| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
NPNSILICONRFPOWERTRANSISTOR DESCRIPTION: TheASIHF150-50Sisa50VepitaxialtransistordesignedforSSBcommunications.Thedeviceutilizesemitterballastiongforruggedness. FEATURES: •PG=14dBmin.at150W/30MHz •IMD3=100dBcmax.at150W(PEP) •Omnigold™MetalizationSystem •CommonEmitterconfiguratio | ASI Advanced Semiconductor, Inc |  |   | |
THISSPECIFICATIONSHEETFORMSAPARTOFTHELATESTISSUEOFRAYCHEMSPECIFICATION1200. 文件：47.99 Kbytes Page：1 Pages | TECTE Connectivity Ltd 泰科电子泰科电子有限公司 |  | | |
~9.6째spotbeamoptimizedforCREEMC-E.14.04mmhighassemblywithinstallationtape. 文件：3.60595 Mbytes Page：4 Pages | LEDILLEDiL 芬兰 |  | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ASI |
23+ |
原厂原包 |
19960 |
只做进口原装 终端工厂免费送样 |
COM-10613芯片相关品牌
COM-10613规格书下载地址
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COM-10613数据表相关新闻
COM-09806 10 kOhms 0.5W，1/2W PC 引脚 通孔 微调电位计 金属陶瓷 1.0 匝 顶部调节
COM-09806
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CNY65VISHAY20+标准封装 CS4333-KSCRYSTALSEMICONDUCTOR20+标准封装 CS8904-CM5CRYSTALSEMICONDUCTOR20+标准封装 C19B235546P7375OTHER20+标准封装 C8051F206-GQSILICONLABS20+标准封装 CH7006C-TCHRONTEL20+标准封装 CL1820CELENOCOMMUNICATIONS20+标准封装 CLC5526MSANATIONALSEMICONDUCTOR
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特点•隔离密封包装，JEDECTO-257AA封装•参考电压设定为±2％•内置热过载保护•短路电流限制说明这三个终端中提供积极的监管机构密封的隔离，金属TO-257封装。所有保护功能被设计成包括热关断电路，电流限制和安全区控制。随着散热，他们可以提供超过3.0安培的输出电流。这些单位功能2％的初始电压容差，0.35％和0.01％的负载调节行规。...
2013-1-31
DdatasheetPDF页码索引
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