General purpose devices

The xCORE-200 General Purpose family of devices extends the popular xCORE architecture to provide increased performance, memory footprint and flexibility for the most demanding applications.\r\n\r\n xCORE-200 XL/XLF implements a dual-issue processor pipeline to boost peak compute performance to 2 • Devices ranging from 8 to 16 cores\r\n• Flexible, high performance configurable I/O capability\r\n• Embedded QuadSPI flash options - up to 2048KB on-board\r\n• Free software library support to implement your exact mix of peripherals\r\n• Easy to use with our free xSOFTip Explorer and xTIMEcomposer;

General purpose devices

The xCORE-200 General Purpose family of devices extends the popular xCORE architecture to provide increased performance, memory footprint and flexibility for the most demanding applications.\r\n\r\n xCORE-200 XL/XLF implements a dual-issue processor pipeline to boost peak compute performance to 2 • Devices ranging from 8 to 16 cores\r\n• Flexible, high performance configurable I/O capability\r\n• Embedded QuadSPI flash options - up to 2048KB on-board\r\n• Free software library support to implement your exact mix of peripherals\r\n• Easy to use with our free xSOFTip Explorer and xTIMEcomposer;

General purpose devices

The xCORE-200 General Purpose family of devices extends the popular xCORE architecture to provide increased performance, memory footprint and flexibility for the most demanding applications.\r\n\r\n xCORE-200 XL/XLF implements a dual-issue processor pipeline to boost peak compute performance to 2 • Devices ranging from 8 to 16 cores\r\n• Flexible, high performance configurable I/O capability\r\n• Embedded QuadSPI flash options - up to 2048KB on-board\r\n• Free software library support to implement your exact mix of peripherals\r\n• Easy to use with our free xSOFTip Explorer and xTIMEcomposer;

封装/外壳：236-LFBGA 包装：托盘 描述：IC MCU 32BIT ROMLESS 236FBGA 集成电路（IC） 微控制器

封装/外壳：128-TQFP 裸露焊盘 包装：托盘 描述：IC MCU 32BIT ROMLESS 128TQFP 集成电路（IC） 微控制器