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NIN-H价格
参考价格：￥0.4655
型号：NIN-HC470GTRF 品牌：NIC Components 备注：这里有NIN-H多少钱，2024年最近7天走势，今日出价，今日竞价，NIN-H批发/采购报价，NIN-H行情走势销售排行榜，NIN-H报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
NIN-H | Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 |  |   |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | | |
Wirewound Chip Inductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NICNIC Components Corporation NIC元件股份有限公司 | | |
NIN-H产品属性
- 类型
描述
- 型号
NIN-H
- 制造商
NIC
- 制造商全称
NIC-Components Corp.
- 功能描述
Wirewound Chip Inductors
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
NICCOMPONENTSCORP |
21+ |
NA |
9000 |
只做原装,一定有货,不止网上数量,量多可订货! |
|||
NICCOMPONENTSCORP |
23+ |
NA |
48000 |
原装现货,专业配单专家 |
|||
NIC |
0616ROHS |
SMD |
1980 |
||||
NICC |
23+ |
SMD |
20000 |
原厂原装正品现货 |
|||
NICC |
22+ |
SMD |
9800 |
只做原装正品假一赔十!正规渠道订货! |
|||
NICC |
2023+ |
SMD |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
|||
NICC |
22+ |
SMD |
38000 |
原装现货样品可售 |
|||
NICCOMPONENTSCORP |
22+ |
NA |
12680 |
||||
NIC COMPONENTS |
1429 |
2020 |
公司优势库存 热卖中! |
||||
NIC |
24+25+/26+27+ |
车规-无源器件 |
143788 |
一一有问必回一特殊渠道一有长期订货一备货HK仓库 |
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2012-11-12
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