MINIATUREFUSES-5x20mm

文件：59.44 Kbytes Page：2 Pages

TemperatureSensorsLineGuide

文件：736.09 Kbytes Page：11 Pages

RUGGEDandLIGHTWEIGHTALUMINUMBATTERYHOLDERS

文件：115.71 Kbytes Page：2 Pages

包装：托盘 描述：BATT HOLDER C 6 CELL SOLDER LUG 电池产品 电池座，电池夹，电池触头

9th/8thGen.IntelXeon/Core™Processor,3.5SBCw/MIOe

Features ƒ9th/8thGen.Intel®Xeon®/Core™Processor,upto6cores,andTDP45W/25W ƒDualchannelDDR4-2400,upto64GB*,ECCforXeonSKU ƒTriplesimultaneousdisplayswith48-bitLVDS+HDMI+DP ƒUSB3.1Gen2(10Gbps),TPM2.0&NVMe/PCIeGen3x4SSD ƒDualGbE,SATAIII,RS-232/422/485,CA

Intel®Atom™E3900/Pentium®/Celeron®NSeriesSMARCModule

Features ƒSMARC2.0&SMARC2.1Compliance ƒIntel®Atom™E3900/Pentium®/Celeron®NSeriesProcessors ƒIntegrateddualGbE.wirelessmoduleonboarddesign ƒDualchannelLPDDR42/4/8GBmemorydown&onboardeMMC ƒTripledisplay(DP++,HDMI,LVDS) ƒSupportsiManager,WISE-PaaS/DeviceO

DevelopmentKitforSMARC2.0/2.1Computer-on-ModuleROM-5720

Features ƒƒNXPi.MX8MprocessorwithdualorquadArmCortexA53cores ƒƒ1xArmCortex-M4core ƒƒOnboard2GBLPDDR4memoryandeMMC16GB ƒƒ1xHDMI2.0upto4096x2160,1x4-LaneMIPIDSI ƒƒ2xUSB3.0,4xUSB2.0,4xUART,4xI2C,12xGPIO, 1xPCIe2.0,1x4-laneMIPICSIcamera

IntelXeonProcessorD-1500COMExpressR3.0Type7ModuleforRuggedizedApplication

Features ƒCOMExpressR3.0BasicModuleType7pinout ƒIntel®Xeon®ProcessorD-1500ProductFamily ƒSolder-downmemoryw/ECC,max.32GB ƒHighspeedEthernet(dual10GBASE-KRinterfaces,oneGbE) ƒAbundantexpansion.(PCIex16,PCIex8,8PCIex1) ƒSupportsiManager,WISE-PaaS/Device

9th/8thGen.IntelXeon/Core™Processor,3.5SBCw/MIOe

Features ƒ9th/8thGen.Intel®Xeon®/Core™Processor,upto6cores,andTDP45W/25W ƒDualchannelDDR4-2400,upto64GB*,ECCforXeonSKU ƒTriplesimultaneousdisplayswith48-bitLVDS+HDMI+DP ƒUSB3.1Gen2(10Gbps),TPM2.0&NVMe/PCIeGen3x4SSD ƒDualGbE,SATAIII,RS-232/422/485,CA

NXPi.MX8XCortex®-A35SMARC2.0/2.1Computer-on-Module

Features ƒNXPi.MX8Xprocessorwith2-4xArmCortex-A35cores ƒ1xArmCortex-M4Fcoreand1xTensilica®HiFi4DSP ƒOnboard2GBLPDDR4memoryandeMMC16GB ƒ2xsinglechannelLVDSor2x4-LANEMIPIDSI ƒ1xUSB3.0,1xUSB2.0Host,1xUSB2.0OTG,2xCAN,3xUART,4xI2C, 12x

