AT9228Assembly

Description SquareDeepRecessedAssembly9.6W/mIP20LEDStripanddriver/4000K/90CRI/2M

Präsenzmelder&BewegungsmelderDeckenmontageinnen

Funktionsbeschreibung -Passiv-Infrarot-PräsenzmelderfürDeckenmontageUP -QuadratischerErfassungsbereich360°,7x7m,(49m2)bei3mMontagehöhe -1KanalLicht(Relais230V) -Automatischepräsenz-undhelligkeitsabhängigeSteuerungfürBeleuchtung -MischlichtmessungfürFluoreszenz

Präsenzmelder&BewegungsmelderDeckenmontageinnen

Funktionsbeschreibung -Passiv-Infrarot-PräsenzmelderfürDeckenmontageUP -QuadratischerErfassungsbereich360°,7x7m,(49m2)bei3mMontagehöhe -1KanalLicht(Relais230V) -Automatischepräsenz-undhelligkeitsabhängigeSteuerungfürBeleuchtung -MischlichtmessungfürFluoreszenz

PresenceandmotiondetectorsCeilinginstallationindoor

Description -Passiveinfra-redpresencedetectorforflush-mountedceilinginstallation -Squaredetectionarea360°,7x7m,(49m2)atmountingheight3m -1channellight(Relay,230V) -Automaticpresence-andbrightness-dependentcontrolforlighting -Mixedlightmeasurementsuitabl

Präsenzmelder&BewegungsmelderDeckenmontageinnen

Funktionsbeschreibung -Passiv-Infrarot-PräsenzmelderfürDeckenmontageUP -QuadratischerErfassungsbereich360°,7x7m,(49m2)bei3mMontagehöhe -1KanalLicht(Relais230V)und1KanalPräsenz(RelaispotenzialfreifürHKLSteuerung) -Automatischepräsenz-undhelligkeitsabhängigeS

PresenceandmotiondetectorsCeilinginstallationindoor

Description -Passiveinfra-redpresencedetectorforflush-mountedceilinginstallation -Squaredetectionarea360°,7x7m,(49m2)atmountingheight3m -1channellight(Relay,230V)and1channelpresence(Relay,floatingforHVACcontrol) -Automaticpresence-andbrightness-depende

Präsenzmelder&BewegungsmelderDeckenmontageinnen

Funktionsbeschreibung -Passiv-Infrarot-PräsenzmelderfürDeckenmontageUP -QuadratischerErfassungsbereich360° -Slave-VersionfürthePrema-MasterPräsenzmelder -DurchwerkseitigeVoreinstellungsofortbetriebsbereit -TestbetriebzurÜberprüfungvonFunktionundErfassungsbereich -Erwe

Präsenzmelder&BewegungsmelderDeckenmontageinnen

Funktionsbeschreibung -Passiv-Infrarot-PräsenzmelderfürDeckenmontageUP -QuadratischerErfassungsbereich360° -Slave-VersionfürthePrema-MasterPräsenzmelder -DurchwerkseitigeVoreinstellungsofortbetriebsbereit -TestbetriebzurÜberprüfungvonFunktionundErfassungsbereich -Erwe

PresenceandmotiondetectorsCeilinginstallationindoor

Description -Passiveinfra-redpresencedetectorforflush-mountedceilinginstallation -Squaredetectionarea360° -SlaveversionforthePremamasterpresencedetectors -Readyforimmediateuseduetofactorypreset -Testmodeforcheckingfunctionanddetectionarea -Extensionofdet

Simplifyingthemulti-cloudwithadomainfocusapplication

Features ƒHigh-performanceedgecloudserverwithIntel®10thGen.Xeon®Wand Core™i3/i7processor ƒAvailablewithopenandstandardstructure:Kubernetes(MicroK8S)built-in, multipleDBconnections,andon-demandmicro-services ƒIntegratedIoTsoftwareforprivateclouddeployment,pla

