HEXFETPowerMOSFEToutput

HEXFET®POWERMOSFETPHOTOVOLTAICRELAY GeneralDescription ThePVT322ASeriesPhotovoltaicRelayisadualpole,normallyopensolid-staterelaythatcanreplaceelectromechanicalrelaysinmanyapplications.ItutilizesInternationalRectifier’sHEXFETpowerMOSFETastheoutputswitch,

Bounce-freeoperation

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封装/外壳：8-DIP（0.300"，7.62mm） 包装：散装散装 描述：SSR RELAY SPST-NO 170MA 0-250V 继电器 固态继电器

封装/外壳：8-DIP（0.300"，7.62mm） 包装：管件 描述：SSR RELAY SPST-NO 170MA 0-250V 继电器 固态继电器

Bounce-freeoperation

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CardEdgeConnectors0.156”(3.96mm)Pitch

Features: •0.156”(3.96mm)contactspacingx0.200”(5.08mm)rowspacing •Accepts0.062”(1.57mm)nominalthicknessP.C.board •Lowprofileinsulatorbody,0.473”(12.01mm)withcardguides •ContactterminationoptionsincludeP.C.tail,wirehole,wirewrap,90degreeandextenderboardb

Plug-interminalstripSocketwithclampingspring,withsolderpin

Theplug-interminalstrip322-FBGwithapitchof10mmisequippedwithasolder pinanddesignedfortheuseonPCBs.Duetolargepitchandmouldingshape,this versionisalsowellsuitedforapplicationsusinghighervoltages. Usedincombinationwithaplug-interminalstrip322-SVW,the

SocketterminalstripScrewconnection,withsolderpin

Thesocketterminalstrip322-Gisavailablein10mmpitchwith1-to12-pole designandcanbeeasilystrippedtothedesirednumberofpoles. Theflexiblepolyamidemouldingcanevenbemountedoncurvedsurfaces. Duetolargepitchandmouldingshape,thisversionisalsowellsuitedfor a

Screw/solderterminalstripScrew/soldertagconnection

Thescrew/solderterminalstrip322-LFSin10mmpitchwasdesignedforlarger cross-sectionsthanversion302-LF-DS.Itisavailablewith1to12poles. Mouldingsofthistypeareopenonthesoldertagsidebuttheycanbeconnected safe-to-touchas2-and3-poleversionwithcovercapsA-323

322/332SeriesLead-free3AB,VeryFast-actingFuse

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