MicroComputer,Intel®Core™i7/i5/i3CPU,H81,2Expansions,250W80PlusPSU

Features ƒIntel®H81Platform –Intel®4thgenCore™i7/i5/i3CPU(LGA1150) –OnePCIex16*&onePCIex4ExpansionSlots ƒCompact,well-thought-outdesign –Twointernal,shock-resistant,2.5SATAHDDbays –FrontaccessibleI/O:VGA+DVI-D,2GbELAN,3USB2.0,2COM –Easy-to-maintains

MicroComputerwithIntel®Core™i7/i5/i3Processor,Intel®H110Chipset,2xExpansionSlots,and250W80PLUSPSU

Features ƒIntel®6th/7thGenCore™i7/i5/i3/Celeron®processerwithIntel®H110chipset ƒ1xPCIex16and1xPCIex4(1xPCIforAIMC-3202-01)expansionslots ƒCompactdesignwithfront-accessibleI/O ƒ1xVGA+DVI-D,2xGbELAN,3xUSB3.0,2xCOM ƒ2x2.5internal,shock-resistantS

Intel8thGenUSeriesCOREi3/i5/i7CPU,eDP(LVDS),2HDMI,2LAN,2USB3.2Gen2x1,4COM(RS-232/422/485),M.2E-Key,M.2B-Key,M.2M-KeyNVMe

Features ƒIntel®8thGenCore™i3-8145UE/i5-8365UE/i7-8665UE/CELERON 4305UE ƒSupports1xDDR4-2400SO-DIMM ƒSupports1xeDP(LVDSco-lay),2xHDMI,3IndependentDisplays ƒSupports2xLAN,2xUSB3.2Gen2x1Type-APorts,4COMPorts (RS-232/422/485,selectedviaBIOS) ƒSupport

Intel8thGenUSeriesCOREi3/i5/i7CPU,eDP(LVDS),2HDMI,2LAN,2USB3.2Gen2x1,4COM(RS-232/422/485),M.2E-Key,M.2B-Key,M.2M-KeyNVMe

Features ƒIntel®8thGenCore™i3-8145UE/i5-8365UE/i7-8665UE/CELERON 4305UE ƒSupports1xDDR4-2400SO-DIMM ƒSupports1xeDP(LVDSco-lay),2xHDMI,3IndependentDisplays ƒSupports2xLAN,2xUSB3.2Gen2x1Type-APorts,4COMPorts (RS-232/422/485,selectedviaBIOS) ƒSupport

1UHighPerformanceRackmountServerwith3rdGen.Intel®Xeon®Scalableprocessors

Features ƒIdealforhyperconvergedstorage,software-definedstorage,andhighend enterpriseserver ƒUpto4bays3.5SAS/SATAdrivessupport ƒDualsocketP+LGA41893rdGen.Intel®Xeon®Scalableprocessorssupport ƒ32xDDR4ECC-Registered2666/2933/3200MhzRDIMM/LRDIMM ƒHighlyscala

2UHighPerformanceRackmountServerwith3rdGen.Intel®Xeon®Scalableprocessors

Features ƒUpto12bays3.5SAS/SATAor24bays2.5hot-swapSAS/SATAdrives support ƒ32xDDR4ECC-Registered2666/2933/3200MhzRDIMM/LRDIMM ƒUpto4FHFL,2FHHLand2LowProfilePCIeGen4 ƒ2M.22280SATASSDsupport,Rear22.5SATA/SAS/NVMedrivesupport ƒ1OCP3.0PCIeGen4x16N

2UHighPerformanceRackmountServerwith3rdGen.Intel®Xeon®Scalableprocessors

Features ƒUpto12bays3.5SAS/SATAor24bays2.5hot-swapSAS/SATAdrives support ƒ32xDDR4ECC-Registered2666/2933/3200MhzRDIMM/LRDIMM ƒUpto4FHFL,2FHHLand2LowProfilePCIeGen4 ƒ2M.22280SATASSDsupport,Rear22.5SATA/SAS/NVMedrivesupport ƒ1OCP3.0PCIeGen4x16N

