOS) ƒ Support

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Intel® Atom® x6000E series and Intel Celeron N and J series 3.5 SBC

Features ƒ Atom® x6000E series and Intel® Celeron® J and N series with Quad/Dual Cores, TDP 6W/ 10W/ 12W ƒ Single Channel DDR4-3200 up to 32GB ƒ 3 independent displays via LVDS, DP1.4, and HDMI2.0 up to 4K@60Hz ƒ Dual GbE, 6 USB, 6 UART, TPM2.0 ƒ CE/FCC Class B, Coastline I/O ESD 8KV/15KV Cr

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9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

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AMD V-series mini-ITX with 2HDMI/2DP/8USB/6COM/2Gb/2M.2

Features ƒ Support AMD V2000 processor ƒ Two 260-pin SO-DIMM up to 64GB DDR4 3200 SDRAM ƒ Support multi display, Max up to 4 displays ƒ Supports 1 PCIe x8, 1 E-Key 2230 M.2 slot, 1 M-Key 2242/2280 M.2 slot ƒ 6COM, 4 USB3.2 Gen2, 2 USB3.2 Gen1, 2 USB2.0, 2 SATA, 16bit GPIO ƒ Support SUSI, WIS

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8th Generation Intel® Core™ i3/i5/Celeron - on SDM Player with Triple 4K Output

Features ƒ Intel SDM-L (Smart Display Module - Large) form factor ƒ 8th Intel® Core™ i3-8100H, i5-8400H processor, 9th Intel® Core™ Celeron G4930E ƒ Dual channel DDR4-2400/2666 SO-DIMM, up to 32 GB ƒ 3 independent displays: Golden Finger (HDMI 2.0, DP1.2), Front Bracket (mini DP++) ƒ Suppor

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Intel® Xeon® W10th Gen Core™(Comet Lake-S) i9/i7/i5/i3 LGA1200,MicroATX with 2 DP/VGA/eDP/6 COM,2 10GbE LANs, 2 GbE LANs, 4 USB 3.2Gen2, 6 USB 3.2 Gen 1

Features ƒ Supports Intel® Xeon® W10th Gen Core™ (Comet Lake-S) i9/i7/i5/i3 processor with W480E/ Q470E/ H420E chipset ƒ Supports triple displays. (2DP++, eDP, VGA display) ƒ Supports Intel AMT 12.0 and Intel vPro competent ƒ Supports PCIe Gen3, max up to 4x USB 3.2 Gen2, 6x USB 3.2 Gen1, 6x

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Intel Atom x6413E QC SoC with HDMI and DP/Dual LAN/Dual COM DIN-Rail Fan-less Box PC

Features ƒ Intel Atom x6413E Quad Core SoC turbo burst up to 3.00 GHz ƒ DIN-Rail system with essential I/O ports on front-side bezel ƒ 2 x Intel GbE and 2 x RS-232/422/485 ƒ Dual independent displays with one 4K HDMI and one 4K DP ƒ 1 x M.2 2280 B key with nano SIM holder and 1 x M.2 2230 E k

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Intel® 11th gen Core™ i processor with Triple LAN/ Quadruple COM Din-Rail Fanless Box PC

Features ƒ Intel 11th gen. Core i5/i3 ƒ DIN-Rail system with essential I/O ports on front-side bezel ƒ 3 x Intel GbE, 4x RS-232/422/485, 8-bit DIO, optional CANBus ƒ 3 Expansions: M.2 E-Key 2230, M.2 B-Key 2280, 1 x Full-size mSATA share with mPCIe slot ƒ Dual independent displays with one 4

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Intel® 8th 9th Gen Core™ i7/i5/i3 LGA1151 MicroATX with VGA/DP/DVI-D/ eDP(LVDS), 14 COM, 8 USB 3.0,12 USB 2.0, Dual LAN

Features ƒ Supports Intel® 8th/9th Gen Core i7/i5/i3 processor with H310 chipset ƒ Supports up to 14 COM, 8 USB 3.0, 12 USB 2.0, TPM 1.2/2.0 (optional) ƒ Supports Dual display of VGA, DP, DVI, eDP, LVDS (optional) and two GbE LAN ƒ Two DIMM sockets support up to 64 GB DDR4 2666 MHz SDRAM ƒ S

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Intel Pentium , Celeron & Atom Mini-ITX with HDMI/DP/eDP or LVDS, 6 COM, and Dual LAN

