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FEATURES PROPRIETARYSOFTGLASSJUNCTIONPASSIVATIONFORSUPERIORRELIABILITYANDPERFORMANCE VOIDFREEVACUUMDIESOLDERINGFORMAXIMUMMECHANICALSTRENGTHANDHEATDISSIPATION (SolderVoids:Typical

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TheGP2010isMitelSemiconductorsecondgenerationRFFront-endforGlobalPositioningSystem(GPS)receivers.TheGP2010usesmanyinnovativedesigntechniquesandaleading-edgebipolarprocesstoofferalowpower,lowcostandhighreliabilityRFFrontEndsolution.TheGP2010isdesignedto

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Features Topview0805package ViewingAngle=70 Compatiblewithinfraredandvaporphasereflow solderprocess Highreliability UltrabrightGreen RoHScompliance Applications Opticalindicator. SwitchandSymbolDisplay. Description TheGP201208ATC3isanAlGaInP

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Features Topview0805package ViewingAngle=70 Compatiblewithinfraredandvaporphasereflow solderprocess Highreliability UltrabrightGreen RoHScompliance Applications Opticalindicator. SwitchandSymbolDisplay. Description TheGP201208-CTC3isanAlGaIn

GPSReceiverRFFrontEnd

TheGP2015isasmallformatRFFront-endforGlobalPositioningSystem(GPS)receivers.EquivalentinperformancetotheGP2010butinaTQFPpackage,thisproductissuitedforsize-criticalapplicationsastheRFareacanbereducedbyafactoroftwotothreeusingminiaturesurfacemountpass

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ThePowerlinerangeofhighpowermodulesincludeshalfbridge,dualandsingleswitchconfigurationscoveringvoltagesfrom600Vto3300Vandcurrentsupto4800A. FEATURES ■LowVCE(SAT) ■NonPunchThroughSilicon ■IsolatedCopperBaseplate ■LowInductanceInternalConstructi

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Processcontrolsystems,instrumentation,railvehicles

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