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位置：首页 > IC中文资料第1023页 > C2012

C2012价格

参考价格：￥0.3498

型号：C2012C0G1E103J060AA 品牌：TDK 备注：这里有C2012多少钱，2024年最近7天走势，今日出价，今日竞价，C2012批发/采购报价，C2012行情走势销售排行榜，C2012报价。
型号 功能描述 生产厂家&企业 LOGO 操作
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORSCommercialgrade,general(Upto75V)

■SERIESOVERVIEW GeneraltypeCseriesisasurface-mountedcomponent,whichmultilayerdielectricsandinnerelectrodesarestackedalternately.Themonolithic structureensuressuperiormechanicalstrengthandhighreliability.Also,outstandingfrequencycharacteristicssuchaslowESRandlo

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

HEYCo-molded™LiquidTightBreak-ThruPlugs

文件：100.58 Kbytes Page：1 Pages

Heyco

Heyco

Heyco
C2012

包装：盒 描述：LTBP 625-063 BLACK 电缆，电线 - 管理 衬套，索环

Heyco Products Corporation

Heyco Products Corporation

Heyco Products Corporation
C2012

FeetsofStrength

文件：116.51 Kbytes Page：1 Pages

Heyco

Heyco

Heyco
C2012

MULTILAYERCERAMICCHIPCAPACITORS

文件：2.57112 Mbytes Page：55 Pages

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

文件：2.57364 Mbytes Page：55 Pages

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

HEYCo-moldedLiquidTightBreak-ThruPlugs

文件：357.4 Kbytes Page：1 Pages

etc2List of Unclassifed Manufacturers

etc2未分类制造商

etc2
C2012

MultilayerCeramicChipCapacitors

文件：173.01 Kbytes Page：31 Pages

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

文件：2.57186 Mbytes Page：55 Pages

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

CAPACITORS

文件：448.8 Kbytes Page：7 Pages

etc2List of Unclassifed Manufacturers

etc2未分类制造商

etc2
C2012C0G1A010B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1A0R5B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1A100B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1E103J060AA

MultilayerCeramicChipCapacitors

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1E153J085AA

MultilayerCeramicChipCapacitors

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1E223J125AA

MultilayerCeramicChipCapacitors

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1E333J125AA

MultilayerCeramicChipCapacitors

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H010B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H0R5B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H100B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H101K

ADS78/8505EVMUsersGuide

Features ·Full-FeaturedEvaluationBoardfortheADS7804,ADS7805orADS8505,parallelAnalogtoDigital Converters ·IndustryStandard±10VAnalogInputRange ·Builtinreference ·ParallelInterfacewith3-stateoutputdrivers ·Compatiblewiththe5-6KInterfaceBoardforusewithava

TITexas Instruments

德州仪器美国德州仪器公司

TI
C2012C0G1H102J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H102K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H103J

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H103J060AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H103K060AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H122J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H122K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H152J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H152K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H153J085AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H153K085AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H182J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H182K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H222J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H222J085AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H222K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H223J125AA

TDKintroducesanewglobalcatalogpartnumberforitsMultilayerCeramicCapacitorproducts

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H223J125AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H223K125AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H272J

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H272J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H272K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H332J

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H332J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H332J125AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H332K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK

C2012产品属性

  • 类型

    描述

  • 型号

    C2012

  • 功能描述

    电缆固定件和配件 LTBP 625-063 1.03 X .32

  • RoHS

    否

  • 制造商

    Heyco

  • 类型

    Cable Grips, Liquid Tight

  • 材料

    Nylon

  • 颜色

    Black

  • 安装方法

    Cable

  • 最大光束直径

    11.4 mm

C2012供应商更多...

更新时间：2024-5-16 23:38:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
中天科工半导体（深圳）有限公司
C2012X7S2A154K085AB
TDK
20+
SMD
362200
TDK原装优势主营型号-可开原型号增税票
询价
深圳市纳立科技有限公司
C2012X7R1A106K125AC
TDK
三年内
1983
纳立只做原装正品13590203865
询价
深圳市晴轩时代电子有限公司
C2012X5R1V106KT000E
TDK
21+
0805
8800
公司只做原装正品
询价
深圳市纳艾斯科技有限公司
C2012X7R1E474KT
TDK/东电化
2020+
NA
80000
只做自己库存,全新原装进口正品假一赔百,可开13%增
询价
深圳市科芯源微电子有限公司
C2012X7R1C474KT00HN
TDK/东电化
24+
SMD
58000
全新原厂原装正品现货,可提供技术支持、样品免费!
询价
深圳廊盛科技有限公司
C2012X5R0J226MT000N
TDK/东电化
23+
SMD
20000
原装正品 欢迎咨询
询价
深圳市华睿芯科技有限公司
C2012X5R1A475KT000N
TDK
23+
SMD
20000
原厂原装正品现货
询价
深圳市科恒伟业电子有限公司
C2012X5R1E475KTJ00E
TDK/东电化
1950+
SMD
4856
只做原装正品现货!或订货假一赔十!
询价
鑫勃源（上海北京 青岛）有限公司
C2012Y5V0J226ZT00HN
TDK
23+
标准封装
18000
询价
深圳市华瑞顺电子科技有限公司
C2012X5R1H475KT000N
TDK/东电化
22+
0805
12680
询价

C2012芯片相关品牌

  • ALLIED
  • DIODES
  • EATON
  • etc2
  • HARTING
  • Littelfuse
  • MERITEK
  • MOLEX1
  • NSC
  • RALTRON
  • SUMIDA
  • TEC

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