N-Channel 2.5V Specified PowerTrench BGA MOSFET

General Description Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ203N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transf

102/103, 202/203, 302/303 Flanged Diaphragm Seal

FEATURES 316L stainless steel top housing (standard) A thin PTFE gasket between the diaphragm/bottom housing ensures a leak-tight, corrosion resistant seal Continuous duty design prevents loss of process fluid if pressure instrument is removed or fails Modular design allows for a suitable

Surface Mount Fuses - Subminiature Surface Mount & Dip Types

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M12-A Female 5 Pin Field Attachable

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BLACK COLOR NI/CU POLYESTER TAFFETA FABRIC-OVER-FOAM

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Masking Tape

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