9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

Intel® Atom™ E3900 / Pentium® / Celeron® N Series SMARC Module

Features ƒ SMARC2.0 & SMARC2.1 Compliance ƒ Intel® Atom™ E3900 / Pentium® / Celeron® N Series Processors ƒ Integrated dual GbE. wireless module on board design ƒ Dual channel LPDDR4 2/4/8 GB memory down & onboard eMMC ƒ Triple display (DP++, HDMI, LVDS) ƒ Supports iManager, WISE-PaaS/DeviceO

Development Kit for SMARC 2.0/2.1 Computer-on-Module ROM-5720

Features ƒƒ NXP i.MX 8M processor with dual or quad Arm Cortex A53 cores ƒƒ 1 x Arm Cortex-M4 core ƒƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒƒ 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ƒƒ 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera

Intel Xeon Processor D-1500 COM Express R3.0 Type 7 Module for Ruggedized Application

Features ƒ COM Express R3.0 Basic Module Type 7 pin out ƒ Intel® Xeon® Processor D-1500 Product Family ƒ Solder-down memory w/ ECC, max. 32GB ƒ High speed Ethernet (dual 10GBASE-KR interfaces, one GbE) ƒ Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1) ƒ Supports iManager, WISE-PaaS/Device

9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

NXP i.MX8X Cortex®-A35 SMARC 2.0/2.1 Computer-on-Module

Features ƒ NXP i.MX 8X processor with 2-4 x Arm Cortex-A35 cores ƒ 1 x Arm Cortex-M4F core and 1x Tensilica® HiFi 4 DSP ƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒ 2 x single channel LVDS or 2 x 4-LANE MIPI DSI ƒ 1 x USB 3.0, 1 x USB 2.0 Host, 1 x USB2.0 OTG, 2 x CAN, 3 x UART, 4 x I2C, 12 x

Micro Computer, Intel® Core™ i7/i5/i3 CPU, H81, 2 Expansions, 250W 80Plus PSU

Features ƒ Intel® H81 Platform – Intel® 4th gen Core™ i7/i5/i3 CPU (LGA1150) – One PCIe x16* & one PCIe x4 Expansion Slots ƒ Compact, well-thought-out design – Two internal, shock-resistant, 2.5 SATA HDD bays – Front accessible I/O: VGA+DVI-D, 2 GbE LAN, 3 USB2.0, 2 COM – Easy-to-maintain s

Micro Computer with Intel® Core™ i7/i5/i3 Processor, Intel® H110 Chipset, 2 x Expansion Slots, and 250W 80PLUS PSU

Features ƒ Intel® 6th/7th Gen Core™ i7/i5/i3/Celeron® processer with Intel® H110 chipset ƒ 1 x PCIe x16 and 1 x PCIe x4(1 x PCI for AIMC-3202-01) expansion slots ƒ Compact design with front-accessible I/O ƒ 1 x VGA+DVI-D, 2 x GbE LAN, 3 x USB 3.0, 2 x COM ƒ 2 x 2.5 internal, shock-resistant S

Intel 8th Gen U Series CORE i3/i5/i7 CPU,eDP (LVDS), 2 HDMI, 2 LAN, 2 USB3.2 Gen2 x1, 4 COM (RS-232/422/485),M.2 E-Key, M.2 B-Key, M.2 M-Key NVMe

Features ƒ Intel® 8th Gen Core™ i3-8145UE / i5-8365UE / i7-8665UE/CELERON 4305UE ƒ Supports 1 x DDR4-2400 SO-DIMM ƒ Supports 1 x eDP (LVDS co-lay), 2 x HDMI, 3 Independent Displays ƒ Supports 2 x LAN, 2 x USB3.2 Gen2 x1 Type-A Ports, 4 COM Ports (RS-232/422/485, selected via BIOS) ƒ Support

Intel 8th Gen U Series CORE i3/i5/i7 CPU,eDP (LVDS), 2 HDMI, 2 LAN, 2 USB3.2 Gen2 x1, 4 COM (RS-232/422/485),M.2 E-Key, M.2 B-Key, M.2 M-Key NVMe

