Silicon Planar Zener Diodes

FEATURES • Total power dissipation: Max. 1 W. • Wide zener reverse voltage range 3.3V to 330V. • Small plastic package suitable for surface mounted design. MECHANICAL DATA • Case: SMA • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.055g / 0.002oz

SURFACE MOUNT SILICON ZENER DIODE

FEATURES ● For surface mounted applications in order to optimize board space ● Low profile package ● Built-in strain relief ● Glass passivated junction ● Low inductance ● Typical IR less than 5.0 A above 11V ● High temperature soldering : 260 /10 seconds at terminals ● Plastic package has

SURFACE MOUNT SILICON ZENER DIODE

FEATURES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Low inductance • Typical IR less than 5.0µA above 11V • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • High temperature soldering :

SURFACE MOUNT SILICON ZENER DIODE

VOLTAGE 3.3 to 100 Volts POWER 1.0 Watts FEATURES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 5.0µA above 11V • Plastic package has Underwriters Labo

SURFACE MOUNT SILICON ZENDER DIODE

PRODUCT SUMMARY 1.0 Watts Surface Mount FEATURES For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Typical IR less than 5.0uA above 11V High temperature sold

1.25 Watts Surface Mount Silicon Zener Diode

FEATURES - Built-in strain relief - Ideal for automated placement - Glass passivated junction - Low inductance - Typical IR less than 1μA above 11V - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition