型号 功能描述 生产厂家&企业 LOGO 操作
4311S-106-2222DA

ThinFilmMoldedSIP

Features ■Leadfreeversionsavailable(seeHowtoOrder“Termination”option) ■RoHScompliant(leadfreeversion)* ■LowprofileprovidescompatibilitywithDIPs ■Alsoavailableinmediumprofile(4300S-.250”)andhighprofile(4300K-.350”) ■Markingoncontrastingbackground ■Cus

BournsBourns Electronic Solutions

伯恩斯伯恩斯(邦士)

Bourns

ThinFilmMoldedSIP

Features ■Leadfreeversionsavailable(seeHowtoOrder“Termination”option) ■RoHScompliant(leadfreeversion)* ■LowprofileprovidescompatibilitywithDIPs ■Alsoavailableinmediumprofile(4300S-.250”)andhighprofile(4300K-.350”) ■Markingoncontrastingbackground ■Cus

BournsBourns Electronic Solutions

伯恩斯伯恩斯(邦士)

Bourns

ThinFilmMoldedSIP

文件:203.84 Kbytes Page:2 Pages

BournsBourns Electronic Solutions

伯恩斯伯恩斯(邦士)

Bourns

ThinFilmMoldedSIP

Features ■Leadfreeversionsavailable(seeHowtoOrder“Termination”option) ■RoHScompliant(leadfreeversion)* ■LowprofileprovidescompatibilitywithDIPs ■Alsoavailableinmediumprofile(4300S-.250”)andhighprofile(4300K-.350”) ■Markingoncontrastingbackground ■Cus

BournsBourns Electronic Solutions

伯恩斯伯恩斯(邦士)

Bourns

ThinFilmMoldedSIP

Features ■Leadfreeversionsavailable(seeHowtoOrder“Termination”option) ■RoHScompliant(leadfreeversion)* ■LowprofileprovidescompatibilitywithDIPs ■Alsoavailableinmediumprofile(4300S-.250”)andhighprofile(4300K-.350”) ■Markingoncontrastingbackground ■Cus

BournsBourns Electronic Solutions

伯恩斯伯恩斯(邦士)

Bourns

ThinFilmMoldedSIP

Features ■Leadfreeversionsavailable(seeHowtoOrder“Termination”option) ■RoHScompliant(leadfreeversion)* ■LowprofileprovidescompatibilitywithDIPs ■Alsoavailableinmediumprofile(4300S-.250”)andhighprofile(4300K-.350”) ■Markingoncontrastingbackground ■Cus

BournsBourns Electronic Solutions

伯恩斯伯恩斯(邦士)

Bourns

ThinFilmMoldedSIP

Features ■Leadfreeversionsavailable(seeHowtoOrder“Termination”option) ■RoHScompliant(leadfreeversion)* ■LowprofileprovidescompatibilitywithDIPs ■Alsoavailableinmediumprofile(4300S-.250”)andhighprofile(4300K-.350”) ■Markingoncontrastingbackground ■Cus

BournsBourns Electronic Solutions

伯恩斯伯恩斯(邦士)

Bourns

ThinFilmMoldedSIP

文件:203.84 Kbytes Page:2 Pages

BournsBourns Electronic Solutions

伯恩斯伯恩斯(邦士)

Bourns
更新时间:2024-9-20 17:11:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
AGERE
23+
BGA
5000
原厂授权代理,海外优势订货渠道。可提供大量库存,详
BOURNS
23+
NA
19960
只做进口原装,终端工厂免费送样

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