Features ƒ Intel® 8th Gen Core™ i3-8145UE / i5-8365UE / i7-8665UE/CELERON 4305UE ƒ Supports 1 x DDR4-2400 SO-DIMM ƒ Supports 1 x eDP (LVDS co-lay), 2 x HDMI, 3 Independent Displays ƒ Supports 2 x LAN, 2 x USB3.2 Gen2 x1 Type-A Ports, 4 COM Ports (RS-232/422/485, selected via BIOS) ƒ Support

1U High Performance Rackmount Server with 3rd Gen. Intel® Xeon® Scalable processors

Features ƒ Ideal for hyperconverged storage, software-defined storage, and high end enterprise server ƒ Up to 4 bays 3.5 SAS/SATA drives support ƒ Dual socket P+ LGA4189 3rd Gen. Intel® Xeon® Scalable processors support ƒ 32x DDR4 ECC-Registered 2666/2933/3200 Mhz RDIMM/LRDIMM ƒ Highly scala

2U High Performance Rackmount Server with 3rd Gen. Intel® Xeon® Scalable processors

Features ƒ Up to 12 bays 3.5 SAS/SATA or 24 bays 2.5 hot-swap SAS/SATA drives support ƒ 32x DDR4 ECC-Registered 2666/2933/3200 Mhz RDIMM/LRDIMM ƒ Up to 4 FHFL, 2 FHHL and 2 Low Profile PCIe Gen4 ƒ 2 M.2 2280 SATA SSD support, Rear 2 2.5 SATA/SAS/NVMe drive support ƒ 1 OCP 3.0 PCIe Gen4 x16 N

2U High Performance Rackmount Server with 3rd Gen. Intel® Xeon® Scalable processors

Features ƒ Up to 12 bays 3.5 SAS/SATA or 24 bays 2.5 hot-swap SAS/SATA drives support ƒ 32x DDR4 ECC-Registered 2666/2933/3200 Mhz RDIMM/LRDIMM ƒ Up to 4 FHFL, 2 FHHL and 2 Low Profile PCIe Gen4 ƒ 2 M.2 2280 SATA SSD support, Rear 2 2.5 SATA/SAS/NVMe drive support ƒ 1 OCP 3.0 PCIe Gen4 x16 N

Intel® 10th Gen Core™ processor,LGA1200 Mini-ITX motherboard

Features ƒ Supports Intel® 10th Gen Core™ i processor (LGA1200) with Intel Q470E/ H420E chipset ƒ Two 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAM ƒ Supports displays of HDMI2.0a/DP1.2/VGA/LVDs (or eDP) ƒ Supports 1 M.2 M key & 1 M.2 E key ƒ Supports 4 USB3.2 Gen2 & 4 USB3.2 Gen1, and 3 SA

12th Gen. Intel® Core™ Processors S-series (LGA1700) on 4 EPIC SBC

Features ƒ 12th Gen. Intel® Core™ Processor up to 16 Cores, TDP 35W ƒ High scalability with socket type CPU (LGA1700) & Support Std. CPU cooler ƒ DDR5 4800 up to 32GB + 3 simultaneous display: Dual HDMI + eDP ƒ Dual High Speed 2.5G Ethernet with TSN, 2x COM, CANbus, TPM ƒ 3 Expansions: Dual M

LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI

Features ƒ LGA4189 ATX server board with 3rd Gen. Xeon® Scalable processor ƒ DDR4 3200 MHz RDIMM up to 512 GB (8 DIMMs) supports Intel® Optane™ Persistent Memory ƒ Features 3x PCIe x16, 1x PCIe x8, 2x PCIe x4, and 1x PCIe x1 ƒ Intel® X550 dual 10GbE ports ƒ Eight SATA 3 and one M.2 connector

2U HCI Server with 3rd Gen. Intel® Xeon® Scalable Processors

Features ƒ Balanced CPU & GPU performance by spread core layout ƒ Wide temperature support up to 40 °C ƒ Up to 5 x low profile PCI-E Gen4 slots ƒ 12 x 3.5 HDD, 2 x 2.5 SATA HDD and 2 x M.2 NVME ƒ Up to 16 x DDR4 3200 RDIMM / LRDIMM ƒ Advantech platfrom management by Redfish and secured web i