12thGen.Intel®Core™ProcessorsS-series(LGA1700)on4EPICSBC

Features ƒ12thGen.Intel®Core™Processorupto16Cores,TDP35W ƒHighscalabilitywithsockettypeCPU(LGA1700)&SupportStd.CPUcooler ƒDDR54800upto32GB+3simultaneousdisplay:DualHDMI+eDP ƒDualHighSpeed2.5GEthernetwithTSN,2xCOM,CANbus,TPM ƒ3Expansions:DualM

Intel®10thGenCore™processor,LGA1200Mini-ITXmotherboard

Features ƒSupportsIntel®10thGenCore™iprocessor(LGA1200)withIntelQ470E/ H420Echipset ƒTwo260-pinSO-DIMMupto64GBDDR42933MHzSDRAM ƒSupportsdisplaysofHDMI2.0a/DP1.2/VGA/LVDs(oreDP) ƒSupports1M.2Mkey&1M.2Ekey ƒSupports4USB3.2Gen2&4USB3.2Gen1,and3SA

LGA4189Intel®3rdGenXeon®ScalableATXServerBoardwith8xDDR4,3xPCIex16,8xSATA3,6xUSB3.2(Gen1),Dual10GbE,andIPMI

Features ƒLGA4189ATXserverboardwith3rdGen.Xeon®Scalableprocessor ƒDDR43200MHzRDIMMupto512GB(8DIMMs)supportsIntel®Optane™ PersistentMemory ƒFeatures3xPCIex16,1xPCIex8,2xPCIex4,and1xPCIex1 ƒIntel®X550dual10GbEports ƒEightSATA3andoneM.2connector

2UHCIServerwith3rdGen.Intel®Xeon®ScalableProcessors

Features ƒBalancedCPU&GPUperformancebyspreadcorelayout ƒWidetemperaturesupportupto40°C ƒUpto5xlowprofilePCI-EGen4slots ƒ12x3.5HDD,2x2.5SATAHDDand2xM.2NVME ƒUpto16xDDR43200RDIMM/LRDIMM ƒAdvantechplatfrommanagementbyRedfishandsecuredwebi

NXPARMCortex-A72i.MX8QuadMaxQseven2.1Module

Features ƒNXPARMCortex-A72+A53i.MX8QuadMax1.6GHzhighperformance processor ƒOnboardLPDDR4memory4GB ƒOnboardeMMCNANDFlash16GB ƒSupportsOpenGL3.0,2.1;OpenGLES3.2;OpenGLES3.1(withAEP);Open GLES3.0,2.0,and1.1;OpenCL2.0and1.1;OpenVG1.1;andVulkanc ƒ

2UHighPerformanceRackmountServerwith3rdGen.Intel®Xeon®Scalableprocessors

Features ƒUpto12bays3.5SAS/SATAor24bays2.5hot-swapSAS/SATAdrives support ƒ32xDDR4ECC-Registered2666/2933/3200MhzRDIMM/LRDIMM ƒUpto4FHFL,2FHHLand2LowProfilePCIeGen4 ƒ2M.22280SATASSDsupport,Rear22.5SATA/SAS/NVMedrivesupport ƒ1OCP3.0PCIeGen4x16N

2UHCIServerwith3rdGen.Intel®Xeon®ScalableProcessors

Features ƒBalancedCPU&GPUperformancebyspreadcorelayout ƒWidetemperaturesupportupto40°C ƒUpto5xlowprofilePCI-EGen4slots ƒ12x3.5HDD,2x2.5SATAHDDand2xM.2NVME ƒUpto16xDDR43200RDIMM/LRDIMM ƒAdvantechplatfrommanagementbyRedfishandsecuredwebi

2UEdgeSeverwith3rdGen.Intel®Xeon®ScalableProcessors

Features ƒBalancedCPU&GPUperformancebyspreadcorelayout ƒWidetemperaturesupportupto45C ƒUpto5xlowprofileor2xDWFH/FLPCIegen4slots ƒ6x2.5HDDand2xM.2NVME ƒUpto16xDDR43200RDIMM/LRDIMM ƒAdvantechplatfrommanagementbyRedfishandsecuredwebinterfa

