位置：首页 > IC中文资料第10721页 > K4B1G0846D-HCH9
| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
K4B1G0846D-HCH9 | 1GbD-dieDDR3SDRAMSpecification The1GbDDR3SDRAMD-dieisorganizedasa32Mbitx4I/Osx8banks,16Mbitx8I/Osx8banksor8Mbitx16I/Osx8banksdevice.Thissynchronousdeviceachieveshighspeeddouble-data-ratetransferratesofupto1600Mb/sec/pin(DDR3-1600)forgeneralapplications. | SamsungSamsung Group 三星三星半导体 |  |   |
K4B1G0846D-HCH9产品属性
- 类型
描述
- 型号
K4B1G0846D-HCH9
- 制造商
SAMSUNG
- 制造商全称
Samsung semiconductor
- 功能描述
1Gb D-die DDR3 SDRAM Specification
更新时间：2024-4-26 14:51:00
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
SAMSUNG/三星 |
22+ |
BGA |
12245 |
现货,原厂原装假一罚十! |
|||
SAMSUNG/三星 |
09+ |
BGA |
120 |
只做正品,原装现货实单来谈 |
|||
SAMSUNG/三星 |
21+ |
BGA |
10000 |
全新原装 公司现货 价优 |
|||
SAMSUNG |
2017+ |
BGA |
24589 |
深圳代理原装现货进口库存(香港-日本-台湾)开17点增票 |
|||
CONSONANCE/如韵电子 |
13000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||||
SAMSUNG |
22+ |
BGA |
360000 |
进口原装房间现货实库实数 |
|||
SAMSANG |
19+ |
BGA |
256800 |
原厂代理渠道,每一颗芯片都可追溯原厂； |
|||
SAMSUNG |
BGA. |
5660 |
国内领先的集成电路专业配单!量大可发货!可开17%增值 |
||||
SAMSUNG |
21+ |
FBGA |
35200 |
一级代理/放心采购 |
|||
SAMSUNG/三星 |
22+ |
FBGA-82 |
8000 |
原装正品支持实单 |
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K4B1G0846D-HCH9规格书下载地址
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K4B1G0846D-HCH9数据表相关新闻
K4A8G165WB-BCRC
K4A8G165WB-BCRC
2020-4-17K4A4G165WE-BCRC
K4A4G165WE-BCRC
2020-4-16K4A4G165WE-BCTD
K4A4G165WE-BCTD
2020-4-16K4B1G0846I-BYNB
K4B1G0846I-BYNB
2019-11-22K4B1G0846S-HQH9
K4B1G0846S-HQH9
2019-11-22K4B1G0846I-BYK0000
K4B1G0846I-BYK0000
2019-11-22
DdatasheetPDF页码索引
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