NXP ARM Cortex-A72 i.MX8 QuadMax Qseven 2.1 Module

Features ƒ NXP ARM Cortex-A72 + A53 i.MX8 QuadMax 1.6GHz high performance processor ƒ Onboard LPDDR4 memory 4 GB ƒ Onboard eMMC NAND Flash 16 GB ƒ Supports OpenGL 3.0, 2.1; OpenGL ES 3.2; Open GL ES 3.1 (with AEP); Open GL ES 3.0, 2.0, and 1.1; OpenCL 2.0 and 1.1; OpenVG 1.1; and Vulkanc ƒ

2U Edge Sever with 3rd Gen. Intel® Xeon® Scalable Processors

Features ƒ Balanced CPU & GPU performance by spread core layout ƒ Wide temperature support up to 45C ƒ Up to 5 x low profile or 2 x DW FH/FL PCIe gen4 slots ƒ 6 x 2.5 HDD and 2 x M.2 NVME ƒ Up to 16 x DDR4 3200 RDIMM / LRDIMM ƒ Advantech platfrom management by Redfish and secured web interfa

2U High Performance Rackmount Server with 3rd Gen. Intel® Xeon® Scalable processors

Features ƒ Up to 12 bays 3.5 SAS/SATA or 24 bays 2.5 hot-swap SAS/SATA drives support ƒ 32x DDR4 ECC-Registered 2666/2933/3200 Mhz RDIMM/LRDIMM ƒ Up to 4 FHFL, 2 FHHL and 2 Low Profile PCIe Gen4 ƒ 2 M.2 2280 SATA SSD support, Rear 2 2.5 SATA/SAS/NVMe drive support ƒ 1 OCP 3.0 PCIe Gen4 x16 N

2U High Performance Rackmount Server with 3rd Gen. Intel® Xeon® Scalable processors

Features ƒ Up to 12 bays 3.5 SAS/SATA or 24 bays 2.5 hot-swap SAS/SATA drives support ƒ 32x DDR4 ECC-Registered 2666/2933/3200 Mhz RDIMM/LRDIMM ƒ Up to 4 FHFL, 2 FHHL and 2 Low Profile PCIe Gen4 ƒ 2 M.2 2280 SATA SSD support, Rear 2 2.5 SATA/SAS/NVMe drive support ƒ 1 OCP 3.0 PCIe Gen4 x16 N

2U HCI Server with 3rd Gen. Intel® Xeon® Scalable Processors

Features ƒ Balanced CPU & GPU performance by spread core layout ƒ Wide temperature support up to 40 °C ƒ Up to 5 x low profile PCI-E Gen4 slots ƒ 12 x 3.5 HDD, 2 x 2.5 SATA HDD and 2 x M.2 NVME ƒ Up to 16 x DDR4 3200 RDIMM / LRDIMM ƒ Advantech platfrom management by Redfish and secured web i

NXP ARM Cortex-A72 i.MX8 QuadMax Qseven 2.1 Module

Features ƒ NXP ARM Cortex-A72 + A53 i.MX8 QuadMax 1.6GHz high performance processor ƒ Onboard LPDDR4 memory 4 GB ƒ Onboard eMMC NAND Flash 16 GB ƒ Supports OpenGL 3.0, 2.1; OpenGL ES 3.2; Open GL ES 3.1 (with AEP); Open GL ES 3.0, 2.0, and 1.1; OpenCL 2.0 and 1.1; OpenVG 1.1; and Vulkanc ƒ

MXM 3.1 Type A NVIDIA® Quadro® Embedded T1000 with DP 1.4a

Features ƒ NVIDIA® Quadro® T1000 with MXM 3.1 TYPE A form factor(82 x 70 mm) ƒ Up to 896 CUDA cores , 2.6 TFLOPS ƒ GDDR6 4GB memory, 128-bit, bandwidth 192 GB/s ƒ Up to 4 x DisplayPort 1.4a outputs ƒ Long life cycle, supports 5 years availability

NXP i.MX8M Cortex®-A53 SMARC 2.0/2.1 Computer-on-Module

Features ƒ NXP i.MX 8M processor with dual or quad Arm Cortex A53 cores ƒ 1 x Arm Cortex-M4 core ƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒ 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ƒ 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera inpu

NXP i.MX8M Cortex®-A53 SMARC 2.0/2.1 Computer-on-Module

Features ƒ NXP i.MX 8M processor with dual or quad Arm Cortex A53 cores ƒ 1 x Arm Cortex-M4 core ƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒ 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ƒ 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera inpu

