贴片电容(MLCC)

贴片电容

贴片电容

封装/外壳：0603（1608 公制） 包装：剪切带（CT）带盒（TB） 描述：CAP CER 0.1UF 16V X7R 0603 电容器 陶瓷电容器

封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：CAP CER 10000PF 50V X7R 0603 电容器 陶瓷电容器

SURFACE MOUNT DEVICE LED

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Monolithic Chip Inductors

SMD Magnetics Packaging Methods

P-Channel 60-V (D-S) MOSFET

FEATURES • Isolated Package • High Voltage Isolation = 2.5 kVRMS (t = 60 s; f = 60 Hz) • Sink to Lead Creepage Distance = 4.8 mm • P-Channel • 175 °C Operating Temperature • Dynamic dV/dt Rating • Low Thermal Resistance • Lead (Pb)-free Available

SMD POWER INDUCTORS

FEATURES: * SUPERIOR QUALITY FOR AN AUTOMATED PRODUCTION LINE. * PICK AND PLACE COMPATIBLE. * TAPE AND REEL PACKING. APPLICATION: * NOTEBOOK COMPUTERS. * DC-DC COMPUTERS. * DC-DC INVERTERS. * PDA * DIGITAL STILL CAMERAS. * PC CAMERAS

Thin Film, Rectangular, Resistor Chips

TNPW High Stability Thin Film Chip Resistors are the perfect choice for most fields of modern electronics where lead (Pb)-bearing terminations are mandatory and reliability and stability are of major concern. FEATURES • Metal film layer on high quality ceramic • SnPb termination plating, Pb con

FemtoFarad Polymer ESD Suppressor

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