9th/8thGen.IntelXeon/Core™Processor,3.5SBCw/MIOe

Features ƒ9th/8thGen.Intel®Xeon®/Core™Processor,upto6cores,andTDP45W/25W ƒDualchannelDDR4-2400,upto64GB*,ECCforXeonSKU ƒTriplesimultaneousdisplayswith48-bitLVDS+HDMI+DP ƒUSB3.1Gen2(10Gbps),TPM2.0&NVMe/PCIeGen3x4SSD ƒDualGbE,SATAIII,RS-232/422/485,CA

IntelAtomE3900seriesEmbeddedSBCFanlessSlimSystem

Features ƒIntel®Atom™E3900series ƒOnboard4GBLPDDR4-2400MT/s,32GBeMMC ƒIndependentdisplaybyHDMI ƒSemi-IndustryFanlessslimsysten,DinRailorWallmountdesign ƒSupportHDMIx1,GbEx2USB3.0x2,COMx2,DIOx2 ƒFlexibleexpansionM.2Ekey,F/SminiPCIe ƒ12Vpower

8thGen.Intel®CoreProcessorSoCMultipleI/OsFanlessEmbeddedSystem

Features ƒ8thGen.IntelCorei7-8665UE/i5-8365UEQuadCore ƒDualDisplayHDMI+DP,upto4K2K ƒ4xGbE,8xUSB3.0/2.0,4xUART,2xCANBus ƒ4Expansion:M.2E-Key2230,M-Key2280,B-Key3042,F/SmPCIe ƒDC-in12V,WallMount&DINRail ƒiManager3.0&SWAPIs,WISE-PaaS/DeviceOn

11thGen.Intel®Core™i7/i5/i3/CeleronU-Series3.5SBCw/MIOe

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W/28W ƒDualChannelDDR4-3200upto64GB ƒ4simultaneousdisplays:LVDS/HDMI/DP/USBType-C,eDP(optional) ƒ2GbE,4USB3.2,CANBus,DC-in12-24V ƒExpansion:M.2E-Key/B-Key/M-Key(supportsNVMe),MIOe ƒSupportsi

Intel8thGenUSeriesPalm-sizedFanlessSystem

Features ƒEquippowerful8th-GenIntel®Core™iprocessor ƒPalm-sizedchassisdesign(180x116.7x66mm) ƒDiversesystemI/O:4xCOM,4xUSB,2xHDMI,2xGbELAN,16-bitGPIO ƒ3xM.2expansionslots(1x2230E-key,1x2242/3042B-Key,1x2280 M-key)foredgeAIcapability ƒWin1

IntelAtomplatformwithDualGbELANFanlessCompactBox

Features ƒIntel®ApolloLakeE3900series&NseriesProcessor ƒPalm-sizeformfactor:128(L)x152(W)x37mm(H) ƒSupports2xCOMport,1xHDMI,1xDisplayPort,2xUSB3.0,TPM2.0 andDCIN12~24V ƒBuilt-in1xM.22230slot,1xHalfsizeMiniPCIeexpansionslotand1xFull siz

Intel®Atom™E3950/E3930DC1.6/1.3GHzUTXIndustrialMotherboardwithHDMI/eDP(LVDS)/DP,2COMsandDualLAN

Features ƒSupportsIntel®Atom™Quad/DualcoreE3950/E39301.6/1.3GHz processor ƒSingle204-pinSO-DIMMupto8GBDDR3L1866MHzSDRAM ƒSupportsHDMI/DP++,eDP(co-laydual-channel48-bitLVDS) ƒSupports1Mini-PCIEexpansionslot,M.2E-Keyslot,2COMs (RS-232,RS-422/485),4USB3

Intel®Atom™E3950QC1.6GHzUTXIndustrialMotherboardwithHDMI/eDP(LVDS)/DP,4COMsand3LANs