4U Rackmount Intel® Xeon® Scalable GPU Server, Supporting 4x PCIe x16 Double-Deck Cards Plus 3x PCIe x8 Single-Deck Cards

Features ƒ Processor: Dual 3rd Gen. Intel® Xeon® scalable processors ƒ Memory: 16x DDR4 3200 MHz ECC RDIMM/LRDIMM / Intel® Optane™ support up to 2TB ƒ Remote Management: IPMI function support ƒ Expansion: Supporting 4 * PCIe x16 double-deck card + 2* PCIe x8 single-deck FH/HL card + 1*PCIe x

NXP i.MX8M Mini Cortex®-A53 SMARC 2.0/2.1 Computer-on-Module

Features ƒ NXP i.MX 8M Mini processor with up to 4 Arm Cortex A53 cores ƒ 1 x Arm Cortex-M4 cores ƒ Onboard LPDDR4 memory and eMMC ƒ 1 x 4 lane MIPI-CSI,1 x Dual channel LVDS or 1 x Display Port ƒ 4 x USB2.0, 1 x USB 2.0 OTG, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1x Gigabit LAN ƒ Suppo

Rockchip RK3399 Cortex®-A72A53 SMARC 2.1 Computer-on-Module

Features ƒ Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz ƒ Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC ƒ Support HDMI2.0 4K, 1 x eDP, 1 x LVDS ƒ Support 4K H.264/H.265 Video decoder ƒ 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO ƒ 1 x PCIe2.0, 1 x SATA, 2 x M

Rockchip RK3399 Cortex®-A72A53 SMARC 2.1 Computer-on-Module

Features ƒ Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz ƒ Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC ƒ Support HDMI2.0 4K, 1 x eDP, 1 x LVDS ƒ Support 4K H.264/H.265 Video decoder ƒ 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO ƒ 1 x PCIe2.0, 1 x SATA, 2 x M

Rockchip RK3399 Cortex®-A72A53 SMARC 2.1 Computer-on-Module

Features ƒ Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz ƒ Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC ƒ Support HDMI2.0 4K, 1 x eDP, 1 x LVDS ƒ Support 4K H.264/H.265 Video decoder ƒ 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO ƒ 1 x PCIe2.0, 1 x SATA, 2 x M

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

LGA 4094 AMD® EPYC™ 7003 ATX server motherboard

characteristic LGA 4094 (Socket SP3) ATX server board with AMD EPYC™ 7003 Processor DDR4 3200 MHz RDIMM up to 256GB per DIMM 5x PCIe 4.0 x16, 2x PCIe 4.0 x8 Intel® X550 dual 10GbE port 8 (via SFF-8643 ports) + 1 SATA 3 and 2 M.2 ports (SATA/PCIe 4.0 compatible) 0 ~ 60 °C operating temperat

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

NXP Arm® Cortex®-A72 LS1046A COM Express Type 7 Compact

Features ƒ NXP LS1046A, 4 x Cortex A72 1.6GHz ƒ Onboard Micro SD slot and eMMC 16GB ƒ 1 SO-DIMM supports ECC and Non-ECC DDR4 ƒ 10GBase-KR x2, GbE up to 4, PCIe 1x x3, USB 3.2 Gen1 x3, USB 2.0.x3, SATA V3.0 x1 ƒ 4 wires UART x2, SPI x1, GPIO x8, I2C ƒ DPAA (Data Path Architecture Accelerati

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Mini Type 10

Features ƒ Up to 4Cores Intel Core Processor, Intel Iris Xe Graphics 96EUs ƒ Max. 16GB LPDDR4 onboard, IBECC support. 32/64GB NVMe SSD ƒ Super Speed I/O Expansion: USB3.2 Gen2(10Gbps), PCIe Gen3, SATAIII ƒ Extended Temp. -40~85 °C ƒ Supports iManager, Edge-AI Suite, DeviceOn

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Mini Type 10

Features ƒ Up to 4Cores Intel Core Processor, Intel Iris Xe Graphics 96EUs ƒ Max. 16GB LPDDR4 onboard, IBECC support. 32/64GB NVMe SSD ƒ Super Speed I/O Expansion: USB3.2 Gen2(10Gbps), PCIe Gen3, SATAIII ƒ Extended Temp. -40~85 °C ƒ Supports iManager, Edge-AI Suite, DeviceOn

