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C1608C0G1H060C价格
参考价格：￥0.0343
型号：C1608C0G1H060C080AA 品牌：TDK 备注：这里有C1608C0G1H060C多少钱，2024年最近7天走势，今日出价，今日竞价，C1608C0G1H060C批发/采购报价，C1608C0G1H060C行情走势销售排行榜，C1608C0G1H060C报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
C1608C0G1H060C | MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 |  |   |
C1608C0G1H060C | MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | |
C1608C0G1H060C | MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | |
C1608C0G1H060C | MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | |
C1608C0G1H060C | MultilayerCeramicChipCapacitors 文件：173.01 Kbytes Page：31 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.74951 Mbytes Page：55 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57112 Mbytes Page：55 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57112 Mbytes Page：55 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors 文件：130.41 Kbytes Page：1 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors 文件：183.93 Kbytes Page：3 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | |
C1608C0G1H060C产品属性
- 类型
描述
- 型号
C1608C0G1H060C
- 功能描述
多层陶瓷电容器MLCC - SMD/SMT 0603 50volts 6.0pF C0G 0.25pF
- RoHS
否
- 制造商
American Technical Ceramics(ATC)
- 电容
10 pF
- 容差
1 %
- 电压额定值
250 V
- 温度系数/代码
C0G(NP0) 外壳代码 -
- in
0505 外壳代码 -
- mm
1414
- 工作温度范围
- 55 C to + 125 C
- 产品
Low ESR MLCCs
- 封装
Reel
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK/东电化 |
2046+ |
9852 |
只做原装正品现货!或订货假一赔十! |
||||
TDK |
2023+ |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
||||
TDK |
2020+ |
原厂封装 |
35000 |
100%进口原装正品公司现货库存 |
|||
TDK |
2339+ |
N/A |
4652 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
|||
TDK/东电化 |
23+ |
NA/ |
4500 |
原装现货,当天可交货,原型号开票 |
|||
TDK |
08+ |
103280 |
|||||
TDK/东电化 |
SMD |
265209 |
假一罚十原包原标签常备现货! |
||||
TDK-东电化 |
24+25+/26+27+ |
车规-电容器 |
76052 |
一一有问必回一特殊渠道一有长期订货一备货HK仓库 |
|||
TDK(东电化) |
2021/2022+ |
标准封装 |
40000 |
原厂原装现货订货价格优势终端BOM表可配单提供样品 |
|||
TDK(东电化) |
23+ |
N/A |
20000 |
C1608C0G1H060C芯片相关品牌
C1608C0G1H060C规格书下载地址
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C1608C0G1H060C数据表相关新闻
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2020-4-3
DdatasheetPDF页码索引
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