Features ƒSupportsIntel®Atom™QuadcoreE3950upto2.0GHzprocessor ƒSingle204-pinSO-DIMMupto8GBDDR3L1866MHzSDRAM ƒSupportsHDMI/DP++,eDP(co-laydual-channel48-bitLVDS) ƒSupports1Mini-PCIEexpansionslot,M.2E-Keyslot,4COMs (2xRS-232,2xRS-232or422or485),4U

IntelAtomPlatformPalmSizeFanlesssystem

Features ƒIntel®AtomQuadCore/DualCoreProcessor ƒPalm-sizeformfactor:170(L)x117(W)x52.6mm(H) ƒSupports2xLAN,2xCOMport,1xHDMI,1xDisplayPort,4xUSB3.0, CANBus,andDCIN12~24V ƒBuilt-in1xM.2expansionslot(PCIeGen2,USB2.0co-lay),1xFullsize MiniPC

IntelAtomPlatformPalmSizeFanlesssystem

Features ƒIntel®ApolloLakeE3900seriesProcessor ƒPalm-sizeformfactor:170X117X52.6mm ƒSupports3xLAN,4xCOMport,1xHDMI,1xDisplayPort,4xUSB3.0, CANBus,16bitGPIO,Audioin/outandDCIN12~24V ƒBuilt-in1xM.2expansionslot(PCIeGen2,USB2.0co-lay),1xFull

AMDEmbeddedRyzenV2000COMExpress®CompactType6

Features ƒAMDEmbeddedRyzen7nmSoC–V2000APU ƒCOMExpress®R3.0CompactModuleType6Pinout ƒDualChannelDDR4SODIMM,max.64GB(BothECC&Non-ECC) ƒHighSpeedI/Os:2USB3.2Gen2,1PCIex8Gen3,8PCIex1Gen3,and 2SATA3.0 ƒFourDisplay(DP++,HDMI,VGA,LVDS) ƒSupportsiM

11thGen.Intel®Core™i7/i5/i3/CeleronU-seriesPico-ITXSBC

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W ƒOn-boardLPDDR4x-4267upto32GwithIBECCforIndustrialSku ƒDualindependentdisplay:eDP/MIPI-DSI,DPupto8K ƒ2GbE,2USB3.2,COMPort,SMBus/I2C ƒExpansion:M.2E-Key,M.2B-Key/M-KeyNVMex2 ƒSupportsi

Intel®Xeon®/Core™i3/i5/i7LGA1151PowerfulEdgeInferenceSystem

Features ƒIntel®Xeon®/6th&7thGen.Core™i3/i5/i7upto65WCPU ƒDualindependentdisplay:VGA+HDMI ƒDualChannelDDR4SO-DIMMmemoryupto32GB ƒ850Wpowersupplybuilt-in ƒPCIex16Graphicscardsupportupto260W ƒTwoswappable2.5harddrivebay

CompactFanlessSystemwith10thGenIntel®Xeon®/Core™iCPUSocket(LGA1200)

Features ƒIntel®10thGenXeon®/Core™iCPUsocket-type(LGA1200)withIntel® W480E/H420Echipset ƒWideoperatingtemperature(-10~60°C) ƒVGAandHDMIoutput ƒ2xGigaLAN,2xUSB3.2(Gen2)and6xUSB3.2(Gen1) ƒ2xRS-232/422/485and4xRS232serialports(Optional) ƒ1x2.5H

EdgeIntelligenceSystemwithIntel11thgenerationwithEdgeXAPIandWISE-DeviceOn

Features ƒIntel11thgen.Corei5/i3/Celeron ƒPre-integratedEdgeXwithdataacquisitionAPI ƒPre-integratedWISE-DeviceOnfordevicemanagementandremotecontrol ƒ8/16GBDDR4MemoryBuilt-in ƒ64GBSATASlimSSDBuilt-in ƒCompact156x112x60mmdimensions ƒ4KHDMIandDP1.4aD