Features ƒ Supports Intel Pentium, Celeron, Atom, Quad Core & Dual Core processor ƒ Two 260-pin SO-DIMM up to 32 GB DDR4 3200 MHz SDRAM ƒ Supports DP++ 1.2/HDMI 1.4b/eDP (optional)/LVDS(optional) ƒ Supports 1 PCIE x1 or 2 M.2 (B+E key), 6 COMs(4 COM optional), 3 USB 3.2 Gen2, and 5 USB 2.0 ƒ

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Intel® Core™ i7/i5/i3 LGA 1151 Mini-ITX with DP/HDMI/VGA, 2 COM, Dual LAN,PCIe x4, miniPCIe, DDR4, DC Input

Features ƒ Supports Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel H110 chipset ƒ Two 260-pin SO-DIMM up to 32GB DDR4 2400/2133 MHz SDRAM ƒ Supports Dual display of DP/HDMI/VGA ƒ Supports PCIe x4 (Gen 3), 1 F/S miniPCIe and 1 H/S miniPCIe ƒ Support 12V DC Input and low profile h

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Intel® Celeron J1900 & Atom™ E3825/ E3845, 3.5 SBC

Features ƒ Intel® Celeron J1900 & Atom™ E3825/E3845, DDR3L-1333MHz 2/4GB on board ƒ DirectX11, OpenGL3.2, OpenCL1.2, Dual display: HDMI, VGA, LVDS ƒ CPU bottom up design for system integration and rugged design for variable automation factory environments ƒ 3 Intel i210 GbE, rich I/O: 4COM,

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6th Gen Intel Core i7-6822EQ QC/i5-6442EQ QC Rugged FullHD NVR

Features ƒƒ Intel i7-6822EQ QC/ Intel i5-6442EQ QC SoC ƒƒ Support TPM2.0 ƒƒ Extreme graphic performance, support up to 1080p 120fps video encode&decode ƒƒ Stackable extension design, option extension kit for applications ƒƒ Isolated 12 ~ 24VDC wide-range power input ƒƒ Diversity communicati

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Outdoor NVR w/4 PoE Ports Intel Atom E3845 SoC Fanless Box PC

Features ƒ Intel® Atom E3845 Quad Core 1.91 GHz SoC ƒ 4 PoE Ports to Support Mainstream IP Cameras ƒ 3KV isolation for 6 x Di & 2 x Do ƒ Diversity Communication Abilities, ex. WWAN, WLAN ƒ 9 ~ 36 VDC* Wide Power Input w/isolation ƒ 1 x Removable 2.5 drive bay ƒ Supports iManager, SUSIAccess

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Micro Computer with Intel® Core™ i7/i5/i3 Processor, Intel® H110 Chipset, 2 x Expansion Slots, and 250W 80PLUS PSU

Features ƒ Intel® 6th/7th Gen Core™ i7/i5/i3/Celeron® processer with Intel® H110 chipset ƒ 1 x PCIe x16 and 1 x PCIe x4(1 x PCI for AIMC-3202-01) expansion slots ƒ Compact design with front-accessible I/O ƒ 1 x VGA+DVI-D, 2 x GbE LAN, 3 x USB 3.0, 2 x COM ƒ 2 x 2.5 internal, shock-resistant S

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Intel® Core™ i7/i5/i3 LGA 1151 Mini-ITX with VGA/DP/DVI-D/LVDS(eDP), 8 COM, Dual LAN, PCIe x16, M.2, DDR4

Features ƒ Supports Intel® 7th Gen Core™ & 6th Gen Core™ i processor /Pentium / Celeron (LGA1151) with Intel H110 chipset ƒ Two 260-pin SO-DIMM up to 32GB DDR4 2400/2133 MHz SDRAM ƒ Supports Dual display configuration by multiple interface: DP/DVI-D/VGA/ LVDS(eDP) ƒ Supports DirectX 12, Open

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Compact Industrial Computer System with 6th/7th Gen Intel® Core™ i CPU Socket (LGA 1151)

Features ƒ Intel® 6th/7th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q170/ H110 chipset ƒ 3 x independent displays (third display output (DP) via optional cable) ƒ 2 x GigaLan and 6 x USB3.0 (Q170)/ 4 x USB3.0 (H110) ƒ 2 x RS-232/422/485 and 2 x RS232 serial ports ƒ 2 x 2.5 HDD/SSD, a

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Compact Industrial Computer System with 6th/7th Gen Intel® Core™ i CPU Socket (LGA 1151)

Features ƒ Intel® 6th/7th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q170/ H110 chipset ƒ 3 x independent displays (third display output (DP) via optional cable) ƒ 2 x GigaLan and 6 x USB3.0 (Q170)/ 4 x USB3.0 (H110) ƒ 2 x RS-232/422/485 and 2 x RS232 serial ports ƒ 2 x 2.5 HDD/SSD, a

