Thin flat package

FEATURES

* Halogen-free type

* Lead free product , compliance to RoHs

* Lead less chip form , no lead damage

* Lead-free solder joint , no wire bond & lead frame

* Low power loss , High efficiency

* High current capability , low VF

* Plastic package has Underwriters Laboratory Flammability

Classification 94V-0

APPLICATION

* Switching mode power supply applications

* Portable equipment battery applications

* High frequency rectification

* DC / DC Converter

* Telecommunication

MECHANICAL DATA

Case : Packed with FRP substrate and epoxy underfilled

Terminals : Pure Tin plated (Lead-Free),

solderable per MIL-STD-750, Method 2026.

Polarity : Laser Cathode band marking

Weight : 0.004 gram