型号 功能描述 生产厂家&企业 LOGO 操作
XPSM82866AA0PRCFR

TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

TPSM82864A/TPSM82866A 2.4-V to 5.5-V Input, 4-A/6-A Step-Down Power Module with an Integrated Inductor in a 3.5-mm 횞 4.0-mm Thin Overmolded QFN Package

文件:3.09655 Mbytes Page:34 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

TPSM82864A/TPSM82866A 2.4-V to 5.5-V Input, 4-A/6-A Step-Down Power Module with an Integrated Inductor in a 3.5-mm 횞 4.0-mm Thin Overmolded QFN Package

文件:3.09655 Mbytes Page:34 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
更新时间:2025-8-5 21:28:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
大量库存XPT
20+
WCSP-9
49000
原装优势主营型号-可开原型号增税票
XPT
25+
SOP-8
54648
百分百原装现货 实单必成
XPT
24+
NA/
4050
原装现货,当天可交货,原型号开票
XPT
24+
WCSP
990000
明嘉莱只做原装正品现货
XPT
11+
BGA
1300
一级代理,专注军工、汽车、医疗、工业、新能源、电力
XPT
1942+
SOP-8
9852
只做原装正品现货或订货!假一赔十!
XPT矽普特
23+
BGA9
15000
全新原装现货,价格优势
XPT
23+
WCSP-9
6000
原装正品假一罚百!可开增票!
XPT25WD类音频功放
24+
WCSP9TDFN8
3500
原装现货,可开13%税票
XPT
24+
MSOP8
900
原装现货假一赔十

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