2UHighPerformanceRackmountServerwith3rdGen.Intel®Xeon®Scalableprocessors

Features ƒUpto12bays3.5SAS/SATAor24bays2.5hot-swapSAS/SATAdrives support ƒ32xDDR4ECC-Registered2666/2933/3200MhzRDIMM/LRDIMM ƒUpto4FHFL,2FHHLand2LowProfilePCIeGen4 ƒ2M.22280SATASSDsupport,Rear22.5SATA/SAS/NVMedrivesupport ƒ1OCP3.0PCIeGen4x16N

NXPARMCortex-A72i.MX8QuadMaxQseven2.1Module

Features ƒNXPARMCortex-A72+A53i.MX8QuadMax1.6GHzhighperformance processor ƒOnboardLPDDR4memory4GB ƒOnboardeMMCNANDFlash16GB ƒSupportsOpenGL3.0,2.1;OpenGLES3.2;OpenGLES3.1(withAEP);Open GLES3.0,2.0,and1.1;OpenCL2.0and1.1;OpenVG1.1;andVulkanc ƒ

MXM3.1TypeANVIDIA®Quadro®EmbeddedT1000withDP1.4a

Features ƒNVIDIA®Quadro®T1000withMXM3.1TYPEAformfactor(82x70mm) ƒUpto896CUDAcores,2.6TFLOPS ƒGDDR64GBmemory,128-bit,bandwidth192GB/s ƒUpto4xDisplayPort1.4aoutputs ƒLonglifecycle,supports5yearsavailability

NXPi.MX8MCortex®-A53SMARC2.0/2.1Computer-on-Module

Features ƒNXPi.MX8MprocessorwithdualorquadArmCortexA53cores ƒ1xArmCortex-M4core ƒOnboard2GBLPDDR4memoryandeMMC16GB ƒ1xHDMI2.0upto4096x2160,1x4-LaneMIPIDSI ƒ2xUSB3.0,4xUSB2.0,4xUART,4xI2C,12xGPIO, 1xPCIe2.0,1x4-laneMIPICSIcamerainpu

NXPi.MX8MCortex®-A53SMARC2.0/2.1Computer-on-Module

Features ƒNXPi.MX8MprocessorwithdualorquadArmCortexA53cores ƒ1xArmCortex-M4core ƒOnboard2GBLPDDR4memoryandeMMC16GB ƒ1xHDMI2.0upto4096x2160,1x4-LaneMIPIDSI ƒ2xUSB3.0,4xUSB2.0,4xUART,4xI2C,12xGPIO, 1xPCIe2.0,1x4-laneMIPICSIcamerainpu

4URackmountIntel®Xeon®ScalableGPUServer,Supporting4xPCIex16Double-DeckCardsPlus3xPCIex8Single-DeckCards

Features ƒProcessor:Dual3rdGen.Intel®Xeon®scalableprocessors ƒMemory:16xDDR43200MHzECCRDIMM/LRDIMM/Intel®Optane™ supportupto2TB ƒRemoteManagement:IPMIfunctionsupport ƒExpansion:Supporting4*PCIex16double-deckcard+2*PCIex8 single-deckFH/HLcard+1*PCIex

NXPi.MX8MMiniCortex®-A53SMARC2.0/2.1Computer-on-Module

Features ƒNXPi.MX8MMiniprocessorwithupto4ArmCortexA53cores ƒ1xArmCortex-M4cores ƒOnboardLPDDR4memoryandeMMC ƒ1x4laneMIPI-CSI,1xDualchannelLVDSor1xDisplayPort ƒ4xUSB2.0,1xUSB2.0OTG,4xUART,4xI2C,12xGPIO,1xPCIe2.0, 1xGigabitLAN ƒSuppo