Dual LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16 DDR4, 4 PCIe x16, 3 PCIe x8, 1 PCIe x4, 5 SATA3, 4 USB3.0, IPMI

Features ƒ Proprietary server board with dual Xeon® Scalable processors ƒ DDR4 3200MHz RDIMM up to 1TB, support Intel Optane Persistent Memory ƒ 1 SFF-8643 connector support 4 ports SATA drive, 1 M.2 2280 on board ƒ 1 SlimSAS connector support 2 ports NVMe drive in option ƒ Four PCIe x16 slot

LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI

Features ƒ LGA4189 ATX server board with 3rd Gen. Xeon® Scalable processor ƒ DDR4 3200 MHz RDIMM up to 512 GB (8 DIMMs) supports Intel® Optane™ Persistent Memory ƒ Features 3x PCIe x16, 1x PCIe x8, 2x PCIe x4, and 1x PCIe x1 ƒ Intel® X550 dual 10GbE ports ƒ Eight SATA 3 and one M.2 connector

LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16x DDR4, 4 x PCIe x16, 10 x SATA3, 8 x USB 3.2 (Gen 1), Dual 10GbE, and IPMI

Features ƒ LGA4189 proprietary server board with 3rd Gen Intel® Xeon® scalable processor ƒ DDR4 3200 MHz RDIMM up to 2TB supports Intel® Optane™ Persistent Memory ƒ 4 x PCIe x16 and 7 x PCIe x8 ƒ Intel® X550 dual 10GbE ports ƒ Ten SATA3 and two M.2 connectors (SATA/PCIe compatible) ƒ 0 ~ 4

2U 20” short-depth Edge Accelerator Server with Dual Intel® 3rd Gen Xeon® Scalable processors, supporting 8 expansion slots

Features ƒ Dual Intel® 3rd Gen Xeon® Scalable processors ƒ DDR4 3200MHz RDIMM up to 1TB, support Intel Optane Persistent Memory ƒ Four PCIe x16 slots support FH/10.5L Cards* ƒ Four PCIeX8 slots support HH/HL Cards ƒ Four 2.5 hot-swappable SASII/SATAIII drive bays (Two can be NVMe in option)

MXM 3.1 Type A NVIDIA® Quadro® Embedded T1000 with DP 1.4a

Features ƒ NVIDIA® Quadro® T1000 with MXM 3.1 TYPE A form factor(82 x 70 mm) ƒ Up to 896 CUDA cores , 2.6 TFLOPS ƒ GDDR6 4GB memory, 128-bit, bandwidth 192 GB/s ƒ Up to 4 x DisplayPort 1.4a outputs ƒ Long life cycle, supports 5 years availability

Water-resistant Fanless In-vehicle AI Computer with Intel® 8th/9th Gen Core™ i CPU

Features ƒ Intel® 8th/9th Gen Core™ i socket-type CPU (LGA1151) with H310 PCH ƒ 8GB memory on board and 1 x DDR4 SO-DIMM socket ƒ Support MXM type GPU module ƒ Supports 2 x Gigabit Ethernet, 2 x USB3.0/3.1 ƒ Supports 2 x COM (RS232/422/485) ƒ Supports 1 x mSATA, 2 x 2.5 HDD/SSD ƒ Supports 3

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W ƒ On-board LPDDR4x-4267 up to 32G with IBECC for Industrial Sku ƒ Dual independent display: eDP/MIPI-DSI, DP up to 8K ƒ 2 GbE, 2 USB 3.2, COM Port, SMBus/I2C ƒ Expansion: M.2 E-Key, M.2 B-Key/M-Key NVMe x2 ƒ Supports i

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W ƒ On-board LPDDR4x-4267 up to 32G with IBECC for Industrial Sku ƒ Dual independent display: eDP/MIPI-DSI, DP up to 8K ƒ 2 GbE, 2 USB 3.2, COM Port, SMBus/I2C ƒ Expansion: M.2 E-Key, M.2 B-Key/M-Key NVMe x2 ƒ Supports i

Intel Atom x6000, Pentium and Celeron® x6000 Series Processor (Code Name: Elkhart Lake) SMARC Module