Intel®Atom®x6000SeriesProcessor(CodeName:ElkhartLake)Pico-ITXSBC

Features ƒIntelAtomx6000ESeries ƒOnboardLPDDR4xupto8GBandEMMCupto128GB ƒSupport12~24Vwidevoltagerangeand-40~85°Coperatingtemperature ƒ2xGbELAN,2xUSB3.2,2xRS-232/422/485,I2C ƒM.2E-KeyandB-KeyforSATAstorage,optiontosupportRS-232module ƒSupportiManag

Intel®10thGenCore™processor,LGA1200Mini-ITXmotherboard

Features ƒSupportsIntel®10thGenCore™iprocessor(LGA1200)withIntelQ470E/ H420Echipset ƒTwo260-pinSO-DIMMupto64GBDDR42933MHzSDRAM ƒSupportsdisplaysofHDMI2.0a/DP1.2/VGA/LVDs(oreDP) ƒSupports1M.2Mkey&1M.2Ekey ƒSupports4USB3.2Gen2&4USB3.2Gen1,and3SA

Intel®Atom™E3940QCSoCwith4KDualHDMI/DualLAN/M.2DIN-RailFanlessBoxPC

Features ƒIntel®Atom™E3940QuadCoreSoCturboburstupto1.8GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIntelGbEand4xUSB3.0 ƒDualHDMIdisplayupto4Kresolution ƒ1xfull-sizemPCIewithSIMholderand1xM.22230forWIFI#1 ƒ1x2.5SATAIIIS

Intel®Atom™E3940QCSoCwith4KDualHDMI/DualLAN/M.2DIN-RailFanlessBoxPC

Features ƒIntel®Atom™E3940QuadCoreSoCturboburstupto1.8GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIntelGbEand4xUSB3.0 ƒDualHDMIdisplayupto4Kresolution ƒ1xfull-sizemPCIewithSIMholderand1xM.22230forWIFI#1 ƒ1x2.5SATAIIIS

Intel8thGenUSeriesCOREi3/i5/i7CPU,eDP(LVDS),2HDMI,2LAN,2USB3.2Gen2x1,4COM(RS-232/422/485),M.2E-Key,M.2B-Key,M.2M-KeyNVMe

Features ƒIntel®8thGenCore™i3-8145UE/i5-8365UE/i7-8665UE/CELERON 4305UE ƒSupports1xDDR4-2400SO-DIMM ƒSupports1xeDP(LVDSco-lay),2xHDMI,3IndependentDisplays ƒSupports2xLAN,2xUSB3.2Gen2x1Type-APorts,4COMPorts (RS-232/422/485,selectedviaBIOS) ƒSupport

Intel®Atom®x6000EseriesandIntelCeleronNandJseries3.5SBC

Features ƒAtom®x6000EseriesandIntel®Celeron®JandNserieswithQuad/Dual Cores,TDP6W/10W/12W ƒSingleChannelDDR4-3200upto32GB ƒ3independentdisplaysviaLVDS,DP1.4,andHDMI2.0upto4K@60Hz ƒDualGbE,6USB,6UART,TPM2.0 ƒCE/FCCClassB,CoastlineI/OESD8KV/15KVCr

9th/8thGenIntel®Xeon®/Core™ProcessorsCOMExpressBasicModuleType6

Features ƒIntel9th/8thGenXeon®/Core™Hexa/QuadCores+PCHQM370/CM246 ƒDualchannelDDR4,Max96GB(ECCoptional) ƒHighSpeedI/O:4USB3.1(Gen2),8PCIex1(Gen3),4SATA(Gen3) ƒThreeIndependentSymmertricalDisplays(Upto4K) ƒSupportsiManager,WISE-Device-On,EmbeddedSoftware

