Dual-BandPowerAmplifierModule

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WCDMA/HSPABand1andBand83.0mm횞4.2mmDual-BandPowerAmplifierModule

文件：163.89 Kbytes Page：3 Pages

封装/外壳：14-SMD 模块 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC POWER AMP SMD RF/IF，射频/中频和 RFID 射频放大器

WCDMA/HSPABand1andBand83.0mm횞4.2mmDual-BandPowerAmplifierModule

文件：163.89 Kbytes Page：3 Pages

封装/外壳：14-SMD 模块 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC POWER AMP SMD RF/IF，射频/中频和 RFID 射频放大器

BNC(m)/F(f),BNC(f)/F(f),BNC(f)/F(m),BNC(m)/F(m)

Features •True75ΩBNCadapters. •EasilyadaptF-ConnectorstoBNC. •Gold-plated(15micro–inches)contacts. •BNCinsulationmaterialisPTFE(notdelrin). Materials •Bodyismadeofmachinedbrasswithtarnishresistantnickel-plating. •FemaleBNCcentercontact:Gol

Low-Power,1-AccurateBatteryMonitorsinuDFNandSC70Packages

GeneralDescription TheMAX6775–MAX6781low-power,1-accuratebatterymonitorsareavailableintheultra-smallµDFNpackage(1.0mmx1.5mm)andSC70packages.Theselow-powerdevicesareidealformonitoringsinglelithium-ion(Li+)cells,ormulticellalkaline/NiCd/NiMHpowersources.Thesedev

EM-6781isultra-smallHalleffectICsofasinglesiliconchipcomposedofHallelementandasignalprocessingIC

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