型号 功能描述 生产厂家&企业 LOGO 操作
AFE4900YZR

Ultra-LowPower,IntegratedAFEforWearableOptical,ElectricalBio-SensingWithFIFO

文件:685.57 Kbytes Page:10 Pages

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

TI1
AFE4900YZR

封装/外壳:30-XFBGA,DSBGA 包装:卷带(TR) 描述:IC AFE 3 CHAN 24BIT 30DSBGA 集成电路(IC) 模拟前端(AFE)

TITexas Instruments

德州仪器美国德州仪器公司

TI

PanelMountBananaJack

Features BananaJacksmountintopanelsranginginthicknessfrom.063”(1.6mm)to.375”(9.5mm). Model4900featuresPolyphenyleneSulfideforhightemperatureapplications. Model2854featuresgoldplatedbodyforoptimumelectricalconnection. Model1581featuresbrighttinplating.

POMONA

Pomona Electronics

POMONA

DualWindingSurfaceMountInductors

DESCRIPTION The4900seriesisarangeofdualwindinductorsofferingflexibleoptions.Windingshavea1:1ratioandcanbeconnectedinseriesorparalleltocreateawiderangeofinductancecombinations.Thesecondarywindingcouldbeusedasafeedbackwindinginswitchedmodepowersupplie

CANDD

C&D Technologies

CANDD

PanelMountBananaJack

FEATURES: ●BananaJacksmountintopanelsranginginthicknessfrom.063(1.6mm)to.375(9.5mm). ●Model4900featuresPolypenyleneSulfideforhightemperatureapplications. ●Model2854featuresgoldplatedbodyforoptimumelectricalconnection. ●Model1581featuresbrighttinplating

POMONA

Pomona Electronics

POMONA

HighVoltageThreePhaseGateDriver

文件:746.03 Kbytes Page:17 Pages

Allegro

Allegro MicroSystems

Allegro

HighVoltageThreePhaseGateDriver

文件:746.03 Kbytes Page:17 Pages

Allegro

Allegro MicroSystems

Allegro
更新时间:2024-4-27 10:34:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Texas Instruments
21+
30-XFBGA,DSBGA
2500
正规渠道/品质保证/原装正品现货
TI(德州仪器)
2021+
8000
原装现货,欢迎询价
TI
24+
DSBGA-30
3000
TI
22+
DSBGA-30
10000
只做原装,支持实单,来电咨询。
TI(德州仪器)
23+
DSBGA-30
14316
正规渠道,免费送样。支持账期,BOM一站式配齐
TI(德州仪器)
22+
DSBGA-30(2.1x2.6)
1563961
600条原装 百分百保证现货
TI
三年内
1983
纳立只做原装正品13590203865
TI/德州仪器
2048+
DSBGA-30
9852
只做原装正品现货!或订货假一赔十!
TI
DSBGA
68900
原包原标签100%进口原装常备现货!
Texas Instruments
23+
30-XFBGA,DSBGA
25000
ADC/DAC转换主营芯片-原装正品

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