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In-Vehicle Full HD NVR w/4 PoE Ports 6th Gen. Intel® Core i7 6600U / Core i5 6300U SoC Fanless Box PC

Features ƒ Intel® Core i7-6600U 2.6GHz / Core i5-6300U 2.4GHz SoC ƒ 4 PoE Ports to Support Mainstream IP Cameras ƒ Diversity Communication Abilities, ex. WWAN, WLAN ƒ Intelligent Vehicle Power Ignition ƒ 12/24VDC with E-Mark certification ƒ 1 x Removable 2.5 drive bay ƒ Advantech DeviceOn b

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15 Ubiquitous Service Computer with Intel® Celeron 3955U or 3965U / Core i3-6100U or i3-7100U / i5-6300U or i5-7300U

Features ƒ Equipped with DeviceOn / iService software for remote device management ƒ 15 TFT LCD (LED backlight) with PCAP Touch ƒ Built in Intel® Celeron 3955U or 3965U / Core i3-6100U or i3-7100U / i5-6300U or i5-7300U ƒ Innovation LEGO stand design enable adaptable configurations ƒ Stylish

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Intel Pentium , Celeron & Atom Mini-ITX with HDMI/DP/eDP or LVDS, 6 COM, and Dual LAN

Features ƒ Supports Intel Pentium, Celeron, Atom, Quad Core & Dual Core processor ƒ Two 260-pin SO-DIMM up to 32 GB DDR4 3200 MHz SDRAM ƒ Supports DP++ 1.2/HDMI 1.4b/eDP (optional)/LVDS(optional) ƒ Supports 1 PCIE x1 or 2 M.2 (B+E key), 6 COMs(4 COM optional), 3 USB 3.2 Gen2, and 5 USB 2.0 ƒ

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LGA1700 12th Generation Intel® Core™ i9/i7/i5/i3/Pentium® System Host Board with DDR5, SATA 3.0, USB 3.2, Dual 2.5GbE, and Triple Displays

Features ƒ Intel® Core™ i9/i7/i5/i3/Pentium LGA1700 processor with H610E chipset ƒ Up to 64 GB of dual-channel (Non-ECC) DDR5 4800 MHz ƒ PCIe 3.0, USB 3.2, SATA 3.0, and Dual 2.5GbE LAN ƒ Supports VGA and 2 x DVI-D/DP/HDMI display (with optional cable) ƒ Supports Advantech’s TPM and COM modul

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LGA1700 12th Generation Intel® Core™ i9/i7/i5/i3/Pentium® System Host Board with DDR5, SATA 3.0, USB 3.2, M.2, Dual 2.5GbE, and Triple Displays

Features ƒ Intel® Core™ i9/i7/i5/i3/Pentium LGA1700 processor with R680E chipset ƒ Up to 64 GB of dual-channel (ECC/ non-ECC) DDR5 4800 MHz ƒ PCIe 3.0, M.2, USB 3.2, SATA 3.0, Dual 2.5GbE LAN and SW Raid 0, 1, 5, 10 ƒ Supports VGA and 2 x DVI-D/DP/HDMI display (with optional cable) ƒ Supports

ADVANTECH

研华科技

Intel Pentium , Celeron & Atom Mini-ITX with HDMI/DP/eDP or LVDS, 6 COM, and Dual LAN

Features ƒ Supports Intel Pentium, Celeron, Atom, Quad Core & Dual Core processor ƒ Two 260-pin SO-DIMM up to 32 GB DDR4 3200 MHz SDRAM ƒ Supports DP++ 1.2/HDMI 1.4b/eDP (optional)/LVDS(optional) ƒ Supports 1 PCIE x1 or 2 M.2 (B+E key), 6 COMs(4 COM optional), 3 USB 3.2 Gen2, and 5 USB 2.0 ƒ

ADVANTECH

研华科技

LGA1700 12th Generation Intel® Core™ i9/i7/i5/i3/Pentium® System Host Board with DDR5, SATA 3.0, USB 3.2, Dual 2.5GbE, and Triple Displays

Features ƒ Intel® Core™ i9/i7/i5/i3/Pentium LGA1700 processor with H610E chipset ƒ Up to 64 GB of dual-channel (Non-ECC) DDR5 4800 MHz ƒ PCIe 3.0, USB 3.2, SATA 3.0, and Dual 2.5GbE LAN ƒ Supports VGA and 2 x DVI-D/DP/HDMI display (with optional cable) ƒ Supports Advantech’s TPM and COM modul