RockchipRK3399Cortex®-A72A53SMARC2.1Computer-on-Module

Features ƒRockchipRK3399ArmdualCortex-A72andquadCortex-A531.8GHz ƒOnboard2/4GBLPDDR4memoryand16/32GBeMMC ƒSupportHDMI2.04K,1xeDP,1xLVDS ƒSupport4KH.264/H.265Videodecoder ƒ2xUSB3.0,3xUSB2.0,1xUSB2,0OTG,3xUART,12xGPIO ƒ1xPCIe2.0,1xSATA,2xM

RockchipRK3399Cortex®-A72A53SMARC2.1Computer-on-Module

Features ƒRockchipRK3399ArmdualCortex-A72andquadCortex-A531.8GHz ƒOnboard2/4GBLPDDR4memoryand16/32GBeMMC ƒSupportHDMI2.04K,1xeDP,1xLVDS ƒSupport4KH.264/H.265Videodecoder ƒ2xUSB3.0,3xUSB2.0,1xUSB2,0OTG,3xUART,12xGPIO ƒ1xPCIe2.0,1xSATA,2xM

RockchipRK3399Cortex®-A72A53SMARC2.1Computer-on-Module

Features ƒRockchipRK3399ArmdualCortex-A72andquadCortex-A531.8GHz ƒOnboard2/4GBLPDDR4memoryand16/32GBeMMC ƒSupportHDMI2.04K,1xeDP,1xLVDS ƒSupport4KH.264/H.265Videodecoder ƒ2xUSB3.0,3xUSB2.0,1xUSB2,0OTG,3xUART,12xGPIO ƒ1xPCIe2.0,1xSATA,2xM

11thGen.Intel®Core™ProcessorU-Series(CodeName:TigerLake-UP3)COMExpress®CompactType6

Features ƒ11thGen.Intel®Core™ProcessorU-Series ƒCOMExpressR3.0CompactModuleType6Pinout ƒDualchannelwithonememorydownandoneSO-DIMM ƒHighspeedI/O:1PCIex4Gen4,5PCIex1Gen3,4USB3.2Gen2 ƒOnboardNVMex4SSDupto64GB,TPM2.0(Optional) ƒSupportsSUSI,Device

11thGen.Intel®Core™i7/i5/i3/CeleronU-Series3.5SBCw/MIOe

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W/28W ƒDualChannelDDR4-3200upto64GB ƒ4simultaneousdisplays:LVDS/HDMI/DP/USBType-C,eDP(optional) ƒ2GbE,4USB3.2,CANBus,DC-in12-24V ƒExpansion:M.2E-Key/B-Key/M-Key(supportsNVMe),MIOe ƒSupportsi

LGA4094AMD®EPYC™7003ATXservermotherboard

characteristic LGA4094(SocketSP3)ATXserverboardwithAMD EPYC™7003Processor DDR43200MHzRDIMMupto256GBperDIMM 5xPCIe4.0x16,2xPCIe4.0x8 Intel®X550dual10GbEport 8(viaSFF-8643ports)+1SATA3and2M.2ports (SATA/PCIe4.0compatible) 0~60°Coperatingtemperat

11thGen.Intel®Core™i7/i5/i3/CeleronU-Series3.5SBCw/MIOe

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W/28W ƒDualChannelDDR4-3200upto64GB ƒ4simultaneousdisplays:LVDS/HDMI/DP/USBType-C,eDP(optional) ƒ2GbE,4USB3.2,CANBus,DC-in12-24V ƒExpansion:M.2E-Key/B-Key/M-Key(supportsNVMe),MIOe ƒSupportsi

11thGen.Intel®Core™ProcessorU-Series(CodeName:TigerLake-UP3)COMExpress®CompactType6

Features ƒ11thGen.Intel®Core™ProcessorU-Series ƒCOMExpressR3.0CompactModuleType6Pinout ƒDualchannelwithonememorydownandoneSO-DIMM ƒHighspeedI/O:1PCIex4Gen4,5PCIex1Gen3,4USB3.2Gen2 ƒOnboardNVMex4SSDupto64GB,TPM2.0(Optional) ƒSupportsSUSI,Device