AMDV-seriesmini-ITXwith2HDMI/2DP/8USB/6COM/2Gb/2M.2

Features ƒSupportAMDV2000processor ƒTwo260-pinSO-DIMMupto64GBDDR43200SDRAM ƒSupportmultidisplay,Maxupto4displays ƒSupports1PCIex8,1E-Key2230M.2slot,1M-Key2242/2280M.2slot ƒ6COM,4USB3.2Gen2,2USB3.2Gen1,2USB2.0,2SATA,16bitGPIO ƒSupportSUSI,WIS

8thGenerationIntel®Core™i3/i5/Celeron-onSDMPlayerwithTriple4KOutput

Features ƒIntelSDM-L(SmartDisplayModule-Large)formfactor ƒ8thIntel®Core™i3-8100H,i5-8400Hprocessor,9thIntel®Core™Celeron G4930E ƒDualchannelDDR4-2400/2666SO-DIMM,upto32GB ƒ3independentdisplays:GoldenFinger(HDMI2.0,DP1.2),FrontBracket (miniDP++) ƒSuppor

Intel®Xeon®W10thGenCore™(CometLake-S)i9/i7/i5/i3LGA1200,MicroATXwith2DP/VGA/eDP/6COM,210GbELANs,2GbELANs,4USB3.2Gen2,6USB3.2Gen1

Features ƒSupportsIntel®Xeon®W10thGenCore™(CometLake-S)i9/i7/i5/i3 processorwithW480E/Q470E/H420Echipset ƒSupportstripledisplays.(2DP++,eDP,VGAdisplay) ƒSupportsIntelAMT12.0andIntelvProcompetent ƒSupportsPCIeGen3,maxupto4xUSB3.2Gen2,6xUSB3.2Gen1, 6x

IntelAtomx6413EQCSoCwithHDMIandDP/DualLAN/DualCOMDIN-RailFan-lessBoxPC

Features ƒIntelAtomx6413EQuadCoreSoCturboburstupto3.00GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIntelGbEand2xRS-232/422/485 ƒDualindependentdisplayswithone4KHDMIandone4KDP ƒ1xM.22280BkeywithnanoSIMholderand1xM.22230Ek

Intel®11thgenCore™iprocessorwithTripleLAN/QuadrupleCOMDin-RailFanlessBoxPC

Features ƒIntel11thgen.Corei5/i3 ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ3xIntelGbE,4xRS-232/422/485,8-bitDIO,optionalCANBus ƒ3Expansions:M.2E-Key2230,M.2B-Key2280,1xFull-sizemSATAshare withmPCIeslot ƒDualindependentdisplayswithone4

Intel®8th9thGenCore™i7/i5/i3LGA1151MicroATXwithVGA/DP/DVI-D/eDP(LVDS),14COM,8USB3.0,12USB2.0,DualLAN

Features ƒSupportsIntel®8th/9thGenCorei7/i5/i3processorwithH310chipset ƒSupportsupto14COM,8USB3.0,12USB2.0,TPM1.2/2.0(optional) ƒSupportsDualdisplayofVGA,DP,DVI,eDP,LVDS(optional)andtwoGbE LAN ƒTwoDIMMsocketssupportupto64GBDDR42666MHzSDRAM ƒS

IntelPentium,Celeron&AtomMini-ITXwithHDMI/DP/eDPorLVDS,6COM,andDualLAN

Features ƒSupportsIntelPentium,Celeron,Atom,QuadCore&DualCoreprocessor ƒTwo260-pinSO-DIMMupto32GBDDR43200MHzSDRAM ƒSupportsDP++1.2/HDMI1.4b/eDP(optional)/LVDS(optional) ƒSupports1PCIEx1or2M.2(B+Ekey),6COMs(4COMoptional), 3USB3.2Gen2,and5USB2.0 ƒ

Intel®Core™i7/i5/i3LGA1151Mini-ITXwithDP/HDMI/VGA,2COM,DualLAN,PCIex4,miniPCIe,DDR4,DCInput

Features ƒSupportsIntel®7th&6thGenCore™iprocessor(LGA1151)withIntelH110 chipset ƒTwo260-pinSO-DIMMupto32GBDDR42400/2133MHzSDRAM ƒSupportsDualdisplayofDP/HDMI/VGA ƒSupportsPCIex4(Gen3),1F/SminiPCIeand1H/SminiPCIe ƒSupport12VDCInputandlowprofileh

Intel®CeleronJ1900&Atom™E3825/E3845,3.5SBC

Features ƒIntel®CeleronJ1900&Atom™E3825/E3845,DDR3L-1333MHz2/4GBon board ƒDirectX11,OpenGL3.2,OpenCL1.2,Dualdisplay:HDMI,VGA,LVDS ƒCPUbottomupdesignforsystemintegrationandruggeddesignforvariable automationfactoryenvironments ƒ3Inteli210GbE,richI/O:4COM,

6thGenIntelCorei7-6822EQQC/i5-6442EQQCRuggedFullHDNVR

Features ƒƒInteli7-6822EQQC/Inteli5-6442EQQCSoC ƒƒSupportTPM2.0 ƒƒExtremegraphicperformance,supportupto1080p120fpsvideo encode&decode ƒƒStackableextensiondesign,optionextensionkitforapplications ƒƒIsolated12~24VDCwide-rangepowerinput ƒƒDiversitycommunicati

OutdoorNVRw/4PoEPortsIntelAtomE3845SoCFanlessBoxPC

Features ƒIntel®AtomE3845QuadCore1.91GHzSoC ƒ4PoEPortstoSupportMainstreamIPCameras ƒ3KVisolationfor6xDi&2xDo ƒDiversityCommunicationAbilities,ex.WWAN,WLAN ƒ9~36VDC*WidePowerInputw/isolation ƒ1xRemovable2.5drivebay ƒSupportsiManager,SUSIAccess

MicroComputerwithIntel®Core™i7/i5/i3Processor,Intel®H110Chipset,2xExpansionSlots,and250W80PLUSPSU

Features ƒIntel®6th/7thGenCore™i7/i5/i3/Celeron®processerwithIntel®H110chipset ƒ1xPCIex16and1xPCIex4(1xPCIforAIMC-3202-01)expansionslots ƒCompactdesignwithfront-accessibleI/O ƒ1xVGA+DVI-D,2xGbELAN,3xUSB3.0,2xCOM ƒ2x2.5internal,shock-resistantS

Intel®Core™i7/i5/i3LGA1151Mini-ITXwithVGA/DP/DVI-D/LVDS(eDP),8COM,DualLAN,PCIex16,M.2,DDR4

Features ƒSupportsIntel®7thGenCore™&6thGenCore™iprocessor/Pentium/ Celeron(LGA1151)withIntelH110chipset ƒTwo260-pinSO-DIMMupto32GBDDR42400/2133MHzSDRAM ƒSupportsDualdisplayconfigurationbymultipleinterface:DP/DVI-D/VGA/ LVDS(eDP) ƒSupportsDirectX12,Open

CompactIndustrialComputerSystemwith6th/7thGenIntel®Core™iCPUSocket(LGA1151)

Features ƒIntel®6th/7thGenCore™iCPUsocket-type(LGA1151)withIntel®Q170/ H110chipset ƒ3xindependentdisplays(thirddisplayoutput(DP)viaoptionalcable) ƒ2xGigaLanand6xUSB3.0(Q170)/4xUSB3.0(H110) ƒ2xRS-232/422/485and2xRS232serialports ƒ2x2.5HDD/SSD,a

CompactIndustrialComputerSystemwith6th/7thGenIntel®Core™iCPUSocket(LGA1151)

Features ƒIntel®6th/7thGenCore™iCPUsocket-type(LGA1151)withIntel®Q170/ H110chipset ƒ3xindependentdisplays(thirddisplayoutput(DP)viaoptionalcable) ƒ2xGigaLanand6xUSB3.0(Q170)/4xUSB3.0(H110) ƒ2xRS-232/422/485and2xRS232serialports ƒ2x2.5HDD/SSD,a

