型号 功能描述 生产厂家&企业 LOGO 操作
507-171M09-BFB

EMI/RFIMicro-DBandingBackshellAssemblywithElipticalBandingPorch

文件:420.4 Kbytes Page:2 Pages

GLENAIR

Glenair, Inc.

GLENAIR

EMI/RFIMicro-DBandingBackshellAssemblywithElipticalBandingPorch

文件:420.4 Kbytes Page:2 Pages

GLENAIR

Glenair, Inc.

GLENAIR

EMI/RFIMicro-DBandingBackshellAssemblywithElipticalBandingPorch

文件:420.4 Kbytes Page:2 Pages

GLENAIR

Glenair, Inc.

GLENAIR

EMI/RFIMicro-DBandingBackshellAssemblywithElipticalBandingPorch

文件:420.4 Kbytes Page:2 Pages

GLENAIR

Glenair, Inc.

GLENAIR

EMI/RFIMicro-DBandingBackshellAssemblywithElipticalBandingPorch

文件:420.4 Kbytes Page:2 Pages

GLENAIR

Glenair, Inc.

GLENAIR
更新时间:2024-9-20 16:06:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TE
55
全新原装 货期两周
TE/泰科
23+
NA/原装
82985
代理-优势-原装-正品-现货*期货
TE Connectivity Aerospace, Def
23+
原厂封装
29
只做原装只有原装现货实报
GLENAIR
23+
NA
39960
只做进口原装,终端工厂免费送样

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