Features ƒ Intel Atom® x6000, Pentium® and Celeron® x6000 Series processor ƒ SMARC2.1.1 pinout, small size ƒ Dual-CH LPDDR4 3200MT/s up to 16GB, support IBECC ƒ Triple displays up to 4K2K (DP++, HDMI, LVDS/eDP/MIPI-DSI) ƒ Multiple I/O expansion: PCIe gen3, USB3.2 Gen2, USB2.0, SATA ƒ On boar

Intel Atom x6000, Pentium and Celeron® x6000 Series Processor (Code Name: Elkhart Lake) SMARC Module

Features ƒ Intel Atom® x6000, Pentium® and Celeron® x6000 Series processor ƒ SMARC2.1.1 pinout, small size ƒ Dual-CH LPDDR4 3200MT/s up to 16GB, support IBECC ƒ Triple displays up to 4K2K (DP++, HDMI, LVDS/eDP/MIPI-DSI) ƒ Multiple I/O expansion: PCIe gen3, USB3.2 Gen2, USB2.0, SATA ƒ On boar

AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

Intel® 11th Gen Core Processors (Code Name: Tiger Lake-H) (Code Name: Tiger Lake-H)

Features ƒ Intel® 11th Gen Core Processors, up to 8Core/16T, L3 Cache 24M ƒ Intel Iris Xe(Gen 12) graphics, 4 independent 4K display ƒ Dual channel DDR4 Max 128GB SODIMM, support ECC ƒ Super speed I/O: PCIe4 x16 (16GT/s), USB3.2 gen3 (10Gb), 2.5GbE, SATA3 (6Gb) ƒ TPM2.0 security protection,

Intel® Xeon® D Processor (Code Name: Ice Lake-D LCC) COM Express® Basic Type7

Features ƒ Intel® Xeon® D Processor ƒ COM Express R3.0 Basic Module Type 7 pin out ƒ 4~10 core processor, with max. TDP 67W ƒ High speed Ethernet (4 x 10GBASE-KR interfaces, one GbE) ƒ Various expansion (PCIe x16 Gen4, PCIe X8, 4PCIe X1, 4 USB3.0, 2 SATA3) ƒ Supports SUSI, DeviceOn and Edge

2U Edge Sever with 3rd Gen. Intel® Xeon® Scalable Processors

Features ƒ Balanced CPU & GPU performance by spread core layout ƒ Wide temperature support up to 45C ƒ Up to 5 x low profile or 2 x DW FH/FL PCIe gen4 slots ƒ 6 x 2.5 HDD and 2 x M.2 NVME ƒ Up to 16 x DDR4 3200 RDIMM / LRDIMM ƒ Advantech platfrom management by Redfish and secured web interfa

Intel® Atom® x6000E series and Intel Celeron N and J series 3.5 SBC

Features ƒ Atom® x6000E series and Intel® Celeron® J and N series with Quad/Dual Cores, TDP 6W/ 10W/ 12W ƒ Single Channel DDR4-3200 up to 32GB ƒ 3 independent displays via LVDS, DP1.4, and HDMI2.0 up to 4K@60Hz ƒ Dual GbE, 6 USB, 6 UART, TPM2.0 ƒ CE/FCC Class B, Coastline I/O ESD 8KV/15KV Cr

Intel® Atom® x6000E series and Intel Celeron N and J series 3.5 SBC

Features ƒ Atom® x6000E series and Intel® Celeron® J and N series with Quad/Dual Cores, TDP 6W/ 10W/ 12W ƒ Single Channel DDR4-3200 up to 32GB ƒ 3 independent displays via LVDS, DP1.4, and HDMI2.0 up to 4K@60Hz ƒ Dual GbE, 6 USB, 6 UART, TPM2.0 ƒ CE/FCC Class B, Coastline I/O ESD 8KV/15KV Cr

2U High Performance Rackmount Server with AMD EPYC™ 7003 Processor

Features ƒ Up to 12 bays 3.5 SAS/SATA and 2 bays 2.5 NVME drives (optional) ƒ 16x DDR4 ECC-Registered 2933/3200 Mhz RDIMM ƒ Up to 5 PCIe Gen4 and 3 PCIe Gen3 ƒ 2 M.2 2280 SATA/PCIe support ƒ 1 OCP 3.0 PCIe Gen4 x16 NIC support