AMDEmbeddedRyzenV2000COMExpress®CompactType6

Features ƒAMDEmbeddedRyzen7nmSoC–V2000APU ƒCOMExpress®R3.0CompactModuleType6Pinout ƒDualChannelDDR4SODIMM,max.64GB(BothECC&Non-ECC) ƒHighSpeedI/Os:2USB3.2Gen2,1PCIex8Gen3,8PCIex1Gen3,and 2SATA3.0 ƒFourDisplay(DP++,HDMI,VGA,LVDS) ƒSupportsiM

NXPArm®Cortex®-A72LS1046ACOMExpressType7Compact

Features ƒNXPLS1046A,4xCortexA721.6GHz ƒOnboardMicroSDslotandeMMC16GB ƒ1SO-DIMMsupportsECCandNon-ECCDDR4 ƒ10GBase-KRx2,GbEupto4,PCIe1xx3,USB3.2Gen1x3,USB2.0.x3,SATA V3.0x1 ƒ4wiresUARTx2,SPIx1,GPIOx8,I2C ƒDPAA(DataPathArchitectureAccelerati

11thGen.Intel®Core™ProcessorU-Series(CodeName:TigerLake-UP3)COMExpress®CompactType6

Features ƒ11thGen.Intel®Core™ProcessorU-Series ƒCOMExpressR3.0CompactModuleType6Pinout ƒDualchannelwithonememorydownandoneSO-DIMM ƒHighspeedI/O:1PCIex4Gen4,5PCIex1Gen3,4USB3.2Gen2 ƒOnboardNVMex4SSDupto64GB,TPM2.0(Optional) ƒSupportsSUSI,Device

11thGen.Intel®Core™i7/i5/i3/CeleronU-Series3.5SBCw/MIOe

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W/28W ƒDualChannelDDR4-3200upto64GB ƒ4simultaneousdisplays:LVDS/HDMI/DP/USBType-C,eDP(optional) ƒ2GbE,4USB3.2,CANBus,DC-in12-24V ƒExpansion:M.2E-Key/B-Key/M-Key(supportsNVMe),MIOe ƒSupportsi

11thGen.Intel®Core™ProcessorU-Series(CodeName:TigerLake-UP3)COMExpress®MiniType10

Features ƒUpto4CoresIntelCoreProcessor,IntelIrisXeGraphics96EUs ƒMax.16GBLPDDR4onboard,IBECCsupport.32/64GBNVMeSSD ƒSuperSpeedI/OExpansion:USB3.2Gen2(10Gbps),PCIeGen3,SATAIII ƒExtendedTemp.-40~85°C ƒSupportsiManager,Edge-AISuite,DeviceOn

11thGen.Intel®Core™ProcessorU-Series(CodeName:TigerLake-UP3)COMExpress®MiniType10

Features ƒUpto4CoresIntelCoreProcessor,IntelIrisXeGraphics96EUs ƒMax.16GBLPDDR4onboard,IBECCsupport.32/64GBNVMeSSD ƒSuperSpeedI/OExpansion:USB3.2Gen2(10Gbps),PCIeGen3,SATAIII ƒExtendedTemp.-40~85°C ƒSupportsiManager,Edge-AISuite,DeviceOn

DualLGA4189Intel®Xeon®ScalableProprietaryServerBoardwith16DDR4,4PCIex16,3PCIex8,1PCIex4,5SATA3,4USB3.0,IPMI

Features ƒProprietaryserverboardwithdualXeon®Scalableprocessors ƒDDR43200MHzRDIMMupto1TB,supportIntelOptanePersistentMemory ƒ1SFF-8643connectorsupport4portsSATAdrive,1M.22280onboard ƒ1SlimSASconnectorsupport2portsNVMedriveinoption ƒFourPCIex16slot

LGA4189Intel®3rdGenXeon®ScalableATXServerBoardwith8xDDR4,3xPCIex16,8xSATA3,6xUSB3.2(Gen1),Dual10GbE,andIPMI

Features ƒLGA4189ATXserverboardwith3rdGen.Xeon®Scalableprocessor ƒDDR43200MHzRDIMMupto512GB(8DIMMs)supportsIntel®Optane™ PersistentMemory ƒFeatures3xPCIex16,1xPCIex8,2xPCIex4,and1xPCIex1 ƒIntel®X550dual10GbEports ƒEightSATA3andoneM.2connector

LGA4189Intel®Xeon®ScalableProprietaryServerBoardwith16xDDR4,4xPCIex16,10xSATA3,8xUSB3.2(Gen1),Dual10GbE,andIPMI

Features ƒLGA4189proprietaryserverboardwith3rdGenIntel®Xeon®scalable processor ƒDDR43200MHzRDIMMupto2TBsupportsIntel®Optane™Persistent Memory ƒ4xPCIex16and7xPCIex8 ƒIntel®X550dual10GbEports ƒTenSATA3andtwoM.2connectors(SATA/PCIecompatible) ƒ0~4

2U20”short-depthEdgeAcceleratorServerwithDualIntel®3rdGenXeon®Scalableprocessors,supporting8expansionslots

Features ƒDualIntel®3rdGenXeon®Scalableprocessors ƒDDR43200MHzRDIMMupto1TB,supportIntelOptanePersistentMemory ƒFourPCIex16slotssupportFH/10.5LCards* ƒFourPCIeX8slotssupportHH/HLCards ƒFour2.5hot-swappableSASII/SATAIIIdrivebays(TwocanbeNVMein option)

MXM3.1TypeANVIDIA®Quadro®EmbeddedT1000withDP1.4a

Features ƒNVIDIA®Quadro®T1000withMXM3.1TYPEAformfactor(82x70mm) ƒUpto896CUDAcores,2.6TFLOPS ƒGDDR64GBmemory,128-bit,bandwidth192GB/s ƒUpto4xDisplayPort1.4aoutputs ƒLonglifecycle,supports5yearsavailability

Water-resistantFanlessIn-vehicleAIComputerwithIntel®8th/9thGenCore™iCPU

Features ƒIntel®8th/9thGenCore™isocket-typeCPU(LGA1151)withH310PCH ƒ8GBmemoryonboardand1xDDR4SO-DIMMsocket ƒSupportMXMtypeGPUmodule ƒSupports2xGigabitEthernet,2xUSB3.0/3.1 ƒSupports2xCOM(RS232/422/485) ƒSupports1xmSATA,2x2.5HDD/SSD ƒSupports3

11thGen.Intel®Core™i7/i5/i3/CeleronU-seriesPico-ITXSBC

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W ƒOn-boardLPDDR4x-4267upto32GwithIBECCforIndustrialSku ƒDualindependentdisplay:eDP/MIPI-DSI,DPupto8K ƒ2GbE,2USB3.2,COMPort,SMBus/I2C ƒExpansion:M.2E-Key,M.2B-Key/M-KeyNVMex2 ƒSupportsi

11thGen.Intel®Core™i7/i5/i3/CeleronU-seriesPico-ITXSBC

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W ƒOn-boardLPDDR4x-4267upto32GwithIBECCforIndustrialSku ƒDualindependentdisplay:eDP/MIPI-DSI,DPupto8K ƒ2GbE,2USB3.2,COMPort,SMBus/I2C ƒExpansion:M.2E-Key,M.2B-Key/M-KeyNVMex2 ƒSupportsi

IntelAtomx6000,PentiumandCeleron®x6000SeriesProcessor(CodeName:ElkhartLake)SMARCModule

Features ƒIntelAtom®x6000,Pentium®andCeleron®x6000Seriesprocessor ƒSMARC2.1.1pinout,smallsize ƒDual-CHLPDDR43200MT/supto16GB,supportIBECC ƒTripledisplaysupto4K2K(DP++,HDMI,LVDS/eDP/MIPI-DSI) ƒMultipleI/Oexpansion:PCIegen3,USB3.2Gen2,USB2.0,SATA ƒOnboar

IntelAtomx6000,PentiumandCeleron®x6000SeriesProcessor(CodeName:ElkhartLake)SMARCModule

Features ƒIntelAtom®x6000,Pentium®andCeleron®x6000Seriesprocessor ƒSMARC2.1.1pinout,smallsize ƒDual-CHLPDDR43200MT/supto16GB,supportIBECC ƒTripledisplaysupto4K2K(DP++,HDMI,LVDS/eDP/MIPI-DSI) ƒMultipleI/Oexpansion:PCIegen3,USB3.2Gen2,USB2.0,SATA ƒOnboar

AMDEmbeddedRyzenV2000COMExpress®CompactType6

Features ƒAMDEmbeddedRyzen7nmSoC–V2000APU ƒCOMExpress®R3.0CompactModuleType6Pinout ƒDualChannelDDR4SODIMM,max.64GB(BothECC&Non-ECC) ƒHighSpeedI/Os:2USB3.2Gen2,1PCIex8Gen3,8PCIex1Gen3,and 2SATA3.0 ƒFourDisplay(DP++,HDMI,VGA,LVDS) ƒSupportsiM

AMDEmbeddedRyzenV2000COMExpress®CompactType6

Features ƒAMDEmbeddedRyzen7nmSoC–V2000APU ƒCOMExpress®R3.0CompactModuleType6Pinout ƒDualChannelDDR4SODIMM,max.64GB(BothECC&Non-ECC) ƒHighSpeedI/Os:2USB3.2Gen2,1PCIex8Gen3,8PCIex1Gen3,and 2SATA3.0 ƒFourDisplay(DP++,HDMI,VGA,LVDS) ƒSupportsiM

Intel®11thGenCoreProcessors(CodeName:TigerLake-H)(CodeName:TigerLake-H)

Features ƒIntel®11thGenCoreProcessors,upto8Core/16T,L3Cache24M ƒIntelIrisXe(Gen12)graphics,4independent4Kdisplay ƒDualchannelDDR4Max128GBSODIMM,supportECC ƒSuperspeedI/O:PCIe4x16(16GT/s),USB3.2gen3(10Gb),2.5GbE, SATA3(6Gb) ƒTPM2.0securityprotection,

Intel®Xeon®DProcessor(CodeName:IceLake-DLCC)COMExpress®BasicType7

Features ƒIntel®Xeon®DProcessor ƒCOMExpressR3.0BasicModuleType7pinout ƒ4~10coreprocessor,withmax.TDP67W ƒHighspeedEthernet(4x10GBASE-KRinterfaces,oneGbE) ƒVariousexpansion(PCIex16Gen4,PCIeX8,4PCIeX1,4USB3.0,2SATA3) ƒSupportsSUSI,DeviceOnandEdge

8-INPUT MULTIPLEXER

LOW POWER SCHOTTKY

DATA SELECTORS/MULTIPLEXERS

1-of-8 Line Data Selector/Multiplexer

1-of-8 Data Selectors/Multiplexers(with strobe)

Data Selector/Multiplexer

1-of-8 Line Data Selector/Multiplexer

Ouadruple 2-input Positive NAND Gates

1-of-8 Data Selectors/Multiplexers(with strobe)

1-of-8 Data Selector / Multiplexer (with strobe)

1-of-8 Data Selector / Multiplexer (with strobe)

DATA SELECTORS/MULTIPLEXERS

LOW POWER SCHOTTKY

DATA SELECTORS/MULTIPLEXERS

DATA SELECTORS/MULTIPLEXERS

DATA SELECTORS/MULTIPLEXERS

LOW POWER SCHOTTKY

DATA SELECTORS/MULTIPLEXERS

DATA SELECTORS/MULTIPLEXERS

8-INPUT MULTIPLEXER