Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

SMD POWER INDUCTORS

文件：401.98 Kbytes Page：5 Pages