ADVANTECH

研华科技

LGA1700 12th Generation Intel® Core™ i9/i7/i5/i3/Pentium® System Host Board with DDR5, SATA 3.0, USB 3.2, M.2, Dual 2.5GbE, and Triple Displays

Features ƒ Intel® Core™ i9/i7/i5/i3/Pentium LGA1700 processor with R680E chipset ƒ Up to 64 GB of dual-channel (ECC/ non-ECC) DDR5 4800 MHz ƒ PCIe 3.0, M.2, USB 3.2, SATA 3.0, Dual 2.5GbE LAN and SW Raid 0, 1, 5, 10 ƒ Supports VGA and 2 x DVI-D/DP/HDMI display (with optional cable) ƒ Supports

ADVANTECH

研华科技

Intel Pentium , Celeron & Atom Mini-ITX with HDMI/DP/eDP or LVDS, 6 COM, and Dual LAN

Features ƒ Supports Intel Pentium, Celeron, Atom, Quad Core & Dual Core processor ƒ Two 260-pin SO-DIMM up to 32 GB DDR4 3200 MHz SDRAM ƒ Supports DP++ 1.2/HDMI 1.4b/eDP (optional)/LVDS(optional) ƒ Supports 1 PCIE x1 or 2 M.2 (B+E key), 6 COMs(4 COM optional), 3 USB 3.2 Gen2, and 5 USB 2.0 ƒ

ADVANTECH

研华科技

LGA1700 12th Generation Intel® Core™ i9/i7/i5/i3/Pentium® System Host Board with DDR5, SATA 3.0, USB 3.2, Dual 2.5GbE, and Triple Displays

Features ƒ Intel® Core™ i9/i7/i5/i3/Pentium LGA1700 processor with H610E chipset ƒ Up to 64 GB of dual-channel (Non-ECC) DDR5 4800 MHz ƒ PCIe 3.0, USB 3.2, SATA 3.0, and Dual 2.5GbE LAN ƒ Supports VGA and 2 x DVI-D/DP/HDMI display (with optional cable) ƒ Supports Advantech’s TPM and COM modul

ADVANTECH

研华科技

LGA1700 12th Generation Intel® Core™ i9/i7/i5/i3/Pentium® System Host Board with DDR5, SATA 3.0, USB 3.2, M.2, Dual 2.5GbE, and Triple Displays

Features ƒ Intel® Core™ i9/i7/i5/i3/Pentium LGA1700 processor with R680E chipset ƒ Up to 64 GB of dual-channel (ECC/ non-ECC) DDR5 4800 MHz ƒ PCIe 3.0, M.2, USB 3.2, SATA 3.0, Dual 2.5GbE LAN and SW Raid 0, 1, 5, 10 ƒ Supports VGA and 2 x DVI-D/DP/HDMI display (with optional cable) ƒ Supports

ADVANTECH

研华科技

Intel Atom platform with Dual GbE LAN Fanless Compact Box

Features ƒ Intel® Apollo Lake E3900 series & N series Processor ƒ Palm-size form factor: 128 (L) x 152 (W) x 37 mm(H) ƒ Supports 2 x COM port, 1 x HDMI, 1 x Display Port, 2 x USB3.0, TPM 2.0 and DCIN 12~24V ƒ Built-in 1 x M.2 2230 slot, 1 x Half size Mini PCIe expansion slot and 1 x Full siz

ADVANTECH

研华科技

Outdoor NVR w/4 PoE Ports Intel Atom E3845 SoC Fanless Box PC

Features ƒ Intel® Atom E3845 Quad Core 1.91 GHz SoC ƒ 4 PoE Ports to Support Mainstream IP Cameras ƒ 3KV isolation for 6 x Di & 2 x Do ƒ Diversity Communication Abilities, ex. WWAN, WLAN ƒ 9 ~ 36 VDC* Wide Power Input w/isolation ƒ 1 x Removable 2.5 drive bay ƒ Supports iManager, SUSIAccess

ADVANTECH

研华科技

更新时间:2025-9-25 18:49:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
I-PEX
18+
SMD
2839
一级代理,专注军工、汽车、医疗、工业、新能源、电力
三年内
1983
只做原装正品
ON/安森美
23+
QFP
5966
原厂授权代理,海外优势订货渠道。可提供大量库存,详
I-PEX
21+
SMD
2839
原装现货假一赔十
I-PEX
23+
SMD
5339
原厂原装正品
I-PEX/第一精工
2450+
CONN
6540
只做原装正品假一赔十为客户做到零风险!!
HIROSE/广濑
2508+
/
473077
一级代理,原装现货
AMP
N/A
30
TE/泰科
2407+
30098
全新原装!仓库现货,大胆开价!
TE
502
全新原装 货期两周

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