ZENER DIODES

1N52 SERIES ZENER DIODES 1N5221B Through 1N5272B ELECTRICAL CHARACTERISTICS (T A =25°C)unless otherwise noted.Based on dc measurements at thermal equillibrium;lead length=3/8”;thermal resistance of heat sink=30°C/W VFmax=1.1V @ I F=200mA for all types(T A = 25°C VFmax=1.1V@ I F=200mA)

High stability and high reliability

Features • Low reverse leakage • Low zener impedance • Maximum power dissipation of 500 mW • High stability and high reliability • Lead and body according with RoHS standard

GOLD BONDED GERMANIUM DIODE

FEATURES Low forward voltagedrop—low power consumption Thirty years of proven reliability—one million hours mean time between failures (MTBF) Very low noise level Metallurgical^ bonded

ZENER DIODES

FEATURE ♦ Low zener impedance ♦ Low regulation factor ♦ Glass passivated junction ♦ High temperature soldering guaranteed: 260 °C/10S/9.5mm lead length at 5 lbs tension

Zener Diodes

■ Features ● Ptot 500mW ● Vz 2.4V-68V ■ Applications ● Stabilizing Voltage

ZENER DIODES

FEATURE ♦ Low zener impedance ♦ Low regulation factor ♦ Glass passivated junction ♦ High temperature soldering guaranteed: 260 °C/10S/9.5mm lead length at 5 lbs tension

Low zener impedance

FEATURE ♦ Low zener impedance ♦ Low regulation factor ♦ Glass passivated junction ♦ High temperature soldering guaranteed: 260 °C/10S/9.5mm lead length at 5 lbs tension

Zener 0.5W

General Data Applicable to all series in this group. 500 MilliwattHermetically SealedGlass Silicon Zener Diodes • Complete Voltage Range - 1.8 to 200 Volts\n• Wide Range of Zener Breakdown Voltages\n• 2% and 5% tolerances available\n• DO-204AH Package - Smaller than Conventional DO-204AA Package\n• Double Slug Type Construction\n• Metallurgically Bonded ConstructionMechanical Characteristics:\n• CASE:;

丝印代码：1N5221B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5222B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5223B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5224B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5225B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5226B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5227B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5228B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5229B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5230B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5231B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5232B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5233B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5234B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5235B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5236B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5237B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5238B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5239B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5240B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5241B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5243B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5244B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5247B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5248B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5251B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5252B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5253B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5255B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5256B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5257B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5258B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5259B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5260B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5261B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5262B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5263B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5264B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5265B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

丝印代码：1N5266B；SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive

CURRENT REGULATOR DIODES

CURRENT REGULATOR DIODES

SILICON PLANAR ZENER DIODES

Standard Zener voltage tolerance is ± 20. Add suffix A for ± 10 Tolerance, suffix B for ± 5 tolerance, suffix C for ± 2 tolerance, Other tolerance, non standard and higher Zener voltages are upon request.

SILICON PLANAR ZENER DIODES

SILICON PLANAR ZENER DIODES Standard Zener voltage tolerance is ± 20. Add suffix A for ± 10 Tolerance, suffix B for ± 5 tolerance, suffix C for ± 2 tolerance, Other tolerance, non standard and higher Zener voltages are upon request.

SILICON PLANAR ZENER DIODES

SILICON PLANAR ZENER DIODES Standard Zener voltage tolerance is ± 20. Add suffix A for ± 10 Tolerance, suffix B for ± 5 tolerance, suffix C for ± 2 tolerance, Other tolerance, non standard and higher Zener voltages are upon request.

SILICON PLANAR ZENER DIODES

SILICON PLANAR ZENER DIODES Standard Zener voltage tolerance is ± 20. Add suffix A for ± 10 Tolerance, suffix B for ± 5 tolerance, suffix C for ± 2 tolerance, Other tolerance, non standard and higher Zener voltages are upon request.

SILICON PLANAR ZENER DIODES

0.5W SILICON PLANAR ZENER DIODES

FEATURES • Standards zener voltage tolerance is 20. Add suffix A for 10 tolerance and suffix B for 5 tolerance other tolerance, non-standards and higher zener voltage upon request.

500 mW Zener Diode 2.4 to 200 Volts

Features • Wide Voltage Range Available • Glass Package • High Temp Soldering: 250°C for 10 Seconds At Terminals

SILICON PLANAR ZENER DIODES

Features Silicon Planar Zener Diodes Standard Zener voltage tolerance is ±20. Add suffix A for 10 tolerance and suffix B for ±5 tolerance. Other tolerances, non standard and higher Zener voltages upon request.

1/2 Watt ZENER DIODES

Features ■ 5 & 10 VOLTAGE TOLERANCES AVAILABLE ■ WIDE VOLTAGE RANGE ■ MEETS UL SPECIFICATION 94V-0

500 mW Zener Diode 2.4 to 75 Volts

Features • Wide Voltage Range Available • Glass Package • High Temp Soldering: 260°C for 10 Seconds At Terminals • Marking : Cathode band and type number • Lead Free Finish/Rohs Compliant (Note1) (PSuffix designates Compliant. See ordering information) • Moisture Sensitivity: Level 1

500 mW Zener Diode 2.4 to 75 Volts

Features • Wide Voltage Range Available • Glass Package • High Temp Soldering: 260°C for 10 Seconds At Terminals • Marking : Cathode band and type number • Lead Free Finish/Rohs Compliant (Note1) (PSuffix designates Compliant. See ordering information) • Moisture Sensitivity: Level 1 per