In-VehicleFullHDNVRw/4PoEPorts6thGen.Intel®Corei76600U/Corei56300USoCFanlessBoxPC

Features ƒIntel®Corei7-6600U2.6GHz/Corei5-6300U2.4GHzSoC ƒ4PoEPortstoSupportMainstreamIPCameras ƒDiversityCommunicationAbilities,ex.WWAN,WLAN ƒIntelligentVehiclePowerIgnition ƒ12/24VDCwithE-Markcertification ƒ1xRemovable2.5drivebay ƒAdvantechDeviceOnb

15UbiquitousServiceComputerwithIntel®Celeron3955Uor3965U/Corei3-6100Uori3-7100U/i5-6300Uori5-7300U

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒ15TFTLCD(LEDbacklight)withPCAPTouch ƒBuiltinIntel®Celeron3955Uor3965U/Corei3-6100Uori3-7100U/ i5-6300Uori5-7300U ƒInnovationLEGOstanddesignenableadaptableconfigurations ƒStylish

IntelPentium,Celeron&AtomMini-ITXwithHDMI/DP/eDPorLVDS,6COM,andDualLAN

Features ƒSupportsIntelPentium,Celeron,Atom,QuadCore&DualCoreprocessor ƒTwo260-pinSO-DIMMupto32GBDDR43200MHzSDRAM ƒSupportsDP++1.2/HDMI1.4b/eDP(optional)/LVDS(optional) ƒSupports1PCIEx1or2M.2(B+Ekey),6COMs(4COMoptional), 3USB3.2Gen2,and5USB2.0 ƒ

LGA170012thGenerationIntel®Core™i9/i7/i5/i3/Pentium®SystemHostBoardwithDDR5,SATA3.0,USB3.2,Dual2.5GbE,andTripleDisplays

Features ƒIntel®Core™i9/i7/i5/i3/PentiumLGA1700processorwithH610Echipset ƒUpto64GBofdual-channel(Non-ECC)DDR54800MHz ƒPCIe3.0,USB3.2,SATA3.0,andDual2.5GbELAN ƒSupportsVGAand2xDVI-D/DP/HDMIdisplay(withoptionalcable) ƒSupportsAdvantech’sTPMandCOMmodul

LGA170012thGenerationIntel®Core™i9/i7/i5/i3/Pentium®SystemHostBoardwithDDR5,SATA3.0,USB3.2,M.2,Dual2.5GbE,andTripleDisplays

Features ƒIntel®Core™i9/i7/i5/i3/PentiumLGA1700processorwithR680Echipset ƒUpto64GBofdual-channel(ECC/non-ECC)DDR54800MHz ƒPCIe3.0,M.2,USB3.2,SATA3.0,Dual2.5GbELANandSWRaid0,1,5,10 ƒSupportsVGAand2xDVI-D/DP/HDMIdisplay(withoptionalcable) ƒSupports

IntelPentium,Celeron&AtomMini-ITXwithHDMI/DP/eDPorLVDS,6COM,andDualLAN

Features ƒSupportsIntelPentium,Celeron,Atom,QuadCore&DualCoreprocessor ƒTwo260-pinSO-DIMMupto32GBDDR43200MHzSDRAM ƒSupportsDP++1.2/HDMI1.4b/eDP(optional)/LVDS(optional) ƒSupports1PCIEx1or2M.2(B+Ekey),6COMs(4COMoptional), 3USB3.2Gen2,and5USB2.0 ƒ

LGA170012thGenerationIntel®Core™i9/i7/i5/i3/Pentium®SystemHostBoardwithDDR5,SATA3.0,USB3.2,Dual2.5GbE,andTripleDisplays

Features ƒIntel®Core™i9/i7/i5/i3/PentiumLGA1700processorwithH610Echipset ƒUpto64GBofdual-channel(Non-ECC)DDR54800MHz ƒPCIe3.0,USB3.2,SATA3.0,andDual2.5GbELAN ƒSupportsVGAand2xDVI-D/DP/HDMIdisplay(withoptionalcable) ƒSupportsAdvantech’sTPMandCOMmodul

LGA170012thGenerationIntel®Core™i9/i7/i5/i3/Pentium®SystemHostBoardwithDDR5,SATA3.0,USB3.2,M.2,Dual2.5GbE,andTripleDisplays

Features ƒIntel®Core™i9/i7/i5/i3/PentiumLGA1700processorwithR680Echipset ƒUpto64GBofdual-channel(ECC/non-ECC)DDR54800MHz ƒPCIe3.0,M.2,USB3.2,SATA3.0,Dual2.5GbELANandSWRaid0,1,5,10 ƒSupportsVGAand2xDVI-D/DP/HDMIdisplay(withoptionalcable) ƒSupports

IntelPentium,Celeron&AtomMini-ITXwithHDMI/DP/eDPorLVDS,6COM,andDualLAN

Features ƒSupportsIntelPentium,Celeron,Atom,QuadCore&DualCoreprocessor ƒTwo260-pinSO-DIMMupto32GBDDR43200MHzSDRAM ƒSupportsDP++1.2/HDMI1.4b/eDP(optional)/LVDS(optional) ƒSupports1PCIEx1or2M.2(B+Ekey),6COMs(4COMoptional), 3USB3.2Gen2,and5USB2.0 ƒ

LGA170012thGenerationIntel®Core™i9/i7/i5/i3/Pentium®SystemHostBoardwithDDR5,SATA3.0,USB3.2,Dual2.5GbE,andTripleDisplays

Features ƒIntel®Core™i9/i7/i5/i3/PentiumLGA1700processorwithH610Echipset ƒUpto64GBofdual-channel(Non-ECC)DDR54800MHz ƒPCIe3.0,USB3.2,SATA3.0,andDual2.5GbELAN ƒSupportsVGAand2xDVI-D/DP/HDMIdisplay(withoptionalcable) ƒSupportsAdvantech’sTPMandCOMmodul

LGA170012thGenerationIntel®Core™i9/i7/i5/i3/Pentium®SystemHostBoardwithDDR5,SATA3.0,USB3.2,M.2,Dual2.5GbE,andTripleDisplays

Features ƒIntel®Core™i9/i7/i5/i3/PentiumLGA1700processorwithR680Echipset ƒUpto64GBofdual-channel(ECC/non-ECC)DDR54800MHz ƒPCIe3.0,M.2,USB3.2,SATA3.0,Dual2.5GbELANandSWRaid0,1,5,10 ƒSupportsVGAand2xDVI-D/DP/HDMIdisplay(withoptionalcable) ƒSupports

IntelAtomplatformwithDualGbELANFanlessCompactBox

Features ƒIntel®ApolloLakeE3900series&NseriesProcessor ƒPalm-sizeformfactor:128(L)x152(W)x37mm(H) ƒSupports2xCOMport,1xHDMI,1xDisplayPort,2xUSB3.0,TPM2.0 andDCIN12~24V ƒBuilt-in1xM.22230slot,1xHalfsizeMiniPCIeexpansionslotand1xFull siz

OutdoorNVRw/4PoEPortsIntelAtomE3845SoCFanlessBoxPC

Features ƒIntel®AtomE3845QuadCore1.91GHzSoC ƒ4PoEPortstoSupportMainstreamIPCameras ƒ3KVisolationfor6xDi&2xDo ƒDiversityCommunicationAbilities,ex.WWAN,WLAN ƒ9~36VDC*WidePowerInputw/isolation ƒ1xRemovable2.5drivebay ƒSupportsiManager,SUSIAccess